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IRF6217TRPBF

Infineon Technologies

IRF6217TRPBF by Infineon Technologies

P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Minimum Operating Temperature: -55 Cel; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$0.558

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$0.558

100+ parts

$0.508

1k+ parts

$0.458

10k+ parts

-

450

$0.558

$0.508

$0.458

-

Farnell

UK . 1,572 parts In-Stock

1+ parts

$0.571

100+ parts

$0.253

1k+ parts

$0.167

10k+ parts

$0.146

1,572

$0.571

$0.253

$0.167

$0.146

Chip1Stop

Japan . 6,504 parts In-Stock

1+ parts

-

100+ parts

$0.233

1k+ parts

$0.202

10k+ parts

-

6,504

-

$0.233

$0.202

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 427 parts In-Stock

1+ parts

$0.437

100+ parts

-

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427

$0.437

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Digiode

USA . 741 parts In-Stock

1+ parts

$0.530

100+ parts

-

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741

$0.530

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Chip Stock

USA . 23,501 parts In-Stock

1+ parts

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23,501

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Cyclops Electronics Ltd

UK . 16,000 parts In-Stock

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16,000

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Component Sense

UK . 15,405 parts In-Stock

1+ parts

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15,405

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Diverse Electronics

Canada . 4,000 parts In-Stock

1+ parts

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4,000

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Sensible Micro Corp

USA . 2,354 parts In-Stock

1+ parts

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2,354

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Semi Source

USA . 1,478 parts In-Stock

1+ parts

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1,478

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TME

Poland . 465 parts In-Stock

1+ parts

-

100+ parts

$0.220

1k+ parts

$0.198

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465

-

$0.220

$0.198

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A2Z Electronics, Inc.

USA . 432 parts In-Stock

1+ parts

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432

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Inventory MP

USA . 316 parts In-Stock

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316

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ComSIT Distribution GmbH

Germany . 243 parts In-Stock

1+ parts

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243

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Bristol Electronics

USA . 180 parts In-Stock

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180

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Prism Electronics

USA . 148 parts In-Stock

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148

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Distributors (Availability)

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Corphita

USA . 26 parts In-Stock

1+ parts

$0.502

100+ parts

-

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-

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26

$0.502

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.558

100+ parts

$0.508

1k+ parts

$0.458

10k+ parts

-

450

$0.558

$0.508

$0.458

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Modulus Dynamics

Lithuania . 2,349 parts In-Stock

1+ parts

$0.854

100+ parts

$0.820

1k+ parts

$0.786

10k+ parts

-

2,349

$0.854

$0.820

$0.786

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$56.300

100+ parts

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1k+ parts

$39.411

10k+ parts

$39.411

50

$56.300

-

$39.411

$39.411

Kepictronics

USA . 306,000 parts In-Stock

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RC Electronics

USA . 27,000 parts In-Stock

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$0.310

1k+ parts

$0.290

10k+ parts

$0.290

27,000

-

$0.310

$0.290

$0.290

Perfect Parts

USA . 26,880 parts In-Stock

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Futuretech Components

Singapore . 20,000 parts In-Stock

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S.R.D Solutions

India . 16,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,399 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,599 parts In-Stock

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3,599

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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1,920

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Component Stockers USA

USA . 1,161 parts In-Stock

1+ parts

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100+ parts

$0.390

1k+ parts

$0.330

10k+ parts

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1,161

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$0.390

$0.330

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Assy Fe

Spain . 1,073 parts In-Stock

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1,073

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Technical Specifications

Small Signal Field Effect Transistors (FET) IRF6217TRPBF attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

.7 A

Maximum Drain-Source On Resistance:

2.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF6217TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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