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IRF6217PBF

Infineon Technologies

IRF6217PBF by Infineon Technologies

IRF6217PBF by Infineon is a P-CHANNEL FET with 150V DS breakdown voltage and 0.7A max drain current. It's used for switching applications in enhancement mode, featuring a built-in diode and 2.4 ohm max RDS(on). The transistor comes in a small outline package with GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 975 parts In-Stock

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Digiode

USA . 546 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Sea View Technologies

USA . 7 parts In-Stock

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Bristol Electronics

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Modulus Dynamics

Lithuania . 5,505 parts In-Stock

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$0.851

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$0.817

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$0.783

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Ampacity Inc.

Singapore . 511 parts In-Stock

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$17.050

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GreenTree Electronics

Israel . 3,629 parts In-Stock

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Assy Fe

Spain . 3,135 parts In-Stock

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Corphita

USA . 205 parts In-Stock

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Kepictronics

USA . 95 parts In-Stock

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Perfect Parts

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Netroflash

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Overview

Discover the cutting-edge IRF6217PBF by Infineon Technologies, a top-tier P-CHANNEL Field Effect Transistor in the realm of Small Signal FETs. With its superior quality and innovative design, this transistor is perfect for a wide range of switching applications. Its single configuration with built-in diode ensures seamless performance, while the 150V minimum DS breakdown voltage guarantees reliability. Trust in Infineon Technologies to deliver exceptional value and benefits with the IRF6217PBF, offering customers unmatched advantages in their electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low power consumption and high efficiency, making them ideal for use in battery-operated devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved performance and protection against voltage spikes, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can rapidly turn on and off, providing efficient control of electrical signals.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the transistor on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this transistor can handle higher voltages without failure, ensuring reliable operation in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and secure mounting on PCBs, facilitating integration into electronic devices.

Transistor Element Material: SILICON

Silicon-based transistors offer good thermal stability and high performance, making them suitable for a wide range of applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRF6217PBF attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

.7 A

Maximum Drain-Source On Resistance:

2.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF6217PBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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