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IRF4905SPBF

Infineon Technologies

IRF4905SPBF by Infineon Technologies

IRF4905SPBF by Infineon Technologies is a P-CHANNEL Power FET with 55V DS Breakdown Voltage, suitable for SWITCHING applications. It features a max IDM of 280A and EAS of 140mJ, making it ideal for high-power operations. With a compact SMALL OUTLINE package style and low 0.02 ohm RDS(on), it offers efficient performance in various electronic designs.

Median Price

$0.712

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

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Cogito LLC

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Sensible Micro Corp

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Speed Components Ltd

Israel . 143 parts In-Stock

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Nova Conductors

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Contempo Components LLC

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Lantek

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Mil-Aero Solutions, Inc.

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 4,571 parts In-Stock

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$1.364

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$1.309

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$1.255

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Aztec Data Supply Inc.

USA . 3,791 parts In-Stock

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$1.468

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Corohmni

South Africa . 386 parts In-Stock

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Semicontronic

India . 779 parts In-Stock

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Ampacity Inc.

Singapore . 306 parts In-Stock

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AZTECH Wire

Italy . 648 parts In-Stock

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Metaverse IC Inc.

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Lixinc

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Infinite Electronics LLP (Excess)

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Australia . 50 parts In-Stock

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Overview

Unlock the power of innovation with the IRF4905SPBF from Infineon Technologies, a leading manufacturer in the field of Power Field Effect Transistors. This P-CHANNEL transistor offers unmatched quality and reliability, making it perfect for switching applications. With a high maximum drain current and low on-resistance, this transistor delivers exceptional performance and efficiency. Trust Infineon Technologies to provide you with the cutting-edge technology you need to take your projects to the next level. Experience the difference with the IRF4905SPBF.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower on-resistance and higher efficiency, making them ideal for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protects the circuit from reverse currents, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and efficient operation in various power control systems.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control over the switch operation, providing a reliable and stable performance in different circuit designs.

Maximum Power Dissipation (Abs): 170 W

With a high power dissipation capability, this FET can handle large amounts of power without overheating, ensuring excellent thermal performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to withstand harsh environmental conditions, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) IRF4905SPBF attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

HIGH RELIABILITY, AVALANCHE RATED

Avalanche Energy Rating (EAS):

140 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

42 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF4905SPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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