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IPZA60R120P7XKSA1

Infineon Technologies

IPZA60R120P7XKSA1 by Infineon Technologies

Infineon's IPZA60R120P7XKSA1 is a N-CHANNEL FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 78A IDM, 82mJ EAS, and 0.12 ohm Drain-Source On Resistance. Package: PLASTIC/EPOXY, RECTANGULAR shape with THROUGH-HOLE terminals. Operating Mode: ENHANCEMENT MODE at -55 °C.

Median Price

$2.368

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$5.480

100+ parts

$3.860

1k+ parts

$3.270

10k+ parts

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3

$5.480

$3.860

$3.270

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Rochester

USA . 6,466 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

$1.820

10k+ parts

$1.710

6,466

-

$2.030

$1.820

$1.710

DigiKey

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.460

10k+ parts

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6,000

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-

$2.460

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Verical

USA . 5,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.275

10k+ parts

$2.138

5,967

-

-

$2.275

$2.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 87 parts In-Stock

1+ parts

$2.138

100+ parts

-

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87

$2.138

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Vyrian

USA . 795 parts In-Stock

1+ parts

$2.250

100+ parts

-

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795

$2.250

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Sensible Micro Corp

USA . 10,590 parts In-Stock

1+ parts

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10,590

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ComSIT Distribution GmbH

Germany . 1,589 parts In-Stock

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1,589

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 984 parts In-Stock

1+ parts

$2.025

100+ parts

-

1k+ parts

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984

$2.025

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Modulus Dynamics

Lithuania . 8,447 parts In-Stock

1+ parts

$3.270

100+ parts

$3.139

1k+ parts

$3.008

10k+ parts

-

8,447

$3.270

$3.139

$3.008

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QUARKTWIN TECHNOLOGY LTD

USA . 15,319 parts In-Stock

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15,319

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Microchip USA

USA . 5,151 parts In-Stock

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5,151

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Perfect Parts

USA . 885 parts In-Stock

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885

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the IPZA60R120P7XKSA1 by Infineon Technologies. This top-of-the-line Power Field Effect Transistor boasts unparalleled quality and reliability, making it the go-to choice for demanding applications in switching technology. With a minimum DS Breakdown Voltage of 600V and a maximum Pulsed Drain Current of 78A, this N-CHANNEL transistor delivers exceptional performance and efficiency. Whether you're looking to optimize your power management system or enhance the overall functionality of your devices, the IPZA60R120P7XKSA1 offers unmatched value and benefits that will take your projects to new heights. Elevate your designs with Infineon Technologies today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durable and lightweight construction, making the FET easily portable and resistant to damage.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current conduction, making it suitable for a wide range of applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, saving space and reducing overall costs.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring reliable performance and efficient power management.

Minimum DS Breakdown Voltage: 600 V

Provides high voltage tolerance, making it suitable for applications requiring high power handling capabilities.

Package Shape: RECTANGULAR

Allows for compact and space-saving installation in electronic circuits.

Terminal Form: THROUGH-HOLE

Facilitates easy and secure PCB mounting, ensuring stable connections.

Operating Mode: ENHANCEMENT MODE

Offers efficient operation with enhanced performance characteristics under specific conditions.

Maximum Pulsed Drain Current (IDM): 78 A

Capable of handling high current loads, suitable for demanding applications.

Avalanche Energy Rating (EAS): 82 mJ

Provides high energy tolerance for enhanced reliability under extreme conditions.

No. of Terminals: 4

Offers versatility for various circuit configurations and connections.

Package Style (Meter): FLANGE MOUNT

Ensures secure mounting in industrial applications with flange support for stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers efficient performance with low power consumption and high switching speeds.

Transistor Element Material: SILICON

Ensures reliable and durable performance with high temperature tolerance and stability.

Minimum Operating Temperature: -55 °C

Suitable for operation in extreme temperature environments, ensuring consistent performance.

Terminal Finish: TIN

Provides corrosion resistance and secure electrical connections for long-term reliability.

Maximum Drain-Source On Resistance: 0.12 ohm

Offers low resistance for efficient power conduction with minimal power loss.

Terminal Position: SINGLE

Facilitates easy installation and connection in circuits with single terminal positioning.

Technical Specifications

Power Field Effect Transistors (FET) IPZA60R120P7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

82 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

78 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPZA60R120P7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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