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IPZA60R060P7XKSA1

Infineon Technologies

IPZA60R060P7XKSA1 by Infineon Technologies

Infineon's IPZA60R060P7XKSA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for switching applications. Features include 151A IDM, 159mJ EAS, and 0.06ohm RDS(on). Package style is flange mount with through-hole terminals.

Median Price

$5.856

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 30 parts In-Stock

1+ parts

$3.873

100+ parts

$3.721

1k+ parts

$3.228

10k+ parts

-

30

$3.873

$3.721

$3.228

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Chip1Stop

Japan . 228 parts In-Stock

1+ parts

$7.500

100+ parts

$4.310

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-

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228

$7.500

$4.310

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-

Farnell

UK . 139 parts In-Stock

1+ parts

$8.825

100+ parts

$5.802

1k+ parts

$4.291

10k+ parts

-

139

$8.825

$5.802

$4.291

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Element14

Singapore . 3 parts In-Stock

1+ parts

$9.200

100+ parts

$4.540

1k+ parts

$4.360

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3

$9.200

$4.540

$4.360

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Verical

USA . 228 parts In-Stock

1+ parts

-

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$4.211

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228

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$4.211

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Rochester

USA . 22 parts In-Stock

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-

100+ parts

$3.170

1k+ parts

$2.840

10k+ parts

$2.670

22

-

$3.170

$2.840

$2.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 67 parts In-Stock

1+ parts

$3.534

100+ parts

-

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-

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67

$3.534

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Vyrian

USA . 4,656 parts In-Stock

1+ parts

-

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4,656

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Sensible Micro Corp

USA . 125 parts In-Stock

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125

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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19

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Distributors (Availability)

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Corphita

USA . 331 parts In-Stock

1+ parts

$3.348

100+ parts

-

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331

$3.348

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Modulus Dynamics

Lithuania . 20,211 parts In-Stock

1+ parts

$6.827

100+ parts

$6.554

1k+ parts

$6.281

10k+ parts

-

20,211

$6.827

$6.554

$6.281

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Continental Prestige Electronics

USA . 209 parts In-Stock

1+ parts

$7.980

100+ parts

$5.070

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-

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209

$7.980

$5.070

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Microchip USA

USA . 6,064 parts In-Stock

1+ parts

$25.144

100+ parts

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6,064

$25.144

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RC Electronics

USA . 8,700 parts In-Stock

1+ parts

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100+ parts

$7.390

1k+ parts

$6.750

10k+ parts

$6.550

8,700

-

$7.390

$6.750

$6.550

iodParts Technologies Inc.

India . 8,016 parts In-Stock

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8,016

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Perfect Parts

USA . 543 parts In-Stock

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543

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Unlock the power of innovation with the IPZA60R060P7XKSA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality Power FETs that guarantee reliability and performance. Ideal for switching applications, this N-CHANNEL transistor offers a breakthrough in efficiency and durability. With a maximum pulsed drain current of 151 A and a minimum DS breakdown voltage of 600 V, this transistor is designed to handle even the most demanding tasks. Elevate your projects with the IPZA60R060P7XKSA1 and experience the difference that Infineon Technologies brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Minimum DS Breakdown Voltage: 600 V

Capable of handling high voltage levels, making it suitable for power applications where voltage spikes may occur.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, offering improved efficiency and control in switching applications.

Maximum Pulsed Drain Current (IDM): 151 A

High current handling capacity allows the transistor to manage heavy loads without overheating or failing.

Avalanche Energy Rating (EAS): 159 mJ

High avalanche energy rating ensures robustness and reliability in high power applications where inductive loads are present.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds, low power consumption, and high efficiency in power applications.

Maximum Drain-Source On Resistance: 0.06 ohm

Low on-resistance minimizes power losses and heat generation, making the transistor suitable for high-efficiency power switching.

Technical Specifications

Power Field Effect Transistors (FET) IPZA60R060P7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

159 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

151 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPZA60R060P7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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