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IPW90R120C3XKSA1

Infineon Technologies

IPW90R120C3XKSA1 by Infineon Technologies

IPW90R120C3XKSA1 by Infineon is a N-CHANNEL Power FET with 900V DS Breakdown Voltage and 96A IDM. Ideal for SWITCHING applications, it features a built-in diode, 1940mJ EAS rating, and 0.12 ohm RDS(on).

Median Price

$14.918

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,480 parts In-Stock

1+ parts

$11.914

100+ parts

$8.220

1k+ parts

$8.132

10k+ parts

-

1,480

$11.914

$8.220

$8.132

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Verical

USA . 1,480 parts In-Stock

1+ parts

$11.986

100+ parts

$8.270

1k+ parts

$8.181

10k+ parts

-

1,480

$11.986

$8.270

$8.181

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Chip1Stop

Japan . 3,160 parts In-Stock

1+ parts

$14.836

100+ parts

$8.745

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-

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3,160

$14.836

$8.745

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DigiKey

USA . 270 parts In-Stock

1+ parts

$15.000

100+ parts

$9.213

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$8.117

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270

$15.000

$9.213

$8.117

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Newark

USA . 347 parts In-Stock

1+ parts

$20.860

100+ parts

$12.240

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$11.540

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347

$20.860

$12.240

$11.540

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Future Electronics

Canada . 240 parts In-Stock

1+ parts

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$16.550

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$16.290

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240

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$16.550

$16.290

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 857 parts In-Stock

1+ parts

$7.812

100+ parts

-

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857

$7.812

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Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$13.498

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60

$13.498

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Chip Stock

USA . 6,900 parts In-Stock

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6,900

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IBS Electronics

USA . 6,180 parts In-Stock

1+ parts

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100+ parts

$23.211

1k+ parts

$9.257

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6,180

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$23.211

$9.257

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Vyrian

USA . 2,088 parts In-Stock

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2,088

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Rutronik

Germany . 1,230 parts In-Stock

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$8.350

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$7.270

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1,230

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$8.350

$7.270

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 257 parts In-Stock

1+ parts

$0.479

100+ parts

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257

$0.479

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Corohmni

South Africa . 545 parts In-Stock

1+ parts

$1.094

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545

$1.094

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Modulus Dynamics

Lithuania . 14,587 parts In-Stock

1+ parts

$1.158

100+ parts

$1.112

1k+ parts

$1.065

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14,587

$1.158

$1.112

$1.065

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Semicontronic

India . 1,331 parts In-Stock

1+ parts

$5.300

100+ parts

$5.168

1k+ parts

$5.141

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1,331

$5.300

$5.168

$5.141

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Ampacity Inc.

Singapore . 1,150 parts In-Stock

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$5.300

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$5.300

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Corphita

USA . 982 parts In-Stock

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$7.401

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982

$7.401

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Benley Electronics

USA . 4 parts In-Stock

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$10.000

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4

$10.000

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Netroflash

USA . 50 parts In-Stock

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$13.498

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$13.228

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50

$13.498

$13.228

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Continental Prestige Electronics

USA . 806 parts In-Stock

1+ parts

$14.620

100+ parts

$10.980

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806

$14.620

$10.980

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QUARKTWIN TECHNOLOGY LTD

USA . 26,572 parts In-Stock

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Microchip USA

USA . 6,346 parts In-Stock

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Argo Parts USA

USA . 3,796 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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RC Electronics

USA . 1,828 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Allen Electronics Distributors

USA . 3 parts In-Stock

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Overview

Discover the cutting-edge IPW90R120C3XKSA1 Power Field Effect Transistor by Infineon Technologies, a trusted manufacturer known for quality and reliability. Ideal for various switching applications, this N-CHANNEL FET offers unparalleled performance with a minimum DS Breakdown Voltage of 900V and a maximum Drain Current of 36A. With a built-in diode and an impressive Maximum Power Dissipation of 417W, this transistor ensures efficient operation even in demanding conditions. Elevate your projects with the exceptional value and benefits that the IPW90R120C3XKSA1 brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good physical protection and insulation for the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are commonly used for high power applications due to their superior performance characteristics.

Minimum DS Breakdown Voltage: 900 V

Can handle high voltage applications, ensuring safety and reliability in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer good control over the switching operation, allowing for precise and efficient power management.

Maximum Pulsed Drain Current (IDM): 96 A

High current handling capability enables the FET to be used in power-hungry applications without the risk of overheating or failure.

Maximum Power Dissipation (Abs): 417 W

Can handle high power dissipation, making it suitable for applications where heat generation is a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability for power switching applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Maximum Drain-Source On Resistance: 0.12 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPW90R120C3XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

1940 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (ID):

36 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

96 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW90R120C3XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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