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IPW90R500C3XKSA1

Infineon Technologies

IPW90R500C3XKSA1 by Infineon Technologies

Infineon's IPW90R500C3XKSA1 is a N-CHANNEL Power FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 24A IDM and 0.5 ohm RDS(on), it operates in ENHANCEMENT MODE at -55 to 150 °C, making it suitable for high-power systems.

Median Price

$4.351

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 112 parts In-Stock

1+ parts

$3.860

100+ parts

$1.800

1k+ parts

$1.400

10k+ parts

-

112

$3.860

$1.800

$1.400

-

Chip1Stop

Japan . 1,302 parts In-Stock

1+ parts

$4.180

100+ parts

$2.110

1k+ parts

$1.850

10k+ parts

-

1,302

$4.180

$2.110

$1.850

-

Arrow

USA . 882 parts In-Stock

1+ parts

$4.307

100+ parts

$2.268

1k+ parts

$1.586

10k+ parts

-

882

$4.307

$2.268

$1.586

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Avnet

USA . 200 parts In-Stock

1+ parts

$4.395

100+ parts

$1.975

1k+ parts

-

10k+ parts

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200

$4.395

$1.975

-

-

Mouser Electronics

USA . 262 parts In-Stock

1+ parts

$4.570

100+ parts

$2.100

1k+ parts

$1.930

10k+ parts

-

262

$4.570

$2.100

$1.930

-

DigiKey

USA . 1,456 parts In-Stock

1+ parts

$4.700

100+ parts

$2.617

1k+ parts

$1.820

10k+ parts

$1.685

1,456

$4.700

$2.617

$1.820

$1.685

Newark

USA . 112 parts In-Stock

1+ parts

$4.710

100+ parts

$2.160

1k+ parts

$1.990

10k+ parts

-

112

$4.710

$2.160

$1.990

-

Element14

Singapore . 112 parts In-Stock

1+ parts

$6.590

100+ parts

$3.110

1k+ parts

$2.510

10k+ parts

-

112

$6.590

$3.110

$2.510

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Verical

USA . 592 parts In-Stock

1+ parts

-

100+ parts

$2.109

1k+ parts

$1.625

10k+ parts

-

592

-

$2.109

$1.625

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Future Electronics

Canada . 510 parts In-Stock

1+ parts

-

100+ parts

$4.160

1k+ parts

$4.010

10k+ parts

$3.940

510

-

$4.160

$4.010

$3.940

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.272

100+ parts

-

1k+ parts

-

10k+ parts

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500

$3.272

-

-

-

Digiode

USA . 79 parts In-Stock

1+ parts

$3.971

100+ parts

-

1k+ parts

-

10k+ parts

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79

$3.971

-

-

-

Chip Stock

USA . 3,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,113

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-

-

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Vyrian

USA . 801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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801

-

-

-

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IBS Electronics

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$5.834

1k+ parts

$2.384

10k+ parts

-

750

-

$5.834

$2.384

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 23,962 parts In-Stock

1+ parts

$0.747

100+ parts

$0.717

1k+ parts

$0.687

10k+ parts

-

23,962

$0.747

$0.717

$0.687

-

Aztec Data Supply Inc.

USA . 3,300 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

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3,300

$0.890

-

-

-

Corohmni

South Africa . 932 parts In-Stock

1+ parts

$1.017

100+ parts

-

1k+ parts

-

10k+ parts

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932

$1.017

-

-

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Ampacity Inc.

Singapore . 702 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

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702

$1.790

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.272

100+ parts

$3.206

1k+ parts

-

10k+ parts

-

1,000

$3.272

$3.206

-

-

Argo Parts USA

USA . 128 parts In-Stock

1+ parts

$3.272

100+ parts

-

1k+ parts

-

10k+ parts

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128

$3.272

-

-

-

Benley Electronics

USA . 1 parts In-Stock

1+ parts

$3.750

100+ parts

-

1k+ parts

-

10k+ parts

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1

$3.750

-

-

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Corphita

USA . 194 parts In-Stock

1+ parts

$3.762

100+ parts

-

1k+ parts

-

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194

$3.762

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-

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Microchip USA

USA . 5,258 parts In-Stock

1+ parts

$14.532

100+ parts

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10k+ parts

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5,258

$14.532

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Lixinc

USA . 12,826 parts In-Stock

1+ parts

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100+ parts

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12,826

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-

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RC Electronics

USA . 8,737 parts In-Stock

1+ parts

-

100+ parts

$3.320

1k+ parts

$3.030

10k+ parts

$2.940

8,737

-

$3.320

$3.030

$2.940

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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8,000

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Overview

Unlock the power of efficiency and reliability with the IPW90R500C3XKSA1 by Infineon Technologies. Crafted by a trusted manufacturer, this N-CHANNEL Power Field Effect Transistor offers seamless switching capabilities ideal for a variety of applications. With a high minimum DS Breakdown Voltage of 900V and a maximum Drain Current of 11A, this transistor ensures superior performance and durability. Say goodbye to downtime and hello to optimized operations with the IPW90R500C3XKSA1 – your key to enhanced productivity and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material allows for a lightweight and cost-effective design.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and high efficiency.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this FET is suitable for high-voltage applications where reliability is critical.

Package Shape: RECTANGULAR

The rectangular shape provides easy mounting and space-saving benefits in compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easy control and low power consumption in a wide range of applications.

Maximum Pulsed Drain Current (IDM): 24 A

The high pulsed drain current rating allows for handling of short-duration peak loads.

Avalanche Energy Rating (EAS): 388 mJ

With a high avalanche energy rating, this FET can withstand momentary power surges without failure.

Maximum Drain Current (Abs) (ID): 11 A

The high drain current rating makes this FET suitable for high-power applications.

No. of Terminals: 3

The 3-terminal design simplifies circuit connections and provides flexibility in circuit design.

Maximum Power Dissipation (Abs): 156 W

With a high power dissipation rating, this FET can handle high power levels without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy and secure mounting in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high speed, low power consumption, and high efficiency.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET is suitable for harsh environments and high-temperature applications.

Transistor Element Material: SILICON

Silicon-based FETs offer high reliability, low leakage current, and excellent thermal performance.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable performance in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Maximum Drain-Source On Resistance: 0.5 ohm

The low ON resistance results in reduced power loss and high efficiency in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit layout and ensures easy integration into existing designs.

Technical Specifications

Power Field Effect Transistors (FET) IPW90R500C3XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

388 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

24 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW90R500C3XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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