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IPW65R099C6FKSA1

Infineon Technologies

IPW65R099C6FKSA1 by Infineon Technologies

IPW65R099C6FKSA1 by Infineon Technologies is a N-CHANNEL Power FET with 650V DS Breakdown Voltage and 0.099 ohm RDS(ON). It is used for SWITCHING applications, featuring 115A IDM and 845mJ EAS. The transistor has a SINGLE configuration with BUILT-IN DIODE, RECTANGULAR package shape, and THROUGH-HOLE terminals.

Median Price

$3.532

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 165 parts In-Stock

1+ parts

-

100+ parts

$3.140

1k+ parts

$2.810

10k+ parts

$2.640

165

-

$3.140

$2.810

$2.640

Verical

USA . 165 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.513

10k+ parts

$3.300

165

-

$3.925

$3.513

$3.300

Distributors (In-Stock)

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Digiode

USA . 87 parts In-Stock

1+ parts

$3.553

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87

$3.553

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Vyrian

USA . 3,277 parts In-Stock

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3,277

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Corohmni

South Africa . 42 parts In-Stock

1+ parts

$0.597

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-

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42

$0.597

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Modulus Dynamics

Lithuania . 11,533 parts In-Stock

1+ parts

$1.726

100+ parts

$1.657

1k+ parts

$1.588

10k+ parts

-

11,533

$1.726

$1.657

$1.588

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Ampacity Inc.

Singapore . 349 parts In-Stock

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$3.180

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349

$3.180

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Corphita

USA . 354 parts In-Stock

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$3.366

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354

$3.366

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AZTECH Wire

Italy . 597 parts In-Stock

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$9.260

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597

$9.260

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QUARKTWIN TECHNOLOGY LTD

USA . 25,465 parts In-Stock

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Microchip USA

USA . 7,938 parts In-Stock

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RC Electronics

USA . 7,281 parts In-Stock

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$6.860

1k+ parts

$6.260

10k+ parts

$6.070

7,281

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$6.860

$6.260

$6.070

GreenTree Electronics

Israel . 4,800 parts In-Stock

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4,800

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Continental Prestige Electronics

USA . 3,687 parts In-Stock

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Argo Parts USA

USA . 2,885 parts In-Stock

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2,885

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Perfect Parts

USA . 605 parts In-Stock

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605

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of the IPW65R099C6FKSA1 by Infineon Technologies and experience top-notch quality and performance in Power Field Effect Transistors. Manufactured by industry leader Infineon Technologies, this N-CHANNEL transistor offers unparalleled reliability for a variety of switching applications. With a high DS Breakdown Voltage of 650V and a low on-resistance of 0.099 ohm, this transistor is sure to provide efficient and effective operation. Upgrade your systems today with the IPW65R099C6FKSA1 and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their excellent efficiency and low ON resistance, making them ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse voltage, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high efficiency and reliability in controlling power flow.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this transistor can handle high voltage loads safely, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and integration into various systems or circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals are sturdy and provide secure connections, reducing the risk of electrical failures.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer precise control over the switching process, leading to improved performance and efficiency.

Maximum Pulsed Drain Current (IDM): 115 A

The high pulsed drain current rating allows the transistor to handle large current spikes without overheating or damage.

Avalanche Energy Rating (EAS): 845 mJ

The high avalanche energy rating ensures the transistor can withstand sudden high-energy pulses, making it reliable and durable in demanding conditions.

No. of Terminals: 3

With three terminals, this transistor is easy to connect and integrate into circuits, simplifying the overall design process.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options, ideal for applications where stability and heat dissipation are crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability, ensuring consistent operation in various conditions.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent electrical properties and high temperature tolerance, making them suitable for demanding applications.

Terminal Finish: TIN

Tin terminal finish enhances conductivity and corrosion resistance, extending the lifespan of the transistor.

Maximum Drain-Source On Resistance: 0.099 ohm

Low drain-source on resistance leads to reduced power losses and improved efficiency, making this transistor an excellent choice for high-power applications.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and ensures proper connectivity within the circuit, reducing the risk of errors or faults.

Technical Specifications

Power Field Effect Transistors (FET) IPW65R099C6FKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

845 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

115 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPW65R099C6FKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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