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IPSA70R1K2P7SAKMA1

Infineon Technologies

IPSA70R1K2P7SAKMA1 by Infineon Technologies

IPSA70R1K2P7SAKMA1 by Infineon is a N-CHANNEL FET with 700V DS breakdown voltage and 9.4A IDM. It is used for switching applications, featuring a single configuration with built-in diode. The transistor operates in enhancement mode, with a max RDS(on) of 1.2 ohm and -40°C min temperature rating.

Median Price

$0.589

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 114 parts In-Stock

1+ parts

$0.552

100+ parts

$0.336

1k+ parts

$0.238

10k+ parts

$0.237

114

$0.552

$0.336

$0.238

$0.237

Farnell

UK . 114 parts In-Stock

1+ parts

$0.683

100+ parts

$0.656

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114

$0.683

$0.656

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DigiKey

USA . 2 parts In-Stock

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$1.040

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2

$1.040

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RS (Exports)

UK . 1,500 parts In-Stock

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100+ parts

$0.589

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$0.395

10k+ parts

$0.365

1,500

-

$0.589

$0.395

$0.365

Rochester

USA . 1,006 parts In-Stock

1+ parts

-

100+ parts

$0.286

1k+ parts

$0.237

10k+ parts

$0.211

1,006

-

$0.286

$0.237

$0.211

Chip1Stop

Japan . 10 parts In-Stock

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Digiode

USA . 471 parts In-Stock

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$0.222

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471

$0.222

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Vyrian

USA . 8,466 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 80 parts In-Stock

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$0.211

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80

$0.211

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Continental Prestige Electronics

USA . 118 parts In-Stock

1+ parts

$0.558

100+ parts

$0.374

1k+ parts

$0.195

10k+ parts

$0.183

118

$0.558

$0.374

$0.195

$0.183

Component Stockers USA

USA . 1,606 parts In-Stock

1+ parts

$0.610

100+ parts

$0.560

1k+ parts

$0.400

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1,606

$0.610

$0.560

$0.400

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Modulus Dynamics

Lithuania . 5,136 parts In-Stock

1+ parts

$0.696

100+ parts

$0.668

1k+ parts

$0.640

10k+ parts

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5,136

$0.696

$0.668

$0.640

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Microchip USA

USA . 6,049 parts In-Stock

1+ parts

$5.135

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6,049

$5.135

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Perfect Parts

USA . 224 parts In-Stock

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Overview

Unlock the power of innovation with the IPSA70R1K2P7SAKMA1 by Infineon Technologies. This Power Field Effect Transistor (FET) offers unparalleled quality and reliability, thanks to its manufacturer's reputation for excellence. Ideal for switching applications, this N-CHANNEL transistor provides a seamless user experience with its single configuration and built-in diode. With a high DS Breakdown Voltage of 700V and maximum Pulsed Drain Current of 9.4A, this product delivers exceptional performance and efficiency. Experience the advantages of cutting-edge technology with the IPSA70R1K2P7SAKMA1 - a game-changer in the field of power transistors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection and insulation for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for their high input impedance, low output impedance, and fast switching speed, making them suitable for a wide range of applications.

Minimum DS Breakdown Voltage: 700 V

With a high breakdown voltage, this FET can handle high voltage applications without risking damage or malfunction.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, making this FET suitable for applications where backflow of current is a concern.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and efficient switching performance.

Maximum Pulsed Drain Current (IDM): 9.4 A

With a high pulsed drain current rating, this FET can handle short bursts of high current, making it suitable for peak power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductors offer good stability and high input impedance, ensuring reliable performance in various operating conditions.

Maximum Drain-Source On Resistance: 1.2 ohm

Low on-resistance results in minimal power dissipation and voltage drop across the FET, improving overall efficiency of the circuit.

Technical Specifications

Power Field Effect Transistors (FET) IPSA70R1K2P7SAKMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

700 V

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

9.4 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPSA70R1K2P7SAKMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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