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IPSA70R2K0P7SAKMA1

Infineon Technologies

IPSA70R2K0P7SAKMA1 by Infineon Technologies

IPSA70R2K0P7SAKMA1 by Infineon is a N-CHANNEL FET with 700V DS breakdown voltage, 5.7A IDM, and 2 ohm RDS(on). It is used for switching applications in enhancement mode with a built-in diode. The transistor operates at -40°C, has a SILICON element, and features an IN-LINE package style.

Median Price

$0.394

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,520 parts In-Stock

1+ parts

$0.327

100+ parts

$0.138

1k+ parts

$0.089

10k+ parts

$0.080

1,520

$0.327

$0.138

$0.089

$0.080

Farnell

UK . 129 parts In-Stock

1+ parts

$0.461

100+ parts

$0.362

1k+ parts

-

10k+ parts

-

129

$0.461

$0.362

-

-

Element14

Singapore . 130 parts In-Stock

1+ parts

$0.553

100+ parts

$0.434

1k+ parts

$0.279

10k+ parts

$0.274

130

$0.553

$0.434

$0.279

$0.274

Mouser Electronics

USA . 1,518 parts In-Stock

1+ parts

$0.580

100+ parts

$0.455

1k+ parts

$0.438

10k+ parts

$0.293

1,518

$0.580

$0.455

$0.438

$0.293

Rochester

USA . 85,292 parts In-Stock

1+ parts

-

100+ parts

$0.248

1k+ parts

$0.206

10k+ parts

$0.184

85,292

-

$0.248

$0.206

$0.184

Verical

USA . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.230

42,000

-

-

-

$0.230

Chip1Stop

Japan . 1,500 parts In-Stock

1+ parts

-

100+ parts

$0.196

1k+ parts

-

10k+ parts

-

1,500

-

$0.196

-

-

RS (Exports)

UK . 1,275 parts In-Stock

1+ parts

-

100+ parts

$0.506

1k+ parts

$0.471

10k+ parts

$0.355

1,275

-

$0.506

$0.471

$0.355

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 165 parts In-Stock

1+ parts

$0.179

100+ parts

-

1k+ parts

-

10k+ parts

-

165

$0.179

-

-

-

Digiode

USA . 467 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

-

10k+ parts

-

467

$0.194

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 634 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$0.184

-

-

-

Modulus Dynamics

Lithuania . 14,437 parts In-Stock

1+ parts

$0.316

100+ parts

$0.303

1k+ parts

$0.291

10k+ parts

-

14,437

$0.316

$0.303

$0.291

-

Continental Prestige Electronics

USA . 105 parts In-Stock

1+ parts

$0.412

100+ parts

$0.287

1k+ parts

$0.177

10k+ parts

$0.170

105

$0.412

$0.287

$0.177

$0.170

Microchip USA

USA . 7,377 parts In-Stock

1+ parts

$4.420

100+ parts

-

1k+ parts

-

10k+ parts

-

7,377

$4.420

-

-

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,000

-

-

-

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Perfect Parts

USA . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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112

-

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-

-

Overview

Elevate your power management solutions with the IPSA70R2K0P7SAKMA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a robust 700V DS breakdown voltage and a maximum pulsed drain current of 5.7A, this transistor ensures reliable and efficient operation. Whether you're in industrial automation, automotive, or renewable energy, this single configuration FET with a built-in diode is the ideal choice for enhancing your system's performance. Trust in the quality and innovation of Infineon Technologies to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse currents, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and fast operation in various electronic circuits.

Minimum DS Breakdown Voltage: 700 V

With a high breakdown voltage, this FET can handle high voltage applications, making it a reliable choice for power electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit boards, saving space and simplifying installation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connection, making it easier to solder and ensuring reliability in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control and better performance in switching applications, providing efficiency and versatility.

Maximum Pulsed Drain Current (IDM): 5.7 A

With a high pulsed drain current rating, this FET can handle sudden surges of current, making it suitable for various power applications.

No. of Terminals: 3

Having 3 terminals allows for specific connections in the circuit, ensuring proper operation and control of the FET.

Package Style (Meter): IN-LINE

The in-line package style allows for easy connections and integration into existing circuit layouts, simplifying design and installation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making this FET suitable for power electronics and switching applications.

Transistor Element Material: SILICON

Silicon-based transistor elements provide high performance and reliability, ensuring stable operation in various conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FET can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and conductivity, ensuring reliable connections and efficient operation of the FET.

Maximum Drain-Source On Resistance: 2 ohm

With a low on-resistance, this FET minimizes power loss and heat generation, improving overall efficiency in power electronics applications.

Terminal Position: SINGLE

Having a single terminal position simplifies circuit design and connections, ensuring proper operation and control of the FET in various applications.

Case Connection: DRAIN

The drain connection allows for proper current flow and control in the circuit, ensuring efficient operation and protection of the FET.

Technical Specifications

Power Field Effect Transistors (FET) IPSA70R2K0P7SAKMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

700 V

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

5.7 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPSA70R2K0P7SAKMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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