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IPP60R380E6XKSA1

Infineon Technologies

IPP60R380E6XKSA1 by Infineon Technologies

Infineon's IPP60R380E6XKSA1 is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. Featuring a single configuration with built-in diode, it offers 0.38 ohm RDS(on) and 30A IDM. This power transistor operates in enhancement mode, with 83W max power dissipation and 150°C max temp.

Median Price

$1.275

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 558 parts In-Stock

1+ parts

$2.000

100+ parts

$1.050

1k+ parts

$0.827

10k+ parts

-

558

$2.000

$1.050

$0.827

-

Element14

Singapore . 965 parts In-Stock

1+ parts

$2.409

100+ parts

$1.579

1k+ parts

$1.179

10k+ parts

$1.171

965

$2.409

$1.579

$1.179

$1.171

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

1,000

-

$1.230

$1.020

$0.910

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.050

10k+ parts

-

500

-

-

$1.050

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.275

10k+ parts

$1.138

500

-

-

$1.275

$1.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 979 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

979

$0.960

-

-

-

Vyrian

USA . 3,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,201

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 486 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

-

486

$0.909

-

-

-

Modulus Dynamics

Lithuania . 13,712 parts In-Stock

1+ parts

$1.261

100+ parts

$1.211

1k+ parts

$1.160

10k+ parts

-

13,712

$1.261

$1.211

$1.160

-

Continental Prestige Electronics

USA . 981 parts In-Stock

1+ parts

$1.660

100+ parts

$1.150

1k+ parts

$1.040

10k+ parts

-

981

$1.660

$1.150

$1.040

-

Component Stockers USA

USA . 1,357 parts In-Stock

1+ parts

$2.120

100+ parts

$1.510

1k+ parts

-

10k+ parts

-

1,357

$2.120

$1.510

-

-

Microchip USA

USA . 5,906 parts In-Stock

1+ parts

$6.955

100+ parts

-

1k+ parts

-

10k+ parts

-

5,906

$6.955

-

-

-

Epart123

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.500

6,000

-

-

$1.500

$1.500

Perfect Parts

USA . 1,137 parts In-Stock

1+ parts

-

100+ parts

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1,137

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Overview

Unleash the power of innovation with the IPP60R380E6XKSA1 by Infineon Technologies. As a leader in Power Field Effect Transistors (FET), Infineon delivers top-quality products that are designed to exceed expectations. This N-CHANNEL transistor with a built-in diode is perfect for various switching applications, providing reliable performance and durability. With a high breakdown voltage of 600V and a maximum pulsed drain current of 30A, this transistor offers unmatched efficiency and power handling capabilities. Trust Infineon to bring you cutting-edge technology that maximizes your system's performance and reliability. Experience the difference with Infineon's IPP60R380E6XKSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

Enhances the efficiency and performance of the transistor in various applications.

Transistor Application: SWITCHING

Designed for switching circuits, allowing for fast and efficient on/off switching operations.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltages, making it suitable for applications requiring robust voltage tolerance.

Configuration: SINGLE WITH BUILT-IN DIODE

Includes a built-in diode for protection and reverse current flow prevention.

Maximum Pulsed Drain Current (IDM): 30 A

Capable of handling high current pulses, ideal for demanding applications.

Maximum Power Dissipation (Abs): 83 W

Can dissipate power efficiently, ensuring stable operation under varying load conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial environments.

Technical Specifications

Power Field Effect Transistors (FET) IPP60R380E6XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

210 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10.6 A

Maximum Drain Current (ID):

10.6 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP60R380E6XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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