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IPP60R099C7XKSA1

Infineon Technologies

IPP60R099C7XKSA1 by Infineon Technologies

IPP60R099C7XKSA1 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage. Ideal for switching applications, it has a max pulsed drain current of 83A and 0.099 ohm drain-source resistance. The transistor operates in enhancement mode and features a built-in diode, making it suitable for high-power systems.

Median Price

$5.584

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 320 parts In-Stock

1+ parts

$3.530

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320

$3.530

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Farnell

UK . 477 parts In-Stock

1+ parts

$4.680

100+ parts

$2.450

1k+ parts

$2.060

10k+ parts

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477

$4.680

$2.450

$2.060

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Arrow

USA . 500 parts In-Stock

1+ parts

$5.584

100+ parts

$2.770

1k+ parts

$2.292

10k+ parts

-

500

$5.584

$2.770

$2.292

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Newark

USA . 477 parts In-Stock

1+ parts

$6.460

100+ parts

$3.830

1k+ parts

$3.520

10k+ parts

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477

$6.460

$3.830

$3.520

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Mouser Electronics

USA . 918 parts In-Stock

1+ parts

$6.700

100+ parts

$3.240

1k+ parts

$2.540

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918

$6.700

$3.240

$2.540

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Element14

Singapore . 477 parts In-Stock

1+ parts

$7.970

100+ parts

$4.040

1k+ parts

$3.080

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477

$7.970

$4.040

$3.080

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Verical

USA . 498 parts In-Stock

1+ parts

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$2.748

1k+ parts

$2.273

10k+ parts

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498

-

$2.748

$2.273

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Distributors (In-Stock)

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Digiode

USA . 399 parts In-Stock

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$1.102

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399

$1.102

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Vyrian

USA . 3,074 parts In-Stock

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3,074

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Nova Conductors

Japan . 53 parts In-Stock

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53

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Ampacity Inc.

Singapore . 487 parts In-Stock

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$0.990

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487

$0.990

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Corphita

USA . 243 parts In-Stock

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$1.044

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243

$1.044

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Modulus Dynamics

Lithuania . 2,246 parts In-Stock

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$1.505

100+ parts

$1.445

1k+ parts

$1.385

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2,246

$1.505

$1.445

$1.385

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Allen Electronics Distributors

USA . 1,466 parts In-Stock

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$5.810

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$4.250

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1,466

$5.810

$4.250

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Microchip USA

USA . 7,620 parts In-Stock

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$17.584

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7,620

$17.584

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iodParts Technologies Inc.

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8,016

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Netroflash

USA . 100 parts In-Stock

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100

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Unlock the power of high-quality electronic components with the IPP60R099C7XKSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch Power Field Effect Transistors that are ideal for various switching applications. With a minimum DS breakdown voltage of 600V and a maximum pulsed drain current of 83A, this N-channel transistor offers exceptional performance and reliability. Whether you're designing industrial equipment or consumer electronics, the IPP60R099C7XKSA1 provides the value, benefits, and advantages you need to bring your projects to life. Experience the difference with Infineon Technologies today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistances and higher efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse polarity and simplifies circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage allows for operation in high voltage circuits without risk of damage.

Terminal Form: THROUGH-HOLE

Easy to solder onto a PCB, providing a secure and reliable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and more commonly used in practical applications.

Maximum Pulsed Drain Current (IDM): 83 A

Capable of handling high current pulses, suitable for demanding applications.

Avalanche Energy Rating (EAS): 97 mJ

Capable of withstanding high energy spikes, ensuring robustness in harsh operating conditions.

No. of Terminals: 3

Simple and straightforward connection setup with only three terminals.

Package Style (Meter): FLANGE MOUNT

Flange mount package allows for easy mounting and heat dissipation in the application.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and fast switching speeds, ideal for power switching applications.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its stability and performance.

Terminal Finish: TIN

Tin finish offers good conductivity and solderability, ensuring a strong electrical connection.

Maximum Drain Current (ID): 22 A

Sufficient current-carrying capacity for medium to high power applications.

Maximum Drain-Source On Resistance: 0.099 ohm

Low ON resistance helps minimize power loss and improve efficiency in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies installation and integration into the circuit.

Case Connection: DRAIN

Drain connection for easy connection to the load, ensuring proper functionality in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) IPP60R099C7XKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

97 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.099 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

83 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP60R099C7XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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