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IPP034NE7N3GXKSA1

Infineon Technologies

IPP034NE7N3GXKSA1 by Infineon Technologies

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; JESD-609 Code: e3; Maximum Drain Current (ID): 100 A; Terminal Position: SINGLE;

Median Price

$3.615

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,059 parts In-Stock

1+ parts

$1.890

100+ parts

$1.321

1k+ parts

$1.165

10k+ parts

-

1,059

$1.890

$1.321

$1.165

-

Farnell

UK . 106 parts In-Stock

1+ parts

$3.600

100+ parts

$1.680

1k+ parts

$1.460

10k+ parts

-

106

$3.600

$1.680

$1.460

-

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$3.630

100+ parts

$2.520

1k+ parts

$1.820

10k+ parts

$1.700

85

$3.630

$2.520

$1.820

$1.700

Chip1Stop

Japan . 495 parts In-Stock

1+ parts

$4.230

100+ parts

$2.150

1k+ parts

-

10k+ parts

-

495

$4.230

$2.150

-

-

DigiKey

USA . 512 parts In-Stock

1+ parts

$4.370

100+ parts

$2.035

1k+ parts

$1.559

10k+ parts

$1.525

512

$4.370

$2.035

$1.559

$1.525

Element14

Singapore . 352 parts In-Stock

1+ parts

$5.190

100+ parts

$3.500

1k+ parts

$2.600

10k+ parts

-

352

$5.190

$3.500

$2.600

-

Rochester

USA . 15,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,650

-

-

-

-

Verical

USA . 2,905 parts In-Stock

1+ parts

-

100+ parts

$1.957

1k+ parts

$1.550

10k+ parts

-

2,905

-

$1.957

$1.550

-

Future Electronics

Canada . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.470

10k+ parts

$2.430

500

-

-

$2.470

$2.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 579 parts In-Stock

1+ parts

$1.612

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$1.612

-

-

-

TME

Poland . 107 parts In-Stock

1+ parts

$4.010

100+ parts

$2.240

1k+ parts

-

10k+ parts

-

107

$4.010

$2.240

-

-

Vyrian

USA . 8,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,804

-

-

-

-

Rutronik

Germany . 5,150 parts In-Stock

1+ parts

-

100+ parts

$1.310

1k+ parts

$1.011

10k+ parts

-

5,150

-

$1.310

$1.011

-

IBS Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.209

10k+ parts

$1.170

500

-

-

$1.209

$1.170

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 10,698 parts In-Stock

1+ parts

$0.734

100+ parts

$0.705

1k+ parts

$0.675

10k+ parts

-

10,698

$0.734

$0.705

$0.675

-

Corphita

USA . 434 parts In-Stock

1+ parts

$1.527

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$1.527

-

-

-

Continental Prestige Electronics

USA . 417 parts In-Stock

1+ parts

$2.940

100+ parts

$2.170

1k+ parts

$1.480

10k+ parts

-

417

$2.940

$2.170

$1.480

-

Microchip USA

USA . 3,399 parts In-Stock

1+ parts

$24.570

100+ parts

-

1k+ parts

-

10k+ parts

-

3,399

$24.570

-

-

-

RC Electronics

USA . 42,871 parts In-Stock

1+ parts

-

100+ parts

$2.450

1k+ parts

$2.230

10k+ parts

$2.170

42,871

-

$2.450

$2.230

$2.170

Infinite Electronics LLP (Excess)

. 4,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,507

-

-

-

-

Perfect Parts

USA . 2,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

-

-

-

-

GreenTree Electronics

Israel . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Technical Specifications

Power Field Effect Transistors (FET) IPP034NE7N3GXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

640 mJ

Minimum DS Breakdown Voltage:

75 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0034 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP034NE7N3GXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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