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IPD80R1K4CEBTMA1

Infineon Technologies

IPD80R1K4CEBTMA1 by Infineon Technologies

Infineon's IPD80R1K4CEBTMA1 is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for switching applications. Features include 12A pulsed drain current, 170mJ avalanche energy rating, and 1.4 ohm max on-resistance. Suitable for enhancement mode operation in various power electronics systems.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 75 parts In-Stock

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Vyrian

USA . 4,681 parts In-Stock

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Digiode

USA . 18 parts In-Stock

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Prism Electronics

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Modulus Dynamics

Lithuania . 16,044 parts In-Stock

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$0.513

100+ parts

$0.492

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$0.472

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16,044

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Argo Parts USA

USA . 3,110 parts In-Stock

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Continental Prestige Electronics

USA . 201 parts In-Stock

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$1.127

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AZTECH Wire

Italy . 283 parts In-Stock

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$6.007

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Ampacity Inc.

Singapore . 657 parts In-Stock

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$16.050

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Microchip USA

USA . 4,685 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.069

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Corphita

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Perfect Parts

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Overview

Power up your projects with the IPD80R1K4CEBTMA1 from Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for switching applications. The N-CHANNEL configuration and built-in diode make this transistor a versatile choice for a wide range of projects. With a high DS breakdown voltage of 800V and maximum pulsed drain current of 12A, this transistor provides reliable performance when you need it most. Trust Infineon to bring you the best in semiconductor technology for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and cost-effective, making the product easy to handle and install.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher mobility and conductivity compared to P-channel FETs, providing better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better control of current flow and protection against reverse polarity, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient and fast switching operations, suitable for various electronic circuits.

Surface Mount: YES

Surface-mount components save space, enable automated assembly processes, and enhance heat dissipation, making the product ideal for compact designs.

Minimum DS Breakdown Voltage: 800 V

The high breakdown voltage ensures reliable operation in high-voltage applications, providing protection against voltage spikes and surges.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement on circuit boards, improves thermal management, and enhances overall aesthetic appeal of the product.

Terminal Form: GULL WING

Gull wing terminals offer secure soldering connections, mechanical strength, and ease of testing during production, ensuring consistent performance of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have lower on-state resistance and faster switching speeds, making the product energy-efficient and suitable for high-frequency applications.

Maximum Pulsed Drain Current (IDM): 12 A

With a high pulsed drain current rating, the product can handle sudden current spikes without damage, ensuring reliable operation in dynamic loads.

Avalanche Energy Rating (EAS): 170 mJ

The high avalanche energy rating indicates the ability of the FET to withstand voltage transients and surge currents, enhancing the robustness of the product.

No. of Terminals: 2

Having only two terminals simplifies the wiring and connection process, reducing the chances of errors and improving the overall reliability of the product.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, enhances thermal performance, and enables high-density mounting of components, suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high electron mobility, low leakage current, and stable operation over a wide temperature range, enhancing the performance of the product.

Transistor Element Material: SILICON

Silicon-based transistors provide high reliability, low noise, and excellent thermal stability, ensuring long-term performance and durability of the product.

Minimum Operating Temperature: -55 °C

With a wide minimum operating temperature range, the product can function in extreme cold environments, making it suitable for a variety of industrial applications.

Terminal Finish: TIN

Tin terminal finish offers good solderability, corrosion resistance, and electrical conductivity, ensuring reliable connections and long-term performance of the product.

Maximum Drain Current (ID): 3.9 A

The high maximum drain current rating allows the FET to handle continuous current flow without overheating, ensuring stable operation in various load conditions.

Maximum Drain-Source On Resistance: 1.4 ohm

The low on-state resistance minimizes power loss, improves efficiency, and reduces heat generation, making the product suitable for high-power applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures consistent connections, enhancing the overall ease of use and reliability of the product.

Technical Specifications

Power Field Effect Transistors (FET) IPD80R1K4CEBTMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

170 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

3.9 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

12 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD80R1K4CEBTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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