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IPD80R1K0CEBTMA1

Infineon Technologies

IPD80R1K0CEBTMA1 by Infineon Technologies

IPD80R1K0CEBTMA1 by Infineon is a N-CHANNEL FET with 800V DS breakdown voltage, ideal for switching applications. Featuring a built-in diode, it operates in enhancement mode with 18A pulsed drain current and 0.95 ohm on-resistance. This small outline transistor has a max ID of 5.7A and can withstand temperatures as low as -55°C.

Median Price

$0.727

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$0.727

1k+ parts

$0.603

10k+ parts

$0.538

10

-

$0.727

$0.603

$0.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 510 parts In-Stock

1+ parts

$0.566

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$0.566

-

-

-

Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$1.250

100+ parts

-

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-

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-

95

$1.250

-

-

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Vyrian

USA . 5,742 parts In-Stock

1+ parts

-

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5,742

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.510

-

-

-

Corphita

USA . 830 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

-

10k+ parts

-

830

$0.536

-

-

-

Modulus Dynamics

Lithuania . 24,203 parts In-Stock

1+ parts

$0.667

100+ parts

$0.640

1k+ parts

$0.614

10k+ parts

-

24,203

$0.667

$0.640

$0.614

-

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.250

100+ parts

$1.225

1k+ parts

-

10k+ parts

-

500

$1.250

$1.225

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AZTECH Wire

Italy . 754 parts In-Stock

1+ parts

$11.513

100+ parts

-

1k+ parts

-

10k+ parts

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754

$11.513

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-

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Perfect Parts

USA . 2,800 parts In-Stock

1+ parts

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2,800

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Microchip USA

USA . 1,024 parts In-Stock

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1,024

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Overview

Unleash the power of cutting-edge technology with the IPD80R1K0CEBTMA1 by Infineon Technologies. Crafted by a manufacturer known for excellence, this Power Field Effect Transistor (FET) offers unparalleled quality and reliability. Ideal for switching applications, this N-CHANNEL transistor provides a seamless experience with its single configuration and built-in diode. With a high DS breakdown voltage of 800V and maximum drain current of 5.7A, this transistor ensures optimal performance in a compact package. Embrace the future of electronics with the IPD80R1K0CEBTMA1 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting.

Polarity or Channel Type: N-CHANNEL

Efficient for use in applications requiring N-channel transistors, enhancing compatibility and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and helps in reducing additional component costs by including a built-in diode.

Transistor Application: SWITCHING

Ideal for switching applications, ensuring fast and reliable operation in various electronic devices.

Surface Mount: YES

Facilitates easy and secure mounting on PCBs, enabling efficient manufacturing processes.

Minimum DS Breakdown Voltage: 800 V

High breakdown voltage capability ensures the product can handle high voltage applications safely.

Package Shape: RECTANGULAR

Compact rectangular shape allows for efficient use of space on the PCB, making it suitable for compact designs.

Terminal Form: GULL WING

Gull wing terminals offer secure solder connections, enhancing reliability in various operating conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides greater control over the transistor's switching characteristics, improving overall performance.

Maximum Pulsed Drain Current (IDM): 18 A

High pulsed drain current rating ensures the product can handle surges in current without damage, enhancing reliability.

Avalanche Energy Rating (EAS): 230 mJ

High avalanche energy rating ensures the product can withstand energy spikes, improving ruggedness in harsh environments.

No. of Terminals: 2

Simple two-terminal design simplifies circuit connections and reduces complexity in the overall system.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the PCB, enabling miniaturization of electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in various applications, making it a preferred choice.

Transistor Element Material: SILICON

Silicon material provides high performance and reliability, ensuring stable operation under different conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range capability allows the product to operate in harsh environments and extreme temperatures, enhancing versatility.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Maximum Drain Current (ID): 5.7 A

High maximum drain current rating allows the product to handle substantial current loads, ensuring stable operation in demanding applications.

Maximum Drain-Source On Resistance: 0.95 ohm

Low drain-source on resistance minimizes power losses and improves efficiency during switching operations, enhancing overall performance.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and reduces complexity in the design, improving ease of use.

Technical Specifications

Power Field Effect Transistors (FET) IPD80R1K0CEBTMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

230 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (ID):

5.7 A

Maximum Drain-Source On Resistance:

.95 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD80R1K0CEBTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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