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IPD12CN10NGATMA1

Infineon Technologies

IPD12CN10NGATMA1 by Infineon Technologies

IPD12CN10NGATMA1 by Infineon is a N-CHANNEL FET with 100V DS breakdown voltage, 268A IDM, and 0.0124 ohm max RDS(on). Ideal for switching applications, it features a built-in diode in a small outline package with GULL WING terminals. Operating in enhancement mode, it can handle up to 175°C temperature.

Median Price

$1.345

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 95 parts In-Stock

1+ parts

$0.329

100+ parts

$0.318

1k+ parts

-

10k+ parts

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95

$0.329

$0.318

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-

Chip1Stop

Japan . 2,485 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,485

$1.240

-

-

-

Farnell

UK . 3,350 parts In-Stock

1+ parts

$1.430

100+ parts

$0.694

1k+ parts

$0.570

10k+ parts

-

3,350

$1.430

$0.694

$0.570

-

Newark

USA . 3,998 parts In-Stock

1+ parts

$1.840

100+ parts

$0.957

1k+ parts

$0.748

10k+ parts

-

3,998

$1.840

$0.957

$0.748

-

Mouser Electronics

USA . 1,664 parts In-Stock

1+ parts

$1.840

100+ parts

$0.957

1k+ parts

$0.748

10k+ parts

$0.675

1,664

$1.840

$0.957

$0.748

$0.675

Element14

Singapore . 3,350 parts In-Stock

1+ parts

$2.100

100+ parts

$1.150

1k+ parts

-

10k+ parts

-

3,350

$2.100

$1.150

-

-

Rochester

USA . 4,487 parts In-Stock

1+ parts

-

100+ parts

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4,487

-

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-

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Future Electronics

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.845

2,500

-

-

-

$0.845

RS (Exports)

UK . 2,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.345

2,488

-

-

-

$1.345

Verical

USA . 2,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.949

10k+ parts

$0.846

2,262

-

-

$0.949

$0.846

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 975 parts In-Stock

1+ parts

$0.712

100+ parts

-

1k+ parts

-

10k+ parts

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975

$0.712

-

-

-

Nova Conductors

Japan . 19 parts In-Stock

1+ parts

$1.189

100+ parts

-

1k+ parts

-

10k+ parts

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19

$1.189

-

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TME

Poland . 1,506 parts In-Stock

1+ parts

$1.950

100+ parts

$1.010

1k+ parts

$0.960

10k+ parts

-

1,506

$1.950

$1.010

$0.960

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Vyrian

USA . 4,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 26,389 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

-

10k+ parts

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26,389

$0.630

-

-

-

Ampacity Inc.

Singapore . 3,863 parts In-Stock

1+ parts

$0.640

100+ parts

-

1k+ parts

-

10k+ parts

-

3,863

$0.640

-

-

-

Semicontronic

India . 3,697 parts In-Stock

1+ parts

$0.640

100+ parts

$0.624

1k+ parts

$0.621

10k+ parts

-

3,697

$0.640

$0.624

$0.621

-

Corphita

USA . 234 parts In-Stock

1+ parts

$0.675

100+ parts

-

1k+ parts

-

10k+ parts

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234

$0.675

-

-

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Modulus Dynamics

Lithuania . 1,768 parts In-Stock

1+ parts

$0.841

100+ parts

$0.807

1k+ parts

$0.774

10k+ parts

-

1,768

$0.841

$0.807

$0.774

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Corohmni

South Africa . 164 parts In-Stock

1+ parts

$1.186

100+ parts

-

1k+ parts

-

10k+ parts

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164

$1.186

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Continental Prestige Electronics

USA . 4,330 parts In-Stock

1+ parts

$2.280

100+ parts

$1.440

1k+ parts

$0.999

10k+ parts

-

4,330

$2.280

$1.440

$0.999

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Microchip USA

USA . 8,608 parts In-Stock

1+ parts

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8,608

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Perfect Parts

USA . 5,634 parts In-Stock

1+ parts

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100+ parts

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5,634

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Argo Parts USA

USA . 2,835 parts In-Stock

1+ parts

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100+ parts

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2,835

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.165

1k+ parts

$1.130

10k+ parts

$1.106

2,000

-

$1.165

$1.130

$1.106

Overview

Unlock the power of innovation with the IPD12CN10NGATMA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for a wide range of switching applications. With a focus on enhancing performance and reliability, this N-CHANNEL FET offers customers unmatched value and benefits. Experience the superior quality and cutting-edge technology that only Infineon can provide. Elevate your projects to new heights with the IPD12CN10NGATMA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making this FET a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and allows for easy control of current flow, enhancing the overall performance of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers reliable and efficient operation in various switching scenarios.

Surface Mount: YES

Being surface mountable, this FET can be easily integrated onto PCBs, saving space and allowing for high-density mounting.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltages safely, making it suitable for demanding applications.

Maximum Pulsed Drain Current (IDM): 268 A

The high pulsed drain current rating of 268A allows for handling large current spikes, making this FET ideal for power switching applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature of 175°C, this FET can operate in harsh environmental conditions without compromising performance.

Maximum Drain-Source On Resistance: 0.0124 ohm

The low drain-source on resistance of 0.0124 ohm ensures minimal power loss and high efficiency in switching operations.

Technical Specifications

Power Field Effect Transistors (FET) IPD12CN10NGATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

154 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

67 A

Maximum Drain-Source On Resistance:

.0124 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

268 A

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPD12CN10NGATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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