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IPD100N04S4-02

Infineon Technologies

IPD100N04S4-02 by Infineon Technologies

IPD100N04S4-02 by Infineon is a N-channel Power FET with 40V DS breakdown voltage, 400A IDM, and 0.002 ohm RDS(on). It is used in power applications due to its 150W Pdiss, EAS of 440mJ, and single configuration with built-in diode. Operating in enhancement mode at up to 175°C, it features a Gull Wing terminal form for surface mount assembly.

Median Price

$2.380

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,294 parts In-Stock

1+ parts

$2.600

100+ parts

$1.120

1k+ parts

$0.875

10k+ parts

$0.796

5,294

$2.600

$1.120

$0.875

$0.796

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$2.160

1k+ parts

$1.987

10k+ parts

$1.944

2,500

-

$2.160

$1.987

$1.944

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 5,000 parts In-Stock

1+ parts

$1.918

100+ parts

-

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5,000

$1.918

-

-

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Digiode

USA . 426 parts In-Stock

1+ parts

$1.919

100+ parts

-

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426

$1.919

-

-

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Rutronik

Germany . 100,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.928

100,000

-

-

-

$0.928

Cyclops Electronics Ltd

UK . 12,500 parts In-Stock

1+ parts

-

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12,500

-

-

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Vyrian

USA . 3,944 parts In-Stock

1+ parts

-

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3,944

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

1+ parts

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2,500

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Chip Stock

USA . 1,360 parts In-Stock

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1,360

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 19,600 parts In-Stock

1+ parts

$1.139

100+ parts

$1.093

1k+ parts

$1.048

10k+ parts

-

19,600

$1.139

$1.093

$1.048

-

CoreStaff

Japan . 2,500 parts In-Stock

1+ parts

$1.270

100+ parts

$1.033

1k+ parts

$0.990

10k+ parts

-

2,500

$1.270

$1.033

$0.990

-

Corphita

USA . 131 parts In-Stock

1+ parts

$1.818

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131

$1.818

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Ampacity Inc.

Singapore . 3,957 parts In-Stock

1+ parts

$2.680

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3,957

$2.680

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Lixinc

USA . 6,297 parts In-Stock

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6,297

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Argo Parts USA

USA . 3,176 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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A-Z Elektronik GmbH

Germany . 1,931 parts In-Stock

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1,931

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Kepictronics

USA . 1,600 parts In-Stock

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1,600

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Alle Elektronik GmbH

Germany . 1,287 parts In-Stock

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1,287

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Continental Prestige Electronics

USA . 960 parts In-Stock

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960

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Infineon Technologies 20V to 40V N-Channel Automotive MOSFETs are AEC-Q101 qualified for automotive applications, and available in a wide range of package types, including D-PAK, TOLL (HSOF-8),  TOLG (HSOG-8), and SSO8 (TDSON-8). These MOSFETs address broad range of applications, including EPS motor control, 3-phase and H-bridge motors, HVAC fan control, and electric pumps in combination with PWM control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher current-carrying capabilities compared to P-channel FETs, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the power FET, making it ideal for applications where reverse current flow needs to be managed.

Surface Mount: YES

Enables easy and efficient PCB assembly processes, making the power FET suitable for automated manufacturing.

Maximum Pulsed Drain Current (IDM): 400 A

High pulse current rating allows the power FET to handle sudden spikes in current effectively, ensuring reliable performance in transient conditions.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capability enables the FET to handle high power loads without overheating, contributing to its durability and reliability.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, making it suitable for applications where heat dissipation is a concern.

Maximum Drain-Source On Resistance: 0.002 ohm

Low ON-resistance leads to reduced power losses and higher efficiency, making the power FET suitable for high-current applications that require minimal voltage drop.

Technical Specifications

Power Field Effect Transistors (FET) IPD100N04S4-02 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

440 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.002 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IPD100N04S4-02 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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