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IPAN50R500CEXKSA1

Infineon Technologies

IPAN50R500CEXKSA1 by Infineon Technologies

Infineon's IPAN50R500CEXKSA1 is a N-CHANNEL FET with 500V DS breakdown voltage, ideal for switching applications. Featuring a built-in diode, it offers 0.5 ohm RDS(on) and 24A IDM. The transistor operates in enhancement mode and has an EAS of 129mJ, making it suitable for high-power requirements.

Median Price

$1.032

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 389 parts In-Stock

1+ parts

$1.032

100+ parts

$0.670

1k+ parts

$0.461

10k+ parts

$0.456

389

$1.032

$0.670

$0.461

$0.456

Mouser Electronics

USA . 834 parts In-Stock

1+ parts

$1.070

100+ parts

$0.689

1k+ parts

$0.475

10k+ parts

$0.407

834

$1.070

$0.689

$0.475

$0.407

Farnell

UK . 319 parts In-Stock

1+ parts

$1.130

100+ parts

$0.477

1k+ parts

-

10k+ parts

-

319

$1.130

$0.477

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DigiKey

USA . 394 parts In-Stock

1+ parts

$1.520

100+ parts

$0.640

1k+ parts

-

10k+ parts

-

394

$1.520

$0.640

-

-

Rochester

USA . 5,693 parts In-Stock

1+ parts

-

100+ parts

$0.550

1k+ parts

$0.457

10k+ parts

$0.407

5,693

-

$0.550

$0.457

$0.407

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.571

10k+ parts

$0.509

5,000

-

-

$0.571

$0.509

RS (Exports)

UK . 460 parts In-Stock

1+ parts

-

100+ parts

$0.686

1k+ parts

$0.598

10k+ parts

$0.554

460

-

$0.686

$0.598

$0.554

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 339 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

-

339

$0.428

-

-

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Vyrian

USA . 352 parts In-Stock

1+ parts

$0.451

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$0.451

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 978 parts In-Stock

1+ parts

$0.406

100+ parts

-

1k+ parts

-

10k+ parts

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978

$0.406

-

-

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Modulus Dynamics

Lithuania . 13,723 parts In-Stock

1+ parts

$0.686

100+ parts

$0.659

1k+ parts

$0.631

10k+ parts

-

13,723

$0.686

$0.659

$0.631

-

Continental Prestige Electronics

USA . 419 parts In-Stock

1+ parts

$0.966

100+ parts

$0.672

1k+ parts

$0.425

10k+ parts

-

419

$0.966

$0.672

$0.425

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Microchip USA

USA . 8,425 parts In-Stock

1+ parts

$8.125

100+ parts

-

1k+ parts

-

10k+ parts

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8,425

$8.125

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Perfect Parts

USA . 34 parts In-Stock

1+ parts

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100+ parts

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34

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Overview

Unlock the power of innovation with the IPAN50R500CEXKSA1 from Infineon Technologies. Designed for high-performance applications, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled reliability and efficiency. Whether you're in need of a reliable switching solution or looking to enhance your system's performance, this transistor is the perfect choice. With a maximum pulsed drain current of 24 A and a minimum DS breakdown voltage of 500 V, this FET delivers exceptional performance in a compact, easy-to-use package. Trust Infineon Technologies for quality you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and protection for the transistor, making it suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better electrical characteristics and lower resistance compared to P-channel transistors, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient current flow and voltage regulation, making this transistor suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high performance and reliability in controlling electrical loads.

Minimum DS Breakdown Voltage: 500 V

With a minimum breakdown voltage of 500V, this transistor can handle high voltages without breakdown, making it suitable for high-power applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and installation in circuit boards or other devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the switching operation, providing precise and efficient performance in various applications.

Maximum Pulsed Drain Current (IDM): 24 A

High maximum pulsed drain current capability allows this transistor to handle high current spikes without damage, making it suitable for power applications.

Avalanche Energy Rating (EAS): 129 mJ

Good avalanche energy rating ensures that the transistor can handle short duration high-energy pulses, improving overall reliability in harsh conditions.

No. of Terminals: 3

3 terminals provide easy connection and integration into circuits, simplifying the design and assembly process.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure and stable mounting, making this transistor suitable for heavy-duty applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, ensuring optimal performance in various applications.

Transistor Element Material: SILICON

Silicon material for the transistor element provides good thermal conductivity and stability, ensuring consistent performance under varying conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections for the transistor.

Maximum Drain-Source On Resistance: 0.5 ohm

Low drain-source on resistance of 0.5 ohm minimizes power losses and heat generation in the transistor, improving overall efficiency.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making this transistor user-friendly and easy to integrate into circuits.

Case Connection: ISOLATED

Isolated case connection offers better safety and protection, preventing electrical shorts or malfunctions in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) IPAN50R500CEXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

129 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

24 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPAN50R500CEXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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