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IPAN60R650CEXKSA1

Infineon Technologies

IPAN60R650CEXKSA1 by Infineon Technologies

IPAN60R650CEXKSA1 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage, 0.65 ohm max RDS(on), and 19A IDM. Ideal for switching applications due to its single configuration with built-in diode and 133mJ EAS rating. Package style is flange mount with isolated case connection.

Median Price

$1.180

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 15 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$1.080

-

-

-

Newark

USA . 20 parts In-Stock

1+ parts

$1.280

100+ parts

$0.840

1k+ parts

$0.606

10k+ parts

$0.530

20

$1.280

$0.840

$0.606

$0.530

Mouser Electronics

USA . 1,038 parts In-Stock

1+ parts

$1.320

100+ parts

$0.873

1k+ parts

$0.629

10k+ parts

$0.503

1,038

$1.320

$0.873

$0.629

$0.503

Element14

Singapore . 20 parts In-Stock

1+ parts

$1.490

100+ parts

$0.954

1k+ parts

$0.628

10k+ parts

-

20

$1.490

$0.954

$0.628

-

Rochester

USA . 9,191 parts In-Stock

1+ parts

-

100+ parts

$0.593

1k+ parts

$0.492

10k+ parts

$0.439

9,191

-

$0.593

$0.492

$0.439

Verical

USA . 8,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.615

10k+ parts

$0.548

8,500

-

-

$0.615

$0.548

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 930 parts In-Stock

1+ parts

$0.462

100+ parts

-

1k+ parts

-

10k+ parts

-

930

$0.462

-

-

-

Vyrian

USA . 226 parts In-Stock

1+ parts

$0.486

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$0.486

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 838 parts In-Stock

1+ parts

$0.437

100+ parts

-

1k+ parts

-

10k+ parts

-

838

$0.437

-

-

-

Modulus Dynamics

Lithuania . 23,287 parts In-Stock

1+ parts

$0.657

100+ parts

$0.631

1k+ parts

$0.604

10k+ parts

-

23,287

$0.657

$0.631

$0.604

-

Continental Prestige Electronics

USA . 20 parts In-Stock

1+ parts

$1.270

100+ parts

$0.761

1k+ parts

$0.462

10k+ parts

-

20

$1.270

$0.761

$0.462

-

Microchip USA

USA . 4,246 parts In-Stock

1+ parts

$3.380

100+ parts

-

1k+ parts

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10k+ parts

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4,246

$3.380

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iodParts Technologies Inc.

India . 6,800 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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6,800

-

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-

-

Perfect Parts

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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17

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Overview

Unlock the power of innovation with the IPAN60R650CEXKSA1 by Infineon Technologies. Designed with precision and reliability in mind, this N-CHANNEL Power Field Effect Transistor is perfect for a wide range of switching applications. With its high-quality construction and built-in diode, this transistor offers unmatched performance and efficiency. Experience seamless operation and enhanced productivity with this cutting-edge technology. Elevate your projects to new heights with the IPAN60R650CEXKSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the FET, making it suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON-state resistance and higher efficiency compared to P-CHANNEL FETs, making them a popular choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from voltage spikes, enhancing the reliability and performance of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and reliable performance in controlling the flow of current in circuits.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600 V, this FET can withstand high voltage levels, making it ideal for applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection in circuit boards, ensuring stable operation of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high efficiency and fast switching speed, making them suitable for a wide range of applications requiring precise control.

Maximum Pulsed Drain Current (IDM): 19 A

With a high maximum pulsed drain current of 19 A, this FET can handle power surges and peak currents effectively.

Avalanche Energy Rating (EAS): 133 mJ

The high avalanche energy rating of 133 mJ ensures the FET can withstand energy spikes and transient events without damage.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration of the FET into a circuit, simplifying the design process.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides a secure and stable mounting option for the FET in electronic systems.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and performance in FETs, ensuring long-term stability and efficient operation.

Transistor Element Material: SILICON

Silicon is a common and reliable material used in FETs, offering good conduction properties and thermal stability for optimal performance.

Terminal Finish: TIN

Tin terminal finish provides corrosion resistance and good electrical conductivity, ensuring long-term reliability and performance of the FET.

Maximum Drain-Source On Resistance: 0.65 ohm

The low drain-source on resistance of 0.65 ohm minimizes power loss and improves efficiency in the FET during operation.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection of the FET in circuits, reducing complexity and ensuring proper functionality.

Case Connection: ISOLATED

Having an isolated case connection enhances safety and reliability by preventing electrical interference and short circuits in the FET.

Technical Specifications

Power Field Effect Transistors (FET) IPAN60R650CEXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

133 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain-Source On Resistance:

.65 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

19 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPAN60R650CEXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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