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IAUT300N08S5N012ATMA1

Infineon Technologies

IAUT300N08S5N012ATMA1 by Infineon Technologies

Infineon's IAUT300N08S5N012ATMA1 is a N-CHANNEL FET with 80V DS Breakdown Voltage and 1200A IDM. Ideal for power applications, it features a built-in diode, 817mJ EAS rating, and -55 to 175°C operating range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,537 parts In-Stock

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Digiode

USA . 271 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 24 parts In-Stock

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$1.592

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24

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Aztec Data Supply Inc.

USA . 18,711 parts In-Stock

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$1.810

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$1.810

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Modulus Dynamics

Lithuania . 2,069 parts In-Stock

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$1.824

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$1.751

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$1.678

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2,069

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AZTECH Wire

Italy . 216 parts In-Stock

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$6.031

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Microchip USA

USA . 143 parts In-Stock

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$22.107

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Semicontronic

India . 357 parts In-Stock

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$51.050

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$49.774

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$49.518

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Ampacity Inc.

Singapore . 410 parts In-Stock

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$61.050

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Continental Prestige Electronics

USA . 5,123 parts In-Stock

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Argo Parts USA

USA . 2,548 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Corphita

USA . 11 parts In-Stock

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Overview

Unlock unparalleled power and efficiency with the IAUT300N08S5N012ATMA1 by Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Power Field Effect Transistors (FET) that are designed for maximum performance. With a single configuration and built-in diode, this N-CHANNEL transistor offers reliability and versatility for a wide range of applications. From automotive to industrial uses, this product provides exceptional value with its impressive features and specifications. Experience the difference with Infineon's cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL allows for efficient current flow in the specified direction, making this product reliable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and can protect the transistor from reverse currents, enhancing overall system reliability.

Surface Mount: YES

The surface mount capability enables easy installation and space-saving on PCBs, making it suitable for compact designs.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable performance in various operating conditions, ensuring stability and longevity.

Maximum Drain Current (ID): 300 A

The high maximum drain current rating makes this FET suitable for high-power applications, providing ample current handling capacity.

Maximum Drain-Source On Resistance: 0.0012 ohm

The low on-resistance ensures minimal power losses and high efficiency in power conversion applications.

Maximum Power Dissipation (Abs): 375 W

The high power dissipation capability allows for reliable operation at high power levels, suitable for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) IAUT300N08S5N012ATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

817 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

300 A

Maximum Drain-Source On Resistance:

.0012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

130 pF

JESD-30 Code:

R-PSSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1200 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IAUT300N08S5N012ATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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