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IAUT165N08S5N029ATMA2

Infineon Technologies

IAUT165N08S5N029ATMA2 by Infineon Technologies

IAUT165N08S5N029ATMA2 by Infineon is a N-CHANNEL FET with 80V DS Breakdown Voltage, 660A IDM, and 0.0029 ohm RDS(on). It is used in power applications due to its 225mJ EAS rating, AEC-Q101 standard compliance, and operating temperature range of -55 to 175 °C.

Median Price

$3.730

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

$3.730

100+ parts

$2.430

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-

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2,000

$3.730

$2.430

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DigiKey

USA . 3,949 parts In-Stock

1+ parts

$3.740

100+ parts

$1.716

1k+ parts

$1.516

10k+ parts

$1.238

3,949

$3.740

$1.716

$1.516

$1.238

Mouser Electronics

USA . 962 parts In-Stock

1+ parts

$3.740

100+ parts

$1.720

1k+ parts

$1.420

10k+ parts

$1.230

962

$3.740

$1.720

$1.420

$1.230

Element14

Singapore . 1,314 parts In-Stock

1+ parts

$3.940

100+ parts

$2.590

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-

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1,314

$3.940

$2.590

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Newark

USA . 1,314 parts In-Stock

1+ parts

$4.250

100+ parts

$2.230

1k+ parts

$2.030

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1,314

$4.250

$2.230

$2.030

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Rochester

USA . 102,888 parts In-Stock

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-

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$1.240

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$1.110

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$1.040

102,888

-

$1.240

$1.110

$1.040

Verical

USA . 95,443 parts In-Stock

1+ parts

-

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1k+ parts

$1.387

10k+ parts

$1.300

95,443

-

-

$1.387

$1.300

RS (Exports)

UK . 8,000 parts In-Stock

1+ parts

-

100+ parts

$2.940

1k+ parts

$2.526

10k+ parts

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8,000

-

$2.940

$2.526

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Farnell

UK . 1,651 parts In-Stock

1+ parts

-

100+ parts

$1.550

1k+ parts

$1.440

10k+ parts

-

1,651

-

$1.550

$1.440

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 818 parts In-Stock

1+ parts

$1.358

100+ parts

-

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818

$1.358

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.355

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50

$2.355

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Vyrian

USA . 13,306 parts In-Stock

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13,306

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 19,865 parts In-Stock

1+ parts

$0.606

100+ parts

$0.582

1k+ parts

$0.558

10k+ parts

-

19,865

$0.606

$0.582

$0.558

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Corohmni

South Africa . 114 parts In-Stock

1+ parts

$0.817

100+ parts

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114

$0.817

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Aztec Data Supply Inc.

USA . 153 parts In-Stock

1+ parts

$1.152

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153

$1.152

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Ampacity Inc.

Singapore . 23,929 parts In-Stock

1+ parts

$1.220

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23,929

$1.220

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Corphita

USA . 729 parts In-Stock

1+ parts

$1.287

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729

$1.287

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Argo Parts USA

USA . 4,230 parts In-Stock

1+ parts

$2.355

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4,230

$2.355

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.355

100+ parts

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1k+ parts

$2.237

10k+ parts

$2.190

1,000

$2.355

-

$2.237

$2.190

Semicontronic

India . 24,067 parts In-Stock

1+ parts

$2.650

100+ parts

$2.584

1k+ parts

$2.570

10k+ parts

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24,067

$2.650

$2.584

$2.570

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Continental Prestige Electronics

USA . 1,681 parts In-Stock

1+ parts

$3.540

100+ parts

$2.320

1k+ parts

$1.590

10k+ parts

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1,681

$3.540

$2.320

$1.590

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Microchip USA

USA . 2,861 parts In-Stock

1+ parts

$12.725

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$12.725

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Perfect Parts

USA . 11,206 parts In-Stock

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Overview

Discover the power and reliability of Infineon Technologies' IAUT165N08S5N029ATMA2 Power Field Effect Transistor. With a built-in diode and N-CHANNEL configuration, this transistor offers seamless operation and enhanced performance in a variety of applications. From automotive to industrial uses, this product delivers exceptional value with its 80V minimum DS breakdown voltage and 660A maximum pulsed drain current. Trust in the quality and expertise of Infineon Technologies to bring you cutting-edge technology that exceeds expectations. Elevate your projects with the IAUT165N08S5N029ATMA2 and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer high efficiency and superior performance compared to other channel types.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances overall functionality.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient installation on circuit boards.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design and ease of integration into various applications.

Terminal Form: FLAT

The flat terminal form facilitates secure and stable connections for optimal performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control and efficient power management.

Maximum Pulsed Drain Current (IDM): 660 A

The high pulsed drain current rating enables handling of heavy loads and power surges.

Avalanche Energy Rating (EAS): 225 mJ

The high avalanche energy rating ensures protection against sudden voltage spikes and overloads.

No. of Terminals: 8

Eight terminals enable versatile connectivity options for different circuit configurations.

Maximum Power Dissipation (Abs): 167 W

The high power dissipation rating allows for reliable performance under demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and facilitates efficient circuit board layout.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high switching speeds and low ON resistance for superior performance.

Maximum Operating Temperature: 175 °C

The high operating temperature range ensures reliability in extreme environments.

Transistor Element Material: SILICON

Silicon material offers excellent thermal conductivity and reliability for long-term use.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures long-term reliability.

Maximum Drain Current (ID): 165 A

The high drain current rating enables efficient power handling and performance.

Maximum Drain-Source On Resistance: 0.0029 ohm

The low ON resistance minimizes power loss and improves efficiency.

Terminal Position: SINGLE

The single terminal position simplifies installation and connectivity for ease of use.

Case Connection: DRAIN

The drain case connection enhances thermal performance and reliability.

Maximum Feedback Capacitance (Crss): 54 pF

The low feedback capacitance minimizes signal distortion and improves performance.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) IAUT165N08S5N029ATMA2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

225 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (ID):

165 A

Maximum Drain-Source On Resistance:

.0029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

54 pF

JESD-30 Code:

R-PSSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

660 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

IAUT165N08S5N029ATMA2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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