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CY62128ELL-45ZXI

Infineon Technologies

CY62128ELL-45ZXI by Infineon Technologies

Infineon's CY62128ELL-45ZXI is a 128Kx8 SRAM with 45ns access time, operating at 5V. It features asynchronous mode, common I/O type, and 3-state output characteristics. Ideal for industrial applications requiring fast and reliable memory storage in a compact small outline package.

Median Price

$1.846

Lifecycle Status

Suppliers In-Stock

43

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 6,332 parts In-Stock

1+ parts

$1.812

100+ parts

$1.435

1k+ parts

$1.247

10k+ parts

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6,332

$1.812

$1.435

$1.247

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Chip1Stop

Japan . 1,150 parts In-Stock

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$1.880

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$1.880

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Newark

USA . 68 parts In-Stock

1+ parts

$2.430

100+ parts

$2.010

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68

$2.430

$2.010

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Mouser Electronics

USA . 1,543 parts In-Stock

1+ parts

$2.870

100+ parts

$2.480

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$2.310

10k+ parts

$2.230

1,543

$2.870

$2.480

$2.310

$2.230

Farnell

UK . 518 parts In-Stock

1+ parts

$2.880

100+ parts

$1.980

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$1.960

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518

$2.880

$1.980

$1.960

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Element14

Singapore . 518 parts In-Stock

1+ parts

$4.630

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$3.660

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$3.290

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518

$4.630

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$3.290

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Rochester

USA . 79,976 parts In-Stock

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$1.370

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$1.220

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$1.150

79,976

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$1.220

$1.150

DigiKey

USA . 70,616 parts In-Stock

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$1.800

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Flip Electronics (Authorized)

USA . 57,481 parts In-Stock

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Verical

USA . 34,519 parts In-Stock

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$1.438

34,519

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Avnet

USA . 1,337 parts In-Stock

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$1.201

1,337

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Future Electronics

Canada . 1,215 parts In-Stock

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$1.230

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$1.190

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RS (Exports)

UK . 27 parts In-Stock

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$2.930

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$2.724

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27

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$2.930

$2.724

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Distributors (In-Stock)

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Freelance Electronics

USA . 1 parts In-Stock

1+ parts

$0.700

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1

$0.700

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Digiode

USA . 15 parts In-Stock

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$1.302

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$1.302

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TME

Poland . 514 parts In-Stock

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$1.480

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514

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DF Sales Co.

USA . 312 parts In-Stock

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$1.600

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312

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DF Sales Co.

USA . 312 parts In-Stock

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312

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Nova Conductors

Japan . 50 parts In-Stock

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$2.210

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50

$2.210

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Ozdisan Elektronik

Türkiye . 306 parts In-Stock

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$3.374

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DigiKey Marketplace

USA . 79,847 parts In-Stock

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Flip Electronics

USA . 34,036 parts In-Stock

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Vyrian

USA . 14,193 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,973 parts In-Stock

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Chip Stock

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R&J Components

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IBS Electronics

USA . 2,263 parts In-Stock

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$1.725

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$1.388

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Rutronik

Germany . 1,560 parts In-Stock

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North Shore Components

USA . 659 parts In-Stock

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Speed Components Ltd

Israel . 271 parts In-Stock

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Standard Data Resources

USA . 140 parts In-Stock

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J2 Sourcing AB

Sweden . 102 parts In-Stock

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Schukat

Germany . 102 parts In-Stock

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$1.193

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$1.138

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A2Z Electronics, Inc.

USA . 100 parts In-Stock

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100

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ECAB

Sweden . 86 parts In-Stock

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A&K Electronics

USA . 69 parts In-Stock

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Rotakorn

Sweden . 69 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 61 parts In-Stock

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ComSIT Distribution GmbH

Germany . 53 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Huijzer Components

Netherlands . 10 parts In-Stock

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Sea View Technologies

USA . 8 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,143 parts In-Stock

1+ parts

$1.160

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14,143

$1.160

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Corphita

USA . 841 parts In-Stock

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$1.233

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841

$1.233

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Continental Prestige Electronics

USA . 1,115 parts In-Stock

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$1.360

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$1.360

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Component Stockers USA

USA . 13,589 parts In-Stock

1+ parts

$1.620

100+ parts

$1.350

1k+ parts

$1.250

10k+ parts

$1.810

13,589

$1.620

$1.350

$1.250

$1.810

Argo Parts USA

USA . 2,829 parts In-Stock

1+ parts

$2.210

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2,829

$2.210

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Netroflash

USA . 2,000 parts In-Stock

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$2.210

100+ parts

$2.166

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$2.210

$2.166

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Modulus Dynamics

Lithuania . 2,423 parts In-Stock

1+ parts

$4.435

100+ parts

$4.258

1k+ parts

$4.080

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2,423

$4.435

$4.258

$4.080

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Microchip USA

USA . 2,028 parts In-Stock

1+ parts

$12.935

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2,028

$12.935

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Perfect Parts

USA . 11,745 parts In-Stock

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Lixinc

USA . 11,661 parts In-Stock

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Epart123

USA . 7,800 parts In-Stock

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$2.840

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$2.840

Kepictronics

USA . 6,088 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,773 parts In-Stock

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Assy Fe

Spain . 4,205 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,340 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,560 parts In-Stock

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1,560

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Metaverse IC Inc.

Canada . 1,248 parts In-Stock

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iodParts Technologies Inc.

India . 685 parts In-Stock

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685

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Authorized Procurement Solutions

USA . 496 parts In-Stock

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496

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GreenTree Electronics

Israel . 496 parts In-Stock

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496

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Cyclops Electronics Ltd (Excess)

UK . 192 parts In-Stock

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192

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Allen Electronics Distributors

USA . 52 parts In-Stock

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$2.274

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52

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$2.274

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Computer Components Inc. - USA

USA . 10 parts In-Stock

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10

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Overview

Unlock unparalleled performance and reliability with the CY62128ELL-45ZXI from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality SRAM memory solutions perfect for a wide range of applications. With a focus on innovation and cutting-edge technology, this product offers customers unmatched value and benefits. Experience seamless operation and enhanced efficiency with the CY62128ELL-45ZXI, setting new standards in memory excellence. Elevate your projects to new heights with Infineon Technologies.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and lightweight construction, making it a reliable choice.

Surface Mount:

YES - The surface mount capability allows for easy installation and space-saving design.

Package Shape:

RECTANGULAR - The rectangular shape offers a compact form factor for efficient PCB layout.

Operating Mode:

ASYNCHRONOUS - Asynchronous operation allows for flexible and independent data transfers.

Input/Output Type:

COMMON - This common input/output type simplifies circuit design and integration.

Nominal Supply Voltage / Vsup (V):

5 - Operates at a standard 5V supply voltage for compatibility with most systems.

Power Supplies (V):

5 - This power supply requirement ensures consistent and reliable performance.

No. of Terminals:

32 - With 32 terminals, this SRAM offers sufficient connectivity options for various applications.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE - The small outline and thin profile design save space on the PCB.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this SRAM is suitable for industrial environments.

Organization:

128KX8 - Organized in a 128Kx8 configuration, providing ample memory capacity for data storage.

Output Characteristics:

3-STATE - The 3-state output characteristics allow for tri-state switching for increased flexibility.

Minimum Standby Voltage:

2 V - This low standby voltage ensures energy efficiency during standby mode.

Minimum Operating Temperature:

40 °C - The wide operating temperature range makes this SRAM suitable for harsh environments.

Terminal Finish:

MATTE TIN - The matte tin finish provides corrosion resistance for long-term reliability.

Terminal Position:

DUAL - The dual terminal position offers flexibility in board mounting options.

Maximum Seated Height:

1.2 mm - With a low seated height, this SRAM saves space in compact designs.

Width:

8 mm - The narrow width allows for efficient use of board real estate.

Minimum Supply Voltage (Vsup):

4.5 V - Can operate at a minimum supply voltage of 4.5V, ensuring reliability even in fluctuating power conditions.

Technical Specifications

SRAM CY62128ELL-45ZXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000004 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

16 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

8 mm

Trade Compliance

CY62128ELL-45ZXI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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