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CY15E016Q-SXE

Infineon Technologies

CY15E016Q-SXE by Infineon Technologies

CY15E016Q-SXE by Infineon Technologies is a FRAM with 2KX8 organization, operating at 16 MHz clock frequency. It offers 10000000000000 write/erase cycles endurance and uses SPI serial bus type for applications requiring high-speed data storage in automotive electronics.

Median Price

$1.690

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 917 parts In-Stock

1+ parts

$1.430

100+ parts

$1.430

1k+ parts

$1.430

10k+ parts

-

917

$1.430

$1.430

$1.430

-

Chip1Stop

Japan . 685 parts In-Stock

1+ parts

$1.950

100+ parts

$1.590

1k+ parts

$1.450

10k+ parts

$1.250

685

$1.950

$1.590

$1.450

$1.250

DigiKey

USA . 1,672 parts In-Stock

1+ parts

$2.080

100+ parts

$1.806

1k+ parts

$1.696

10k+ parts

$1.567

1,672

$2.080

$1.806

$1.696

$1.567

Mouser Electronics

USA . 934 parts In-Stock

1+ parts

$2.080

100+ parts

$1.770

1k+ parts

$1.650

10k+ parts

$1.430

934

$2.080

$1.770

$1.650

$1.430

Flip Electronics (Authorized)

USA . 907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

907

-

-

-

-

Verical

USA . 685 parts In-Stock

1+ parts

-

100+ parts

$1.110

1k+ parts

-

10k+ parts

-

685

-

$1.110

-

-

Rochester

USA . 199 parts In-Stock

1+ parts

-

100+ parts

$1.300

1k+ parts

$1.160

10k+ parts

$1.100

199

-

$1.300

$1.160

$1.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 982 parts In-Stock

1+ parts

$1.036

100+ parts

-

1k+ parts

-

10k+ parts

-

982

$1.036

-

-

-

Vyrian

USA . 952 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

-

10k+ parts

-

952

$1.080

-

-

-

Flip Electronics

USA . 907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

907

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 14 parts In-Stock

1+ parts

$0.075

100+ parts

-

1k+ parts

-

10k+ parts

$0.072

14

$0.075

-

-

$0.072

Northwest PG Solutions

USA . 1,927 parts In-Stock

1+ parts

$0.083

100+ parts

-

1k+ parts

-

10k+ parts

$0.073

1,927

$0.083

-

-

$0.073

Corphita

USA . 766 parts In-Stock

1+ parts

$0.981

100+ parts

-

1k+ parts

-

10k+ parts

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766

$0.981

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,523 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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28,523

-

-

-

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,000

-

-

-

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A-Z Elektronik GmbH

Germany . 4,842 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,842

-

-

-

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Alle Elektronik GmbH

Germany . 3,228 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,228

-

-

-

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Perfect Parts

USA . 1,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,630

-

-

-

-

Overview

Unlock the power of reliable data storage with the CY15E016Q-SXE by Infineon Technologies. As a leading manufacturer in the field, Infineon delivers top-quality FRAMs that are perfect for a wide range of applications. With its durable plastic/epoxy body and AEC-Q100 screening level, this device ensures exceptional performance in even the harshest conditions. The synchronous operating mode and high clock frequency of 16 MHz make it ideal for demanding tasks. Trust Infineon to provide you with a solution that offers unparalleled value, benefits, and advantages, setting you up for success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the FRAM chip, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration of the FRAM chip onto circuit boards, saving space and simplifying assembly.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high quality and reliability, making this FRAM chip suitable for automotive applications where stringent standards are required.

Operating Mode: SYNCHRONOUS

The synchronous operating mode enables faster data transfer and communication, enhancing the overall performance of the FRAM chip in a system.

Nominal Supply Voltage: 5V

The 5V supply voltage provides sufficient power for the FRAM chip to operate efficiently across a wide range of applications.

Memory Density: 16384 bit

With a high memory density of 16384 bits, this FRAM chip offers ample storage capacity for data and programs, making it ideal for applications requiring large amounts of memory.

Technical Specifications

FRAMs CY15E016Q-SXE attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

16 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00003 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15E016Q-SXE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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