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CY15B004J-SXE

Infineon Technologies

CY15B004J-SXE by Infineon Technologies

Infineon's CY15B004J-SXE FRAM features 512x8 organization, operates synchronously at 1MHz with 3.3V supply voltage. Ideal for automotive applications due to AEC-Q100 screening, it offers 10000000000000 write/erase cycles and I2C serial bus interface.

Median Price

$1.587

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 359 parts In-Stock

1+ parts

$1.110

100+ parts

$1.050

1k+ parts

$1.010

10k+ parts

-

359

$1.110

$1.050

$1.010

-

Chip1Stop

Japan . 485 parts In-Stock

1+ parts

$1.520

100+ parts

$1.160

1k+ parts

$1.100

10k+ parts

-

485

$1.520

$1.160

$1.100

-

DigiKey

USA . 496 parts In-Stock

1+ parts

$1.810

100+ parts

$1.572

1k+ parts

$1.477

10k+ parts

$1.365

496

$1.810

$1.572

$1.477

$1.365

Mouser Electronics

USA . 412 parts In-Stock

1+ parts

$2.050

100+ parts

$1.560

1k+ parts

$1.420

10k+ parts

$1.310

412

$2.050

$1.560

$1.420

$1.310

Newark

USA . 402 parts In-Stock

1+ parts

$2.050

100+ parts

$1.560

1k+ parts

$1.520

10k+ parts

-

402

$2.050

$1.560

$1.520

-

Rochester

USA . 7,991 parts In-Stock

1+ parts

-

100+ parts

$1.340

1k+ parts

$1.200

10k+ parts

$1.130

7,991

-

$1.340

$1.200

$1.130

Verical

USA . 1,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.587

10k+ parts

$1.413

1,972

-

-

$1.587

$1.413

Flip Electronics (Authorized)

USA . 910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

910

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 893 parts In-Stock

1+ parts

$0.978

100+ parts

-

1k+ parts

-

10k+ parts

-

893

$0.978

-

-

-

Vyrian

USA . 484 parts In-Stock

1+ parts

$1.030

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$1.030

-

-

-

Flip Electronics

USA . 910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

910

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 205 parts In-Stock

1+ parts

$0.927

100+ parts

-

1k+ parts

-

10k+ parts

-

205

$0.927

-

-

-

Component Stockers USA

USA . 579 parts In-Stock

1+ parts

$1.920

100+ parts

$1.520

1k+ parts

-

10k+ parts

-

579

$1.920

$1.520

-

-

Native Components

USA . 717 parts In-Stock

1+ parts

$9.500

100+ parts

-

1k+ parts

-

10k+ parts

-

717

$9.500

-

-

-

Northwest PG Solutions

USA . 1,775 parts In-Stock

1+ parts

$10.450

100+ parts

$9.405

1k+ parts

-

10k+ parts

-

1,775

$10.450

$9.405

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unlock unparalleled efficiency and reliability with the CY15B004J-SXE by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality FRAMs for various applications. This product offers customers a seamless experience with its innovative features like synchronous operation, hardware write protection, and low standby voltage. With a staggering endurance of 10^13 write/erase cycles, this FRAM ensures long-lasting performance and data retention. Elevate your projects with the CY15B004J-SXE and experience the exceptional value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FRAM, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS

Enables efficient and synchronized data transfer, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common voltage levels used in electronic devices, making integration seamless.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, ensuring reliable operation in harsh environmental conditions.

Technology: CMOS

Uses low power consumption CMOS technology, extending battery life in portable devices.

Memory IC Type: FRAM

Utilizes Ferroelectric RAM technology for fast read/write speeds, high endurance, and low power consumption.

Technical Specifications

FRAMs CY15B004J-SXE attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

.34 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE

Trade Compliance

CY15B004J-SXE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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