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C167SRLMHABXUMA1

Infineon Technologies

C167SRLMHABXUMA1 by Infineon Technologies

Infineon's C167SRLMHABXUMA1 microcontroller features 16-bit architecture, 24-bit address bus, and 16-bit external data bus. Ideal for applications requiring a max clock frequency of 25 MHz, such as automotive control systems and industrial automation.

Median Price

$16.417

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 71 parts In-Stock

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$16.417

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Vyrian

USA . 10,024 parts In-Stock

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Digiode

USA . 661 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 576 parts In-Stock

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$5.569

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576

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Netroflash

USA . 100 parts In-Stock

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$16.417

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$15.596

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$15.268

100

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$15.268

Ampacity Inc.

Singapore . 381 parts In-Stock

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$22.000

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381

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Modulus Dynamics

Lithuania . 3,636 parts In-Stock

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$50.301

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$48.289

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$46.277

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3,636

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Microchip USA

USA . 2,935 parts In-Stock

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Perfect Parts

USA . 829 parts In-Stock

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Corphita

USA . 76 parts In-Stock

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Overview

Experience the next level of performance and reliability with the C167SRLMHABXUMA1 microcontroller by Infineon Technologies. Crafted with precision and expertise, this powerful device offers unparalleled quality and versatility for a wide range of applications. Whether you're looking to enhance your automotive systems, industrial controls, or consumer electronics, this microcontroller delivers exceptional value and efficiency. Trust in the superior design and cutting-edge technology of Infineon to take your projects to new heights. Elevate your creations with the C167SRLMHABXUMA1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for various applications.

Surface Mount: YES

This allows for easy and efficient installation on circuit boards, saving space and time.

Maximum Supply Voltage: 5.5 V

With a high supply voltage, this microcontroller can handle a wide range of power sources.

Address Bus Width: 24

The large address bus width allows for efficient memory access and processing capabilities.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of handling during assembly.

Bit Size: 16

The 16-bit size allows for fast and precise data processing, enhancing overall performance.

No. of Terminals: 144

With a high number of terminals, this microcontroller can support complex circuit connections.

Package Style: FLATPACK

The flatpack style offers a compact and efficient design for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

The high operating temperature range makes this microcontroller suitable for demanding environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this microcontroller can be used in various climates.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the conversion of analog signals to digital data.

Terminal Position: QUAD

The quad terminal position offers stability and efficient connectivity for integrated circuits.

Maximum Seated Height: 2.75 mm

The low seated height allows for compact and slim designs in electronic applications.

Width: 28 mm

The moderate width provides a balance between space-saving and ease of handling during installation.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data transfer and processing.

Maximum Clock Frequency: 25 MHz

With a high clock frequency, this microcontroller can handle fast computational tasks.

Length: 28 mm

The moderate length of the microcontroller offers a balanced design for various applications.

Temperature Grade: COMMERCIAL

This microcontroller is suitable for commercial applications with standard temperature requirements.

Peripheral IC Type: MICROCONTROLLER

The microcontroller type offers versatility and programmability for different applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures compatibility with standard power sources for easy integration.

PWM Channels: YES

The presence of Pulse-Width Modulation channels allows for precise control of outputs such as motors and LEDs.

Terminal Pitch: 0.65 mm

The small terminal pitch enables compact circuit designs and efficient connectivity.

Speed: 25 rpm

With a speed of 25 rotations per minute, this microcontroller is suitable for applications requiring precise timing control.

No. of I/O Lines: 111

The high number of Input/Output lines provides versatility and connectivity options for interfacing with other devices.

Technical Specifications

Microcontrollers C167SRLMHABXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.75 mm

Speed:

25 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Trade Compliance

C167SRLMHABXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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