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C167CRLMHAKXQLA1

Infineon Technologies

C167CRLMHAKXQLA1 by Infineon Technologies

The Infineon Technologies C167CRLMHAKXQLA1 microcontroller features 16-bit size, 24-bit address bus width, and operates at a max clock frequency of 25 MHz. Ideal for automotive applications, this CMOS technology-based microcontroller offers 111 I/O lines and PWM channels for versatile functionality in a compact flatpack package style.

Median Price

$14.912

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 99 parts In-Stock

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$14.912

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99

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Vyrian

USA . 3,460 parts In-Stock

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3,460

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Digiode

USA . 302 parts In-Stock

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302

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Distributors (Availability)

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AZTECH Wire

Italy . 652 parts In-Stock

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$13.455

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652

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Continental Prestige Electronics

USA . 6,409 parts In-Stock

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$14.912

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$14.614

6,409

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$14.614

Netroflash

USA . 1,000 parts In-Stock

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$14.912

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$14.166

10k+ parts

$13.868

1,000

$14.912

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$14.166

$13.868

Semicontronic

India . 1,363 parts In-Stock

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$29.000

100+ parts

$28.275

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$28.130

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1,363

$29.000

$28.275

$28.130

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Ampacity Inc.

Singapore . 894 parts In-Stock

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$34.000

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Aztec Data Supply Inc.

USA . 3,020 parts In-Stock

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$59.170

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Modulus Dynamics

Lithuania . 3,876 parts In-Stock

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$60.074

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$57.671

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$55.268

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Corohmni

South Africa . 156 parts In-Stock

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$81.128

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Argo Parts USA

USA . 4,357 parts In-Stock

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Microchip USA

USA . 1,029 parts In-Stock

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Perfect Parts

USA . 735 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the C167CRLMHAKXQLA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality microcontrollers that are versatile and reliable. From automotive applications to industrial automation, this product offers unmatched performance and precision. With features like multiple ADC channels and PWM capabilities, customers can experience seamless integration and enhanced functionality. Elevate your projects with the C167CRLMHAKXQLA1 and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of systems.

Address Bus Width: 24

The wide address bus width allows for efficient memory addressing and data transfer capabilities.

Package Shape: SQUARE

The square package shape makes the product easy to handle and integrate into circuit designs.

Bit Size: 16

The 16-bit architecture allows for fast and efficient processing of data and instructions.

No. of Terminals: 144

The high number of terminals provides ample connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK

The flatpack style provides a compact and space-saving design for efficient PCB layout and development.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures optimal performance and power efficiency in various operating conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes the product suitable for demanding industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing and conversion, expanding the product's application range.

Terminal Position: QUAD

The quad terminal position offers easy soldering and secure connections for stable operation.

Maximum Seated Height: 2.75 mm

The low maximum seated height allows for slim and compact device designs.

Width: 28 mm

The compact width makes the product suitable for space-constrained applications.

External Data Bus Width: 16

The 16-bit external data bus width enables efficient data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency provides fast processing and response times for real-time applications.

Length: 28 mm

The compact length allows for versatile mounting options in different device designs.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable performance in harsh environmental conditions typically found in automotive applications.

Peripheral IC Type: MICROCONTROLLER

The peripheral IC type indicates that the product is a versatile microcontroller suitable for a wide range of embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability for secure PCB mounting.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures compatibility with standard power sources and voltage levels.

PWM Channels: YES

The presence of PWM channels allows for precise control of output signals and motor speed regulation.

Terminal Pitch: 0.65 mm

The small terminal pitch facilitates high-density mounting and compact PCB designs.

Speed: 25 rpm

The high speed capability enables fast and responsive performance in time-critical applications.

No. of I/O Lines: 111

The abundant I/O lines provide extensive connectivity options for interfacing with sensors, actuators, and other peripheral devices.

Technical Specifications

Microcontrollers C167CRLMHAKXQLA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.75 mm

Speed:

25 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

C167CRLMHAKXQLA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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