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C167CRL33MHAKXQLA1

Infineon Technologies

C167CRL33MHAKXQLA1 by Infineon Technologies

Infineon's C167CRL33MHAKXQLA1 microcontroller features 16-bit size, 33 MHz clock frequency, and 24-bit address bus width. Ideal for automotive applications due to its CMOS technology, with PWM channels and ADC support for versatile I/O control in a compact flatpack package.

Median Price

$15.384

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$15.384

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50

$15.384

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Vyrian

USA . 4,356 parts In-Stock

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4,356

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Digiode

USA . 732 parts In-Stock

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732

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Distributors (Availability)

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AZTECH Wire

Italy . 571 parts In-Stock

1+ parts

$11.103

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571

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Continental Prestige Electronics

USA . 4,777 parts In-Stock

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$15.384

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$15.076

4,777

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$15.076

Netroflash

USA . 100 parts In-Stock

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$15.384

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100

$15.384

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Semicontronic

India . 791 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

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791

$27.000

$26.325

$26.190

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Ampacity Inc.

Singapore . 1,468 parts In-Stock

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$32.000

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1,468

$32.000

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Modulus Dynamics

Lithuania . 1,113 parts In-Stock

1+ parts

$75.684

100+ parts

$72.657

1k+ parts

$69.629

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1,113

$75.684

$72.657

$69.629

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Microchip USA

USA . 2,176 parts In-Stock

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Argo Parts USA

USA . 1,861 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 383 parts In-Stock

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383

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Corphita

USA . 182 parts In-Stock

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Overview

Unlock the power of innovation with the C167CRL33MHAKXQLA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon's microcontrollers are designed for optimal performance and reliability. This versatile device is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're looking to enhance automotive systems or implement advanced control algorithms, the C167CRL33MHAKXQLA1 delivers top-notch quality and efficiency. Upgrade your projects today with this cutting-edge microcontroller!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility for various application environments.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 5.5 V

Allows for a higher input voltage range.

Address Bus Width: 24

Allows for more memory addressability.

Package Shape: SQUARE

Efficient use of space and easy mounting.

Bit Size: 16

Offers moderate processing power.

No. of Terminals: 144

Provides a wide range of connectivity options.

Package Style (Meter): FLATPACK

Saves space and enhances heat dissipation.

Minimum Supply Voltage: 4.5 V

Ensures the device can operate at lower voltages.

Maximum Operating Temperature: 125 °C

Suitable for use in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions.

Terminal Finish: MATTE TIN

Provides good electrical conductivity and corrosion resistance.

ADC Channels: YES

Allows for analog-to-digital conversion for sensor interfacing.

Terminal Position: QUAD

Facilitates easy PCB layout and soldering.

Maximum Seated Height: 2.75 mm

Low profile design for compact devices.

Width: 28 mm

Compact form factor for space-constrained applications.

External Data Bus Width: 16

Efficient data transfer capabilities.

Maximum Clock Frequency: 33 MHz

Offers high-speed processing capabilities.

Length: 28 mm

Compact size for small footprint designs.

Temperature Grade: AUTOMOTIVE

Designed to operate in automotive temperature ranges.

Peripheral IC Type: MICROCONTROLLER

Integrated peripherals for versatile functionality.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: GULL WING

Ease of soldering and rework.

Nominal Supply Voltage: 5 V

Standard voltage input for compatibility.

PWM Channels: YES

Supports pulse-width modulation for precise control.

Terminal Pitch: 0.65 mm

Fine pitch for high-density PCB designs.

Speed: 33 rpm

Moderate processing speed for various applications.

No. of I/O Lines: 111

Provides a sufficient number of input/output options.

Technical Specifications

Microcontrollers C167CRL33MHAKXQLA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

33 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

2.75 mm

Speed:

33 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

C167CRL33MHAKXQLA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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