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C167CSL40MCAKXQLA1

Infineon Technologies

C167CSL40MCAKXQLA1 by Infineon Technologies

The Infineon C167CSL40MCAKXQLA1 microcontroller features a 16-bit architecture, 24-bit address bus width, and operates at up to 50 MHz clock frequency. Ideal for automotive applications, it offers 111 I/O lines, PWM channels, and ADC channels for versatile system integration in a compact flatpack package.

Median Price

$17.470

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 7 parts In-Stock

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Rochester

USA . 7 parts In-Stock

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$17.470

1k+ parts

$15.630

10k+ parts

$14.710

7

-

$17.470

$15.630

$14.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 83 parts In-Stock

1+ parts

$18.487

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83

$18.487

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Nova Conductors

Japan . 10 parts In-Stock

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$21.496

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10

$21.496

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Vyrian

USA . 8,612 parts In-Stock

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Chip Stock

USA . 132 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$7.716

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574

$7.716

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$16.540

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7

$16.540

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Semicontronic

India . 7 parts In-Stock

1+ parts

$16.540

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$16.126

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$16.044

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$16.540

$16.126

$16.044

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Corphita

USA . 341 parts In-Stock

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$17.514

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341

$17.514

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Continental Prestige Electronics

USA . 5,077 parts In-Stock

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$21.496

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$21.066

5,077

$21.496

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$21.066

Netroflash

USA . 2,000 parts In-Stock

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$21.496

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$21.496

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Corohmni

South Africa . 7 parts In-Stock

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$30.863

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$71.060

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$67.507

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$67.507

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$71.060

$67.507

$67.507

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Aztec Data Supply Inc.

USA . 1,591 parts In-Stock

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$76.110

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$76.110

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Modulus Dynamics

Lithuania . 4,754 parts In-Stock

1+ parts

$85.410

100+ parts

$81.994

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$78.577

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4,754

$85.410

$81.994

$78.577

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Argo Parts USA

USA . 3,610 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 2,408 parts In-Stock

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Perfect Parts

USA . 96 parts In-Stock

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Overview

Unleash the power of innovation with the C167CSL40MCAKXQLA1 by Infineon Technologies. As a top-tier manufacturer in the industry, Infineon Technologies has crafted a high-quality microcontroller that offers unmatched performance and reliability. Ideal for automotive applications, this microcontroller boasts a wide range of features, including PWM channels and ADC channels, making it perfect for a variety of projects. Elevate your designs with the C167CSL40MCAKXQLA1 and experience the value and benefits it brings to your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving space and improving overall design flexibility.

Maximum Supply Voltage: 5.5 V

Can handle higher voltages, providing flexibility and compatibility with various power supply systems.

Address Bus Width: 24

Wide address bus allows for efficient memory access and data processing capabilities.

Package Shape: SQUARE

Square shape can optimize space utilization on the circuit board and improve overall design aesthetics.

Bit Size: 16

16-bit architecture enables the microcontroller to process data and instructions with greater precision compared to lower bit sizes.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and flexibility in interfacing with external components.

Package Style: FLATPACK

Flatpack design offers easy handling and installation, making it suitable for automated assembly processes.

Minimum Supply Voltage: 4.5 V

Can operate at lower voltages, enhancing energy efficiency and enabling use in battery-powered applications.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in harsh environments or under heavy load conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the microcontroller to function in extreme cold conditions, ensuring versatility in various applications.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and solderability, ensuring long-term reliability and performance.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making the microcontroller suitable for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal position offers easy access and connectivity options, simplifying the integration of external components.

Maximum Seated Height: 4.1 mm

Low seated height allows for compact and slim designs, ideal for space-constrained applications.

Width: 28 mm

Compact width enables the microcontroller to fit into smaller spaces, making it suitable for compact electronic devices.

External Data Bus Width: 16

16-bit external data bus width allows for efficient data transfer and processing capabilities.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast data processing and real-time operation, enhancing overall performance.

Length: 28 mm

Compact length allows for easy integration into small form factor devices, facilitating design flexibility.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications subject to wide temperature variations.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral ICs offer enhanced functionality and capabilities, making the microcontroller suitable for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and excellent noise immunity, making it suitable for energy-efficient and reliable designs.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder connections and easy manual or automated soldering, ensuring robust and secure connectivity.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power supply systems.

PWM Channels: YES

Integrated PWM channels enable precise control of analog outputs, making the microcontroller suitable for motor control and power management applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for high-density integration and space-saving design, ideal for compact and miniaturized electronic devices.

Speed: 40 rpm

High-speed operation enables rapid data processing and real-time control, enhancing overall system performance.

No. of I/O Lines: 111

Abundance of I/O lines offers versatile connectivity options for interfacing with external sensors, actuators, and components, enhancing system flexibility and functionality.

Technical Specifications

Microcontrollers C167CSL40MCAKXQLA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

4.1 mm

Speed:

40 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

C167CSL40MCAKXQLA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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