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C167CSL33MCAKXUMA2

Infineon Technologies

C167CSL33MCAKXUMA2 by Infineon Technologies

The Infineon Technologies C167CSL33MCAKXUMA2 microcontroller features a 16-bit architecture, 24-bit address bus width, and operates at a max clock frequency of 40 MHz. Ideal for automotive applications, it offers peripherals like RTC, TIMER(5), WDT, and connectivity options including CAN(2), SPI, USART.

Median Price

$51.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$51.400

1k+ parts

$45.990

10k+ parts

$43.290

600

-

$51.400

$45.990

$43.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,681 parts In-Stock

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8,681

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Digiode

USA . 934 parts In-Stock

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934

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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Semicontronic

India . 373 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

373

$3.000

$2.925

$2.910

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AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$18.473

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391

$18.473

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Ampacity Inc.

Singapore . 605 parts In-Stock

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$33.000

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605

$33.000

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Modulus Dynamics

Lithuania . 1,544 parts In-Stock

1+ parts

$68.540

100+ parts

$65.798

1k+ parts

$63.057

10k+ parts

-

1,544

$68.540

$65.798

$63.057

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Continental Prestige Electronics

USA . 3,932 parts In-Stock

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3,932

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Argo Parts USA

USA . 3,407 parts In-Stock

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Corphita

USA . 510 parts In-Stock

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510

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Microchip USA

USA . 279 parts In-Stock

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279

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Bastille Electronics

Australia . 25 parts In-Stock

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25

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Overview

Unlock the potential of your automotive projects with the C167CSL33MCAKXUMA2 microcontroller by Infineon Technologies. This high-quality product offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With advanced features like 24-channel ADC, PWM channels, and connectivity options including CAN, SPI, and USART, this microcontroller provides endless possibilities for customization and innovation. Trust in the expertise of Infineon Technologies to deliver a superior product that will exceed your expectations and take your projects to the next level.

Feature Benefit Bullets

Package Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle a high voltage input, providing versatility in power supply options.

Address Bus Width: 24

Allows for a larger memory address space, enabling more complex and sophisticated programming capabilities.

Bit Size: 16

Offers a good balance between processing power and memory efficiency for various applications.

No. of Terminals: 144

Provides ample connections for interfacing with other components and peripherals in a system.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Provides reliable performance even in extreme cold environments.

ADC Channels: YES

Allows the microcontroller to convert analog signals to digital data, enabling sensor integration and data acquisition.

ROM Words: 11264

Offers a large on-chip memory for storing program instructions and data, supporting complex algorithms and applications.

Peripheral IC Type: MICROCONTROLLER

Combines multiple functions in a single chip, reducing component count and system complexity.

Analog To Digital Convertors: 24-Ch 10-Bit

Supports multiple analog inputs with high resolution conversion, enabling accurate data processing.

Connectivity: CAN(2), SPI, USART

Provides multiple communication interfaces for connecting to external devices and networks.

Technical Specifications

Microcontrollers C167CSL33MCAKXUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

ROM Words:

11264

Maximum Seated Height:

4.1 mm

Speed:

33 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), SPI, USART

Peripherals:

RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

C167CSL33MCAKXUMA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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