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C167CRLMHAFXUMA2

Infineon Technologies

C167CRLMHAFXUMA2 by Infineon Technologies

C167CRLMHAFXUMA2 by Infineon is a 16-bit microcontroller with 24-bit address bus width, operating at a max clock frequency of 25 MHz. It features 16-channel 10-bit ADCs and peripherals like PWM(4), TIMER(9), WDT, suitable for industrial applications requiring CAN, SPI, USART connectivity.

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1k+

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Digiode

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Ampacity Inc.

Singapore . 392 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 810 parts In-Stock

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$22.000

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$21.450

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$21.340

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Modulus Dynamics

Lithuania . 686 parts In-Stock

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$32.349

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$31.055

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$29.761

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$29.761

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Aztec Data Supply Inc.

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$71.340

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Overview

Unlock endless possibilities with the C167CRLMHAFXUMA2 microcontroller from Infineon Technologies. This cutting-edge device offers unparalleled performance, reliability, and versatility for a wide range of applications. With features like PWM, TIMER, and WDT peripherals, along with CAN, SPI, and USART connectivity options, this microcontroller is a game-changer in the industry. Experience seamless operation and efficient functionality with this advanced technology, designed to meet your every need. Elevate your projects to new heights with the C167CRLMHAFXUMA2 - the ultimate choice for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing its versatility.

Address Bus Width: 24

The 24-bit address bus width allows for efficient memory addressing, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square shape of the package offers a compact design, saving space on the PCB and allowing for more efficient layout.

Bit Size: 16

The 16-bit processing capability provides a balance between performance and cost, making this microcontroller a cost-effective choice for various applications.

No. of Terminals: 144

With a high number of terminals, this microcontroller offers a wide range of connectivity options, making it suitable for complex projects.

Package Style (Meter): FLATPACK

The flatpack package style provides a low profile design, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows for operation in low-power environments, making this microcontroller energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable operation in a variety of environmental conditions, increasing the durability of the microcontroller.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for use in extreme cold environments, making this microcontroller versatile in various settings.

ADC Channels: YES

The built-in ADC channels enable analog-to-digital conversion, making this microcontroller suitable for applications requiring sensor inputs.

Terminal Position: QUAD

The quad terminal position offers stable connectivity and ease of integration, improving the overall reliability of the microcontroller.

ROM Words: 4096

The 4096 ROM words provide ample storage for program code, allowing for complex algorithms and functions to be implemented on this microcontroller.

Maximum Seated Height: 2.75 mm

The low maximum seated height enables a slim design, making this microcontroller suitable for compact devices.

Width: 28 mm

The 28mm width offers a balance between size and functionality, making this microcontroller suitable for a wide range of applications.

External Data Bus Width: 16

The 16-bit external data bus width allows for efficient data transfer, enhancing the overall performance of the microcontroller.

Peripherals: PWM(4), TIMER(9), WDT

The integrated peripherals such as PWM, timers, and watchdog timer enhance the functionality and versatility of this microcontroller.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables fast processing speeds, making this microcontroller suitable for real-time applications.

Length: 28 mm

The 28mm length offers a compact form factor, making this microcontroller suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed for embedded systems and offers integrated peripherals for enhanced functionality.

Technology: CMOS

The CMOS technology used in this microcontroller provides low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form offers reliable solder connections, ensuring a secure and stable connection for optimal performance.

Analog To Digital Convertors: 16-Ch 10-Bit

With 16-channel 10-bit ADCs, this microcontroller can efficiently convert analog signals to digital data, making it suitable for sensor-based applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, making this microcontroller easy to integrate into existing systems.

PWM Channels: YES

The availability of PWM channels allows for precise control of output signals, making this microcontroller suitable for motor control and power management applications.

Connectivity: CAN, SPI, USART

The CAN, SPI, and USART connectivity options provide flexibility for communication with external devices, enhancing the versatility of this microcontroller.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch offers a fine pitch design, allowing for high-density mounting and compact PCB layouts.

Speed: 25 rpm

With a speed of 25 rpm, this microcontroller can process instructions quickly, making it suitable for time-sensitive applications.

No. of I/O Lines: 111

The 111 I/O lines offer a high level of connectivity options for interfacing with external devices, making this microcontroller versatile and adaptable.

Technical Specifications

Microcontrollers C167CRLMHAFXUMA2 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of I/O Lines:

111

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

4096

Maximum Seated Height:

2.75 mm

Speed:

25 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, SPI, USART

Peripherals:

PWM(4), TIMER(9), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

C167CRLMHAFXUMA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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