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BTS410E2E3043NKSA1

Infineon Technologies

BTS410E2E3043NKSA1 by Infineon Technologies

BTS410E2E3043NKSA1 by Infineon is a 5-terminal peripheral driver with built-in protections for transient, over current, over voltage, thermal, and under voltage. It operates at supply voltages ranging from 4.7V to 42V and has a nominal output peak current limit of 1.8A. This rectangular package style flange mount device is ideal for applications requiring sink output current flow direction and turn-on/off times of 125us/85us respectively.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 7,208 parts In-Stock

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Chip Stock

USA . 7,180 parts In-Stock

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VNN

France . 1,246 parts In-Stock

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Digiode

USA . 451 parts In-Stock

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Nova Conductors

Japan . 64 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$7.617

100+ parts

$6.931

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$6.246

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100

$7.617

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$6.246

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Ampacity Inc.

Singapore . 955 parts In-Stock

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$8.500

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$8.500

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Modulus Dynamics

Lithuania . 1 parts In-Stock

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$10.198

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$9.790

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$9.382

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1

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AZTECH Wire

Italy . 219 parts In-Stock

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$11.313

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Corohmni

South Africa . 633 parts In-Stock

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$14.541

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Corphita

USA . 666 parts In-Stock

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Microchip USA

USA . 315 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unleash the power of seamless driving experience with the BTS410E2E3043NKSA1 by Infineon Technologies. Crafted with precision and quality, this peripheral driver offers unparalleled protection against transient, over current, over voltage, thermal, and under voltage issues, ensuring optimal performance and reliability. Ideal for a wide range of applications, this product is designed to provide unmatched value and benefits to customers seeking efficiency, durability, and peace of mind. Elevate your driving experience with the BTS410E2E3043NKSA1 and enjoy a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-lasting performance.

Maximum Supply Voltage: 42 V

The high maximum supply voltage allows for compatibility with a wide range of systems and applications.

Built-in Protections: TRANSIENT, OVER CURRENT, OVER VOLTAGE, THERMAL, UNDER VOLTAGE

The comprehensive built-in protections ensure the safety of the connected devices and the peripheral driver itself against various electrical faults.

Nominal Supply Voltage: 12 V

The nominal supply voltage of 12 V makes it suitable for use in standard voltage setups without requiring additional adjustments.

Turn-on Time: 125 us

The quick turn-on time of 125 us ensures rapid activation and response, enhancing the overall efficiency of the peripheral driver.

Nominal Output Peak Current Limit: 1.8 A

The high nominal output peak current limit of 1.8 A allows for the driving of various peripherals with demanding power requirements.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter based peripheral driver offers flexibility in interfacing with different types of devices and systems.

Output Current Flow Direction: SINK

The output current flow direction being sink indicates the ability to sink current from connected devices, providing control over the flow of electricity.

Technical Specifications

Peripheral Drivers BTS410E2E3043NKSA1 attributes and parameters. Explore more Peripheral Drivers devices from Infineon Technologies

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

JESD-30 Code:

R-PSFM-T5

No. of Functions:

1

No. of Terminals:

5

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage:

42 V

Minimum Supply Voltage:

4.7 V

Nominal Supply Voltage:

12 V

Surface Mount:

NO

Terminal Form:

Terminal Position:

SINGLE

Turn-off Time:

85 us

Turn-on Time:

125 us

Trade Compliance

BTS410E2E3043NKSA1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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