Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF/Microwave Switches BGS15MU14E6327 attributes and parameters. Explore more RF/Microwave Switches devices from Infineon Technologies
RF or Microwave Device Type:
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRM140T1G
Onsemi
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
National Semiconductor
Hitano Enterprise
ROHM
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Texas Instruments
LM555CN by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications. This rectangular package IC has dual terminals and uses bipolar technology for pulse generation in various electronic circuits.
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
LM358M
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
SMBJ18CA
Multicomp Pro
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
ADGM1004JCPZ-R2
Analog Devices
ADGM1004JCPZ-R2 by Analog Devices is a SP4T RF switch with 50 ohm impedance, offering low insertion loss of 0.95 dB and high isolation of 16 dB. It operates from 0 to 13000 MHz, handling up to 33 dBm CW power. Ideal for RF/Microwave applications requiring precise signal routing in compact designs.
CSH210R
Infineon Technologies
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1;
HMC183QS24E
HMC183QS24E by Analog Devices is a RF/Microwave Switch with 29.03 dBm CW power, 1.8 dB max insertion loss, and 26 dB min isolation. It is ideal for diversity switch applications in the frequency range of 0-2000 MHz, offering high performance in surface mount construction.
ADG901BRMZ
ADG901BRMZ by Analog Devices is a CMOS RF/Microwave Diversity Switch with 8 terminals. It offers 1.25 dB max insertion loss, 31 dB min isolation, and operates from 0 to 2500 MHz. Ideal for applications requiring high-frequency signal routing in wireless communication systems.
6025
Micronetics
SPST; Maximum Input Power (CW): 20 dBm; Minimum Operating Frequency: 2000 MHz; Maximum Operating Temperature: 125 Cel; Construction: COAXIAL; Characteristic Impedance: 50 ohm;
ADG901BCPZ-REEL7
ADG901BCPZ-REEL7 by Analog Devices is an RF/Microwave Switch with 17.99 dBm CW input power, 1.25 dB max insertion loss, and 31 dB min isolation. Ideal for diversity switch applications in CMOS technology, it operates from -40 to 85 °C with a frequency range of 0-2500 MHz.
MASWSS0178
Tyco Electronics M/a-com
DIVERSITY SWITCH; Additional Features: HIGH RELIABILITY; Construction: COMPONENT; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn); Maximum Input Power (CW): 33.01 dBm;
SW-277
M/a-com
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Isolation: 14 dB;
HMC546MS8GE
Analog Devices' HMC546MS8GE is a RF/Microwave Switch with 1.5 dB max insertion loss, 8 dB min isolation, and 200-2200 MHz operating frequency range. Ideal for diversity switch applications, it has 40 dBm CW input power handling and operates b/w -40 to 85°C.
HMC199AMS8
Analog Devices' HMC199AMS8 is a RF/Microwave Switch with max input power of 29.29 dBm, insertion loss of 1 dB, and operating frequency range from 0 to 2500 MHz. Ideal for diversity switch applications due to its construction as a component with characteristic impedance of 50 ohm.
BGS13S4N9
SP3T;
HA22016
Renesas Electronics
SPDT; Maximum Input Power (CW): 20.97 dBm; Maximum Voltage Standing Wave Ratio: 1.2; Maximum Operating Temperature: 70 Cel; Construction: COMPONENT; Minimum Operating Temperature: -20 Cel;
HMC349AMS8GTR
Analog Devices' HMC349AMS8GTR is a RF/Microwave Switch with max input power of 33.5 dBm, insertion loss of 2.1 dB, and operating frequency range from 100 MHz to 4 GHz. Ideal for diversity switch applications due to its 50 ohm impedance and wide temperature range (-40°C to 125°C).
HMC104
Analog Devices' HMC104 is a GAAS SPDT RF switch with -5V power supply, operating from -55°C to 125°C. It supports frequencies up to 6GHz and features absorptive port termination. Ideal for RF/microwave applications requiring high-frequency switching capabilities.
HMC270MS8GE
Analog Devices' HMC270MS8GE is a SPDT RF/Microwave switch with 2.4 dB max insertion loss and 28 dB min isolation. It operates from 0 to 8000 MHz, handles up to 23.98 dBm CW power, and suits applications requiring fast 0.05 us switching in a compact surface-mount package.
PE42820B-X
Psemi
SPDT;
PE42520C-Z
PE42520C-Z by Psemi is a SPDT RF switch with 2.7 dB insertion loss, 13 dB isolation, and 1.15 VSWR. It operates from -40 to 85°C and handles up to 36 dBm CW power. Ideal for RF/Microwave applications requiring low power consumption and high performance in a compact surface-mount package.
TG2211FT
Toshiba
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; JESD-609 Code: e0;
HRF-SW1020-GR-TR
Honeywell
HRF-SW1020-GR-TR by Honeywell is a SP4T RF/Microwave switch with 2.3 dB max insertion loss and 35.05 dBm CW input power. It operates from -40 to 85°C, has Ni/Pd/Au terminal finish, and supports frequencies from 0 to 2500 MHz. Ideal for high-frequency applications requiring precise signal routing in a compact form factor.
PE42540LGBD-Z
PE42540LGBD-Z by Psemi is a SP4T RF switch with 1.6 dB max insertion loss, 30 dBm CW power handling, and VSWR of 1.1. Ideal for applications requiring high-frequency switching in RF/microwave systems with operating frequency range from 0.00001 MHz to 8000 MHz.
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BGS12WN6E6327XTSA1
BGS12WN6E6327XTSA1 by Infineon is a RF/Microwave Switch with max input power of 28 dBm, operating freq. from 50 MHz to 6000 MHz, and min isolation of 21 dB. It's a SPDT diversity switch suitable for applications requiring low insertion loss and high isolation in wireless communication systems.
BGS12P2L6E6327XTSA1
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Screening Level: IEC-61000-4-2;
BGS12PL6E6327XTSA1
BGS12PL6E6327XTSA1 by Infineon is a RF/Microwave Switch with 36 dBm CW power, 1.04 VSWR, and 1.15 dB insertion loss. It operates from -30 to 85°C, ideal for CMOS technology applications requiring SPDT switches in the frequency range of 100-4000 MHz.
BGS13S4N9E6327XTSA1
BGS12WN6E6327
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Supply Current: .12 mA;
BGS14M8U9E6327
SP4T;
BGS14WMA9
RF/Microwave Switches;
BGS12AE6327X1SA1
SPDT; Maximum Input Power (CW): 23.98 dBm; Maximum Insertion Loss: .8 dB; Minimum Operating Frequency: 100 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm;
BGS12WN6E6329
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Insertion Loss: 2 dB;
BGS13AL12
SP3T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: MOS; Maximum Input Power (CW): 31.99 dBm;
BGS14M8U9
BGS12WN6
BGS14MPA9
BGS12P2L6
BGS12PL6
BGS12A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; JESD-609 Code: e3;
BGS12ATRE6327
SPDT; Additional Features: CMOS COMPATIBLE; Maximum Insertion Loss: .8 dB; Construction: COMPONENT; Maximum Input Power (CW): 23.98 dBm; Maximum Operating Temperature: 85 Cel;
BGS13SN8
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