Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGS12WN6E6327XTSA1 by Infineon is a RF/Microwave Switch with max input power of 28 dBm, operating freq. from 50 MHz to 6000 MHz, and min isolation of 21 dB. It's a SPDT diversity switch suitable for applications requiring low insertion loss and high isolation in wireless communication systems.
Median Price
$0.270
Lifecycle Status
Suppliers In-Stock
19
In-Stock Inventory
1k+
Arrow
1+ parts
100+ parts
$0.202
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10k+ parts
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Mouser Electronics
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Newark
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DigiKey
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EBV Elektronik
Farnell
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Element14
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Verical
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Chip1Stop
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Nova Conductors
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Digiode
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IBS Electronics
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NAC Semi
Chip Stock
Rutronik
Vyrian
VNN
Sensible Micro Corp
ComSIT Distribution GmbH
Semicontronic
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Ampacity Inc.
Argo Parts USA
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Continental Prestige Electronics
$0.174
Netroflash
$0.173
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Corphita
$0.376
Corohmni
$0.831
Modulus Dynamics
$1.689
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Aztec Data Supply Inc.
$1.700
Advanced Electronics
$2.716
$2.580
Futuretech Components
Authorized Procurement Solutions
Robosynatics
$2.005
$1.964
Lucentia Tech
The use of plastic/epoxy material for the package body makes the switch lightweight and durable, ideal for portable or mobile applications.
With a high maximum input power handling capability, this switch can handle strong RF signals without damage, ensuring reliable operation.
The component construction of this switch allows for easy integration into RF systems and circuitry, making it versatile for various applications.
The flexibility of power supply voltages allows for compatibility with different system requirements, making it suitable for a range of applications.
Having 6 terminals provides additional connection options and versatility in system design, allowing for more complex RF setups.
The high maximum operating temperature ensures reliable performance even in harsh environments or during prolonged use.
The low minimum operating temperature allows for use in cold environments without compromising performance, making it suitable for various applications.
With a low maximum insertion loss, this switch minimizes signal attenuation, ensuring efficient RF signal transmission.
The use of CMOS technology offers low power consumption and high integration capabilities, making the switch energy-efficient and compact.
The low maximum supply current requirement results in minimal power consumption, contributing to energy efficiency in the overall system.
As a diversity switch with single-pole double-throw configuration, this switch offers switching between two input signals, ideal for applications requiring signal switching flexibility.
The 50 ohm characteristic impedance matches common RF systems, ensuring compatibility and efficient signal transmission.
With a high minimum isolation value, this switch effectively isolates input signals, reducing interference and ensuring signal integrity in complex RF setups.
The low minimum operating frequency allows for handling of signals in the lower frequency range, making it versatile for a wide range of RF applications.
The surface mounting feature simplifies installation and integration into circuit boards, saving space and enhancing ease of use in compact RF systems.
With a high maximum operating frequency capability, this switch can handle signals in the microwave frequency range, suitable for high-frequency RF applications.
RF/Microwave Switches BGS12WN6E6327XTSA1 attributes and parameters. Explore more RF/Microwave Switches devices from Infineon Technologies
Additional Features:
Characteristic Impedance:
Construction:
Maximum Input Power (CW):
Maximum Insertion Loss:
Minimum Isolation:
Mounting Feature:
No. of Functions:
No. of Terminals:
Maximum Operating Frequency:
Minimum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
RF or Microwave Device Type:
Maximum Supply Current:
Technology:
Maximum Voltage Standing Wave Ratio:
BGS12WN6E6327XTSA1 RF & Microwave trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.50.70.00
SB
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
BAV99
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Taitron Components
Dc Components
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
Zowie Technology
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
Pro-an Electronic
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
Thinking Electronic Industrial
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
F2911NBGP
Renesas Electronics
SPST; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Construction: COMPONENT; Minimum Operating Frequency: 1 MHz; Maximum Insertion Loss: .55 dB;
HMC596LP4RTR
Analog Devices
Analog Devices' HMC596LP4RTR is a CMOS DPDT RF switch with 2 functions, 24 terminals, and 5V power supply. It offers a max insertion loss of 9 dB, min isolation of 37 dB, and operates up to 3 GHz. Ideal for RF/microwave applications requiring fast switching and high performance in surface mount packages.
PE42525A-X
Psemi
SPDT;
TG2210FT(TE85L)
Toshiba
RF/Microwave Switches;
HMC641ATCPZ-EP-RL7
HMC641ATCPZ-EP-RL7 by Analog Devices is a SP4T RF/Microwave switch with 50 ohm impedance and 30 dB isolation. It operates from 100 MHz to 20 GHz, handling up to 17 dBm CW power and featuring a compression point of 22 dBm. This component is ideal for high-frequency applications requiring precise signal routing in a compact surface-mount package.
HMC545E
Hittite Microwave
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Port Termination: REFLECTIVE;
HMC427LP3
Analog Devices' HMC427LP3 is a RF/Microwave Switch with 2.1 dB max insertion loss, 26.99 dBm CW power handling, and 0-8000 MHz frequency range. Ideal for transfer switch applications in environments ranging from -40 to 85°C.
MA4AGSW1A
M/a-com Technology Solutions
SPST; Characteristic Impedance: 50 ohm; Maximum Insertion Loss: 1.2 dB; Construction: COMPONENT; Maximum Operating Frequency: 50000 MHz; Maximum Operating Temperature: 125 Cel;
MASWSS0115TR-3000
M/a-com
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -40 Cel;
LM96530SQE/NOPB
Texas Instruments
LM96530SQE/NOPB by Texas Instruments is a RF/Microwave Switch with 60 terminals, operating at 0-70°C. It has a power supply of 5V and a nominal on time of 2μs. Ideal for applications requiring a transfer switch, it features surface mounting and matte tin terminal finish.
ADRF5024BCCZN
Analog Devices' ADRF5024BCCZN is a RF/Microwave switch with max. input power of 26.99 dBm, insertion loss of 1.7 dB, and freq. range from 100 MHz to 44 GHz. Ideal for diversity switching applications due to its temp. range (-40°C to +105°C) and impedance of 50 ohm.
TGS8250SCMX
TGS8250SCMX by Texas Instruments is an RF/Microwave SPDT switch with 30 dBm CW power, 1.5 VSWR, and 2.7 dB insertion loss. Ideal for applications requiring high-frequency switching up to 18 GHz in components construction.
HMC252QS24E
Analog Devices' HMC252QS24E is a SP6T RF/Microwave switch with 26 dBm compression point, 1.8 dB max insertion loss, and 3000 MHz operating frequency. Ideal for applications requiring high-speed switching in the 0-3000 MHz range, such as communication systems and radar equipment.
MA4SW510B-1
TE Connectivity
TE Connectivity's MA4SW510B-1 is an RF/Microwave Switch with SP5T configuration, 15V power supply, and 18000 MHz operating frequency. It offers a max insertion loss of 2.1 dB and min isolation of 25 dB. Ideal for applications requiring high-frequency switching in temperature range from -65°C to 125°C.
ADG901BRM-REEL7
ADG901BRM-REEL7 by Analog Devices is a CMOS RF/Microwave Diversity Switch with 8 terminals. It offers 1.25 dB max insertion loss, 31 dB min isolation, and operates from 0 to 2500 MHz. Ideal for applications requiring fast 0.0036 us switching times in temperature range of -40 to 85 °C.
HMC199MS8
HMC199MS8 by Analog Devices is a RF/Microwave Switch with 2 functions, SPDT type, and 50 ohm impedance. It operates from 0 to 2500 MHz with max insertion loss of 1 dB. Ideal for applications requiring fast switching times and high isolation levels in temperature range -40 to +85°C.
HMC975
Analog Devices' HMC975 is a SPDT RF/Microwave switch with 2.1 dB max insertion loss, handling up to 30 dBm CW power. Operating from -55 °C to 85°C, it supports frequencies from 2-50 GHz. Ideal for high-frequency applications requiring reliable signal switching in a compact form factor.
MASWSS0115
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Nominal On Time: .04 us;
HMC284AMS8GTR
Analog Devices' HMC284AMS8GTR is a SPDT RF switch with 1.1 dB max insertion loss, 30 dB min isolation, and 3500 MHz max operating frequency. Ideal for applications requiring high compression point of 29 dBm in RF/Microwave systems.
HMC336MS8GE
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Insertion Loss: 2 dB;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGS12P2L6E6327XTSA1
Infineon Technologies
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Screening Level: IEC-61000-4-2;
BGS12PL6E6327XTSA1
BGS12PL6E6327XTSA1 by Infineon is a RF/Microwave Switch with 36 dBm CW power, 1.04 VSWR, and 1.15 dB insertion loss. It operates from -30 to 85°C, ideal for CMOS technology applications requiring SPDT switches in the frequency range of 100-4000 MHz.
BGS13S4N9E6327XTSA1
SP3T;
BGS12WN6E6327
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Supply Current: .12 mA;
BGS14M8U9E6327
SP4T;
BGS14WMA9
BGS12AE6327X1SA1
SPDT; Maximum Input Power (CW): 23.98 dBm; Maximum Insertion Loss: .8 dB; Minimum Operating Frequency: 100 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm;
BGS15MU14E6327
SP5T;
BGS12WN6E6329
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Insertion Loss: 2 dB;
BGS13AL12
SP3T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: MOS; Maximum Input Power (CW): 31.99 dBm;
BGS14M8U9
BGS12WN6
BGS14MPA9
BGS12P2L6
BGS12PL6
BGS13S4N9
BGS12A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; JESD-609 Code: e3;
BGS12ATRE6327
SPDT; Additional Features: CMOS COMPATIBLE; Maximum Insertion Loss: .8 dB; Construction: COMPONENT; Maximum Input Power (CW): 23.98 dBm; Maximum Operating Temperature: 85 Cel;
BGS13SN8
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