Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGS12PL6E6327XTSA1 by Infineon is a RF/Microwave Switch with 36 dBm CW power, 1.04 VSWR, and 1.15 dB insertion loss. It operates from -30 to 85°C, ideal for CMOS technology applications requiring SPDT switches in the frequency range of 100-4000 MHz.
Median Price
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Farnell
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Element14
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ComSIT Distribution GmbH
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Perfect Parts
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Advanced Electronics
The plastic/epoxy package provides durability and protection, making this switch suitable for various environments.
With a high maximum input power capacity, this switch can handle strong signals without distortion or damage.
Compliance with IEC-61000-4-2 standards ensures reliable performance in the presence of electrostatic discharge.
The low VSWR indicates minimal signal reflections and efficient transfer of power within the system.
The use of high-quality components ensures the reliability and longevity of this switch.
The compatibility with common power supplies makes integration of this switch into existing systems seamless.
Having 6 terminals allows for versatile connectivity options and compatibility with various circuit designs.
The high maximum operating temperature tolerance enables this switch to function effectively in demanding thermal conditions.
The low minimum operating temperature allows for reliable operation even in cold environments.
The gold terminal finish ensures reliable connections and minimizes signal loss for optimal performance.
The low insertion loss preserves signal integrity and minimizes power loss during switching.
The fast on-time of 1.4 microseconds ensures quick and responsive signal switching for efficient operation.
The CMOS technology offers low power consumption and high reliability, making this switch energy-efficient and durable.
The low supply current requirement ensures minimal power consumption, making this switch ideal for battery-powered applications.
Being a Single-Pole Double-Throw switch, it provides flexibility in routing RF signals between two paths for versatile applications.
The 50-ohm impedance matches common RF systems, ensuring efficient signal transfer and compatibility with standard equipment.
The high isolation level of 19 dB minimizes signal leakage between ports, ensuring clear and reliable signal routing.
The low minimum operating frequency allows this switch to handle a wide range of RF signals, making it versatile for various applications.
The surface mount design allows for easy and secure installation on circuit boards, saving space and simplifying assembly processes.
With a high maximum operating frequency, this switch can handle a wide range of RF and microwave signals with precision and efficiency.
RF/Microwave Switches BGS12PL6E6327XTSA1 attributes and parameters. Explore more RF/Microwave Switches devices from Infineon Technologies
Additional Features:
Characteristic Impedance:
Construction:
Maximum Input Power (CW):
Maximum Insertion Loss:
Minimum Isolation:
JESD-609 Code:
Mounting Feature:
No. of Functions:
No. of Terminals:
Nominal On Time:
Maximum Operating Frequency:
Minimum Operating Frequency:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Equivalence Code:
Power Supplies (V):
RF or Microwave Device Type:
Screening Level:
Maximum Supply Current:
Technology:
Terminal Finish:
Maximum Voltage Standing Wave Ratio:
BGS12PL6E6327XTSA1 RF & Microwave trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.50.70.00
SB
PCN Packaging - Mult Dev Packing Box Chg 18/Oct/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
EU2B-YS2J03C
Idec
ROTARY SWITCH;
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
1N4148
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
Rfe International
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
Diotec Electronics
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
4259-63
Psemi
Psemi's 4259-63 RF/Microwave Switch offers SPDT technology, with max freq of 3 GHz and min isolation of 19 dB. It operates b/w -40 to 85°C, has 0.6 dB insertion loss, and can handle up to 34 dBm CW power. Ideal for applications requiring fast switching in high-frequency environments.
HMC232LP4
Analog Devices
HMC232LP4 by Analog Devices is a RF/Microwave Switch with 24 terminals, offering max insertion loss of 3.1 dB and min isolation of 37 dB. With a max operating frequency of 12 GHz, it is ideal for high-frequency applications requiring fast switching times (0.006 us) and high power handling (30 dBm CW).
HMC784MS8GETR
HMC784MS8GETR by Analog Devices is a RF/Microwave Switch with max input power of 39 dBm and compression point of 35 dBm. It operates b/w -40 to 85°C, offers min isolation of 26 dB, and has a max insertion loss of 2 dB. Ideal for diversity switch applications in the frequency range from 0 to 4000 MHz.
UPG2163T5N-E2
Renesas Electronics
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: SOLCC6,.06,20;
HMC344ATCPZ-EP-PT
Analog Devices' HMC344ATCPZ-EP-PT is a RF/Microwave Switch with 19 dBm CW input power, 25 dBm compression point, and 2.5 dB max insertion loss. Ideal for applications requiring SP4T switches in the frequency range of 100 MHz to 8 GHz with GAAS technology and surface mounting feature.
HMC241QS16TR
Analog Devices' HMC241QS16TR is a SP4T RF/Microwave switch with 1.5 dB max insertion loss, 23 dB min isolation, and 3500 MHz max operating frequency. Ideal for applications requiring high power handling up to 26.99 dBm CW, such as in wireless communication systems or radar equipment.
TGS8122XPCX
Texas Instruments
TGS8122XPCX by Texas Instruments is an RF/Microwave SPDT switch with 34.77 dBm CW power, 1.2 VSWR, and 1.4 dB insertion loss. Ideal for applications requiring switching b/w frequencies of 8-11 GHz in COMPONENT construction.
SKY13588-460LF
Skyworks Solutions
DIVERSITY SWITCH;
CMD203C4
Custom Mmic Design Services
SP4T; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm; Terminal Finish: Gold (Au) - with Nickel (Ni) barrier; Additional Features: HIGH ISOLATION; Maximum Operating Frequency: 20000 MHz;
HMC641LC4TR
Analog Devices' HMC641LC4TR is a GAAS SP4T RF switch with 3.5 dB max insertion loss, 30 dB min isolation, and 20 GHz max operating frequency. Ideal for RF/microwave applications, it features -40 to 85 °C temp range and ceramic package for high performance in diverse environments.
HMC349AMS8G
Hittite Microwave
DIVERSITY SWITCH; Minimum Operating Temperature: -40 Cel; Maximum Input Power (CW): 33.6 dBm; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Operating Frequency: 4000 MHz;
HMC595TR
HMC7992LP3DETR
HMC7992LP3DETR by Analog Devices is a SP4T RF/Microwave Switch with 1.5 dB max insertion loss, 25 dB min isolation, and 33 dBm compression point. Ideal for applications requiring high-frequency switching in the range of 100 MHz to 6 GHz, such as wireless communication systems and radar equipment.
TGS8705-SCC
TGS8705-SCC by Texas Instruments is a GAAS SPDT RF switch with 30 dBm CW power, 1.2 VSWR, and 1.1 dB insertion loss. Operating from 0-6000 MHz, it's ideal for reflective port termination applications in RF/Microwave systems.
HMC194MS8
HMC194MS8 by Analog Devices is an RF/Microwave SPDT switch with a max freq of 3 GHz, insertion loss of 1.1 dB, and CW input power of 26.99 dBm. Ideal for applications requiring high-frequency signal routing in environments ranging from -40°C to 85°C.
MASWSS0180TR-3000
M/a-com Technology Solutions
MASWSS0180TR-3000 by M/a-com: RF/Microwave Switch with 27 dBm CW power, 1.1 VSWR, and 0.7 dB max insertion loss. Ideal for SPDT applications in GAAS technology up to 2500 MHz frequency range.
SKY13372-467LF
SKY13372-467LF by Skyworks Solutions is a RF/Microwave Switch with 23.98 dBm CW power, 1.12 VSWR, and 28 dBm compression point. It operates from -40 to 105 °C, has 1.9 dB insertion loss, and offers SPDT functionality at frequencies ranging from 100 MHz to 6 GHz. Ideal for high-frequency applications requiring low insertion loss and high isolation in compact designs.
6014
Micronetics
SPST; Maximum Operating Frequency: 10100 MHz; Minimum Operating Frequency: 9000 MHz; Minimum Operating Temperature: -55 Cel; Maximum Operating Temperature: 125 Cel; Maximum Voltage Standing Wave Ratio: 1.5;
MASWSS0180TR
TE Connectivity's MASWSS0180TR is a SPDT RF switch with 1.1 VSWR, 30 dBm compression point, and 36 dB isolation. Suitable for applications requiring high-frequency switching up to 2500 MHz in environments ranging from -40°C to 85°C. Features GaAs technology and surface mounting feature for ease of installation.
TGS8122SSC
TGS8122SSC by Texas Instruments is a GAAS SPDT RF switch with 29 dBm compression point, operating from 0 to 70°C. It has a max frequency of 11 GHz and reflective port termination. Ideal for RF/microwave applications requiring high power handling and wide temperature range.
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BGS12WN6E6327XTSA1
Infineon Technologies
BGS12WN6E6327XTSA1 by Infineon is a RF/Microwave Switch with max input power of 28 dBm, operating freq. from 50 MHz to 6000 MHz, and min isolation of 21 dB. It's a SPDT diversity switch suitable for applications requiring low insertion loss and high isolation in wireless communication systems.
BGS12P2L6E6327XTSA1
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Screening Level: IEC-61000-4-2;
BGS13S4N9E6327XTSA1
SP3T;
BGS12WN6E6327
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Supply Current: .12 mA;
BGS14M8U9E6327
SP4T;
BGS14WMA9
RF/Microwave Switches;
BGS12AE6327X1SA1
SPDT; Maximum Input Power (CW): 23.98 dBm; Maximum Insertion Loss: .8 dB; Minimum Operating Frequency: 100 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm;
BGS15MU14E6327
SP5T;
BGS12WN6E6329
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Insertion Loss: 2 dB;
BGS13AL12
SP3T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: MOS; Maximum Input Power (CW): 31.99 dBm;
BGS14M8U9
BGS12WN6
BGS14MPA9
BGS12P2L6
BGS12PL6
BGS13S4N9
BGS12A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; JESD-609 Code: e3;
BGS12ATRE6327
SPDT; Additional Features: CMOS COMPATIBLE; Maximum Insertion Loss: .8 dB; Construction: COMPONENT; Maximum Input Power (CW): 23.98 dBm; Maximum Operating Temperature: 85 Cel;
BGS13SN8
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