Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF/Microwave Switches BGS14M8U9 attributes and parameters. Explore more RF/Microwave Switches devices from Infineon Technologies
RF or Microwave Device Type:
BGS14M8U9 RF & Microwave trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.50.70.00
SB
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
2N7002
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
FDN306P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
SMBJ18CA
Yageo
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Lite-on Semiconductor
LM358DT
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
KSZ9031RNXIA
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
ADG901BCP
Analog Devices
ADG901BCP by Analog Devices is a CMOS RF/Microwave switch with 8 terminals. It offers low insertion loss of 1.25 dB and operates from 0 to 2500 MHz. Ideal for diversity switching applications, it has a max input power of 18.06 dBm and compression point of 20 dBm.
HMC252QS24
Analog Devices' HMC252QS24 is a SP6T RF/Microwave switch with 26 dBm compression point, 1.8 dB max insertion loss, and 3000 MHz max operating frequency. Ideal for applications requiring fast 0.12 us on time switching in the temperature range of -40 to 85 °C.
HMC199MS8E
HMC199MS8E by Analog Devices is a RF/Microwave Switch with SPDT configuration and 50 ohm impedance. It has a max insertion loss of 1 dB, min isolation of 17 dB, and operates from 0 to 2500 MHz. This component is ideal for applications requiring fast switching times and high power handling up to 23.98 dBm CW.
SKY13348-374LF
Skyworks Solutions
SKY13348-374LF by Skyworks Solutions is an RF/Microwave switch with max input power of 37.99 dBm, insertion loss of 1.15 dB, and operating frequency range from 500 MHz to 6 GHz. It's a diversity switch component ideal for applications requiring high-frequency signal routing in temperature range -40°C to 85°C.
HMC104
Analog Devices' HMC104 is a GAAS SPDT RF switch with -5V power supply, operating from -55°C to 125°C. It supports frequencies up to 6GHz and features absorptive port termination. Ideal for RF/microwave applications requiring high-frequency switching capabilities.
UPG2157T5F-A
Renesas Electronics
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -45 Cel;
HMC241QS16ETR
Hittite Microwave
SP4T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Input Power (CW): 26.99 dBm;
PE42440MLBB-Z
Psemi
PE42440MLBB-Z by Psemi is a SP4T RF/Microwave switch with 1.15 dB max insertion loss, 32.99 dBm CW power handling, and 50-3000 MHz frequency range. Ideal for applications requiring high-frequency signal routing in environments ranging from -40 to 85°C.
HMC536LP2ETR
Analog Devices' HMC536LP2ETR is a GAAS technology RF switch with 1.3 dB max insertion loss and 23 dB min isolation. Operating at up to 6 GHz, it has 0.07 us nominal on time and is ideal for diversity switching applications in the -40 to 85°C temperature range.
HMC232G7
SPDT; Package Body Material: METAL; Technology: GAAS; Port Termination: ABSORPTIVE; Compression Point (1 dB): 27 dBm; Maximum Operating Frequency: 6000 MHz;
HMC276QS24RTR
RF/Microwave Switches;
PE42525A-X
SPDT;
UPG2406TB-E4-A
DIVERSITY SWITCH; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Compression Point (1 dB): 25 dBm;
MASWSS0178
M/a-com
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -40 Cel;
SKY12210-478LF
SKY12210-478LF by Skyworks Solutions is a RF/Microwave Switch with 16 terminals, operating from -55°C to 175°C. It offers 0.7 dB insertion loss, 22 dB isolation, and operates up to 4000 MHz. Ideal for diversity switch applications due to its surface mount feature and plastic/epoxy package body material.
SKY13322-375LF
SKY13322-375LF by Skyworks Solutions is an RF/Microwave Switch with max. insertion loss of 1.25 dB, operating freq. range of 20-6000 MHz, and 50 ohm impedance. It's a diversity switch ideal for applications requiring temp. range of -40 to 85°C, such as wireless communication systems.
HMC8800
Analog Devices' HMC8800 RF/Microwave Switch offers SPDT configuration, 2.9 dB max insertion loss, and 40 dB min isolation. With a frequency range of 0-15000 MHz, it's ideal for high-power applications requiring up to 30 dBm CW input power. Suitable for surface mount installation in various electronic systems.
HMC574MS8E
Analog Devices' HMC574MS8E is a RF/Microwave Switch with 39.03 dBm CW input power, 0.8 dB max insertion loss, and 16 dB min isolation. Ideal for diversity switch applications in the 0-3000 MHz frequency range, it features GAAS technology and operates b/w -40 to 85 °C.
ADRF5046BCCZN-R7
Analog Devices' ADRF5046BCCZN-R7 is a RF/Microwave Switch with 27.48 dBm CW power, 100-44000 MHz frequency range, and 50 ohm impedance. Ideal for diversity switch applications due to its wide operating temperature range (-40 to 105 °C) and nickel palladium gold finish.
MA4SW310
Tyco Electronics M/a-com
SP3T; Minimum Operating Temperature: -65 Cel; Maximum Operating Frequency: 20000 MHz; Additional Features: HIGH ISOLATION; Maximum Input Power (CW): 30 dBm; Minimum Operating Frequency: 6000 MHz;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
BGS12WN6E6327XTSA1
BGS12WN6E6327XTSA1 by Infineon is a RF/Microwave Switch with max input power of 28 dBm, operating freq. from 50 MHz to 6000 MHz, and min isolation of 21 dB. It's a SPDT diversity switch suitable for applications requiring low insertion loss and high isolation in wireless communication systems.
BGS12P2L6E6327XTSA1
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Screening Level: IEC-61000-4-2;
BGS12PL6E6327XTSA1
BGS12PL6E6327XTSA1 by Infineon is a RF/Microwave Switch with 36 dBm CW power, 1.04 VSWR, and 1.15 dB insertion loss. It operates from -30 to 85°C, ideal for CMOS technology applications requiring SPDT switches in the frequency range of 100-4000 MHz.
BGS13S4N9E6327XTSA1
SP3T;
BGS12WN6E6327
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Supply Current: .12 mA;
BGS14M8U9E6327
BGS14WMA9
BGS12AE6327X1SA1
SPDT; Maximum Input Power (CW): 23.98 dBm; Maximum Insertion Loss: .8 dB; Minimum Operating Frequency: 100 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm;
BGS15MU14E6327
SP5T;
BGS12WN6E6329
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Maximum Insertion Loss: 2 dB;
BGS13AL12
SP3T; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: MOS; Maximum Input Power (CW): 31.99 dBm;
BGS12WN6
BGS14MPA9
BGS12P2L6
BGS12PL6
BGS13S4N9
BGS12A
SPDT; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; JESD-609 Code: e3;
BGS12ATRE6327
SPDT; Additional Features: CMOS COMPATIBLE; Maximum Insertion Loss: .8 dB; Construction: COMPONENT; Maximum Input Power (CW): 23.98 dBm; Maximum Operating Temperature: 85 Cel;
BGS13SN8
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