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BCX70HE6327HTSA1

Infineon Technologies

BCX70HE6327HTSA1 by Infineon Technologies

Infineon BCX70HE6327HTSA1 is a NPN BJT transistor with hFE of 70, VCE of 45V, and fT of 250MHz. Ideal for switching applications due to its small outline package, Gull Wing terminals, and surface mount capability.

Median Price

$0.046

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,503,753 parts In-Stock

1+ parts

-

100+ parts

$0.050

1k+ parts

$0.041

10k+ parts

$0.037

1,503,753

-

$0.050

$0.041

$0.037

Verical

USA . 1,313,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.041

1,313,000

-

-

-

$0.041

Chip1Stop

Japan . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.035

15,000

-

-

-

$0.035

Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.218

6,000

-

-

-

$0.218

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 776 parts In-Stock

1+ parts

$0.025

100+ parts

-

1k+ parts

-

10k+ parts

-

776

$0.025

-

-

-

Nova Conductors

Japan . 89 parts In-Stock

1+ parts

$0.049

100+ parts

-

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-

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89

$0.049

-

-

-

Chip Stock

USA . 102,500 parts In-Stock

1+ parts

-

100+ parts

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102,500

-

-

-

-

IBS Electronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.047

24,000

-

-

-

$0.047

NAC Semi

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.178

21,000

-

-

-

$0.178

Vyrian

USA . 4,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,216

-

-

-

-

Rutronik

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.033

3,000

-

-

-

$0.033

VNN

France . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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45

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 592,102 parts In-Stock

1+ parts

$0.022

100+ parts

-

1k+ parts

-

10k+ parts

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592,102

$0.022

-

-

-

Corphita

USA . 361 parts In-Stock

1+ parts

$0.023

100+ parts

-

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361

$0.023

-

-

-

Argo Parts USA

USA . 4,794 parts In-Stock

1+ parts

$0.049

100+ parts

-

1k+ parts

-

10k+ parts

$0.047

4,794

$0.049

-

-

$0.047

Continental Prestige Electronics

USA . 3,631 parts In-Stock

1+ parts

$0.049

100+ parts

-

1k+ parts

-

10k+ parts

$0.048

3,631

$0.049

-

-

$0.048

Modulus Dynamics

Lithuania . 14,056 parts In-Stock

1+ parts

$1.632

100+ parts

$1.567

1k+ parts

$1.501

10k+ parts

-

14,056

$1.632

$1.567

$1.501

-

AZTECH Wire

Italy . 1,078 parts In-Stock

1+ parts

$13.300

100+ parts

-

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1,078

$13.300

-

-

-

Perfect Parts

USA . 215,040 parts In-Stock

1+ parts

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215,040

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Eastek

USA . 177,000 parts In-Stock

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177,000

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QUARKTWIN TECHNOLOGY LTD

USA . 28,744 parts In-Stock

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28,744

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Glotronic Ltd.

UK . 21,600 parts In-Stock

1+ parts

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21,600

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-

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-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,000

-

-

-

-

Robosynatics

Brazil . 900 parts In-Stock

1+ parts

-

100+ parts

$3.500

1k+ parts

$3.241

10k+ parts

$3.241

900

-

$3.500

$3.241

$3.241

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.048

1k+ parts

$0.046

10k+ parts

$0.045

100

-

$0.048

$0.046

$0.045

Overview

Upgrade your electronic designs with the BCX70HE6327HTSA1 by Infineon Technologies, a top-quality Small Signal Bipolar Junction Transistor (BJT) perfect for switching applications. Manufactured with precision and expertise, this NPN transistor offers unparalleled performance and reliability. Its compact size and surface mount capability make it ideal for space-constrained projects. Trust in the superior quality and advanced technology of Infineon to take your creations to the next level. Experience the difference with the BCX70HE6327HTSA1 – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the transistor from external elements, ensuring reliable performance over time.

Polarity or Channel Type: NPN

Commonly used type for amplifying and switching applications, making it versatile in various electronic circuits.

Configuration: SINGLE

Simplified design with a single transistor, making it easy to integrate into circuits and reducing complexity.

Transistor Application: SWITCHING

Designed for efficient switching operations, making it suitable for applications that require rapid on/off switching.

Surface Mount: YES

Enables easy mounting on PCBs, saving space and simplifying circuit board layout.

Package Shape: RECTANGULAR

Compact shape that allows for efficient use of space on a circuit board.

Minimum DC Current Gain (hFE): 70

Ensures stable and consistent amplification of input signals.

Maximum Collector-Emitter Voltage: 45 V

Sufficient voltage handling capability for a wide range of applications.

Transistor Element Material: SILICON

Provides high performance and reliability compared to other materials.

Maximum Collector Current (IC): 0.1 A

Able to handle moderate current levels, suitable for low to medium power applications.

Terminal Finish: TIN

Corrosion-resistant finish that ensures reliable electrical connections.

Terminal Position: DUAL

Allows for easy and secure connections to the circuit.

Nominal Transition Frequency (fT): 250 MHz

High frequency capability for fast switching and amplification of signals.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BCX70HE6327HTSA1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

45 V

Configuration:

Minimum DC Current Gain (hFE):

70

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BCX70HE6327HTSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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