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BCX68-25E6327

Infineon Technologies

BCX68-25E6327 by Infineon Technologies

BCX68-25E6327 by Infineon is a NPN BJT with 1W power dissipation, hFE of 160, and 20V VCE. It's used in small outline packages for applications requiring high transition frequency up to 100MHz.

Median Price

$0.100

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,000 parts In-Stock

1+ parts

$0.100

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$0.100

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$0.100

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2,000

$0.100

$0.100

$0.100

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Adafruit Industries

USA . 2,545 parts In-Stock

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2,545

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Bristol Electronics

USA . 4,740 parts In-Stock

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4,740

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Dan-Mar Components

USA . 4,740 parts In-Stock

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4,740

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ACDS - Activité Composants Distribution Service

France . 4,000 parts In-Stock

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PC Components Company LLC

USA . 3,000 parts In-Stock

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Vyrian

USA . 2,351 parts In-Stock

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VNN

France . 2,302 parts In-Stock

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2,302

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Electronics Depot

USA . 1,000 parts In-Stock

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Pegasus Components GmbH

Germany . 964 parts In-Stock

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964

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J2 Sourcing AB

Sweden . 300 parts In-Stock

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300

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Q Components

USA . 294 parts In-Stock

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294

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Digiode

USA . 284 parts In-Stock

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284

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Semicontronic

India . 1,884 parts In-Stock

1+ parts

$0.085

100+ parts

$0.083

1k+ parts

$0.082

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1,884

$0.085

$0.083

$0.082

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Ampacity Inc.

Singapore . 2,218 parts In-Stock

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$0.185

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2,218

$0.185

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Modulus Dynamics

Lithuania . 23,912 parts In-Stock

1+ parts

$0.734

100+ parts

$0.705

1k+ parts

$0.675

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23,912

$0.734

$0.705

$0.675

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Aztec Data Supply Inc.

USA . 4,454 parts In-Stock

1+ parts

$1.001

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4,454

$1.001

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Corohmni

South Africa . 291 parts In-Stock

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$1.677

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291

$1.677

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Andel Nordic

Denmark . 287 parts In-Stock

1+ parts

$31.760

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$22.231

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$22.231

287

$31.760

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$22.231

$22.231

Component Stockers USA

USA . 716 parts In-Stock

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$99.990

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Perfect Parts

USA . 54,123 parts In-Stock

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Kepictronics

USA . 39,000 parts In-Stock

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Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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Lixinc

USA . 17,179 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,647 parts In-Stock

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Microchip USA

USA . 5,053 parts In-Stock

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Argo Parts USA

USA . 4,148 parts In-Stock

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Continental Prestige Electronics

USA . 3,854 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,431 parts In-Stock

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Advanced Electronics

New Zealand . 2,545 parts In-Stock

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Corphita

USA . 809 parts In-Stock

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Bastille Electronics

Australia . 750 parts In-Stock

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750

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Overview

Unleash the power of innovation with the BCX68-25E6327 by Infineon Technologies, a top-of-the-line Small Signal Bipolar Junction Transistor that guarantees quality and reliability. With its NPN configuration and maximum power dissipation of 1W, this transistor is perfect for a wide range of applications. Whether you're looking to amplify signals or control currents, this product offers unmatched performance and efficiency. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects. Upgrade to the BCX68-25E6327 today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, making it durable and reliable in various operating conditions.

Polarity or Channel Type: NPN

Common type of transistor that allows for easy integration into a variety of electronic circuits.

Configuration: SINGLE

Simplified design with only one transistor in the package, making it easier to use in circuit designs.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and enabling automated assembly processes.

Package Shape: RECTANGULAR

Standard shape that fits well on modern circuit boards, ensuring compatibility and ease of use.

No. of Terminals: 3

Provides necessary connections for the transistor while keeping the package size small and compact.

Maximum Power Dissipation (Abs): 1 W

Can handle moderate power levels, suitable for a variety of low to medium power applications.

Package Style (Meter): SMALL OUTLINE

Compact form factor that saves space on the PCB and allows for efficient layout of components.

Minimum DC Current Gain (hFE): 160

High gain value ensures amplification of input signals with minimal distortion, making it ideal for signal processing applications.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, suitable for applications where heat dissipation is a concern.

Maximum Collector-Emitter Voltage: 20 V

Allows for operation in low voltage circuits while providing some margin for voltage spikes or fluctuations.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and performance in electronic components.

Maximum Collector Current (IC): 1 A

Can handle moderate current levels, suitable for a range of low to medium power applications.

Terminal Finish: MATTE TIN

Provides a reliable and durable finish on the terminals, ensuring good electrical connections and resistance to corrosion.

Terminal Position: SINGLE

Simplified terminal layout for easy connection to external components, reducing complexity in circuit designs.

Case Connection: COLLECTOR

Specific connection point for the collector terminal, making it easy to identify and connect in the circuit.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the soldering process, ensuring proper and reliable assembly on the PCB.

Nominal Transition Frequency (fT): 100 MHz

High transition frequency allows for efficient switching and signal processing in high-frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BCX68-25E6327 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

1 A

Maximum Collector-Emitter Voltage:

20 V

Configuration:

Minimum DC Current Gain (hFE):

160

JESD-30 Code:

R-PSSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

1 W

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BCX68-25E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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