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BAR81WH6327XTSA1

Infineon Technologies

BAR81WH6327XTSA1 by Infineon Technologies

PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 4; Surface Mount: YES; Package Shape: RECTANGULAR;

Median Price

$0.490

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 180 parts In-Stock

1+ parts

$0.194

100+ parts

$0.191

1k+ parts

-

10k+ parts

-

180

$0.194

$0.191

-

-

Farnell

UK . 17,800 parts In-Stock

1+ parts

$0.455

100+ parts

$0.233

1k+ parts

$0.213

10k+ parts

-

17,800

$0.455

$0.233

$0.213

-

Mouser Electronics

USA . 9,249 parts In-Stock

1+ parts

$0.490

100+ parts

$0.332

1k+ parts

$0.245

10k+ parts

$0.216

9,249

$0.490

$0.332

$0.245

$0.216

DigiKey

USA . 23,058 parts In-Stock

1+ parts

$0.550

100+ parts

$0.303

1k+ parts

$0.258

10k+ parts

$0.235

23,058

$0.550

$0.303

$0.258

$0.235

Element14

Singapore . 6,000 parts In-Stock

1+ parts

$0.590

100+ parts

$0.330

1k+ parts

$0.280

10k+ parts

$0.260

6,000

$0.590

$0.330

$0.280

$0.260

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.539

36,000

-

-

-

$0.539

Rochester

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

$0.284

1k+ parts

$0.236

10k+ parts

$0.210

7,000

-

$0.284

$0.236

$0.210

Chip1Stop

Japan . 4,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,785

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 558 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

10k+ parts

-

558

$0.198

-

-

-

Digiode

USA . 309 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$0.220

-

-

-

TME

Poland . 960 parts In-Stock

1+ parts

$0.850

100+ parts

$0.266

1k+ parts

$0.248

10k+ parts

-

960

$0.850

$0.266

$0.248

-

Semi Source

USA . 7,917 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,917

-

-

-

-

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.397

3,000

-

-

-

$0.397

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 10,058 parts In-Stock

1+ parts

$0.178

100+ parts

$0.171

1k+ parts

$0.164

10k+ parts

-

10,058

$0.178

$0.171

$0.164

-

Corphita

USA . 835 parts In-Stock

1+ parts

$0.209

100+ parts

-

1k+ parts

-

10k+ parts

-

835

$0.209

-

-

-

Native Components

USA . 662 parts In-Stock

1+ parts

$6.973

100+ parts

-

1k+ parts

-

10k+ parts

-

662

$6.973

-

-

-

Perfect Parts

USA . 39,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

39,536

-

-

-

-

Eastek

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

RC Electronics

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

$0.250

1k+ parts

$0.240

10k+ parts

$0.230

2,700

-

$0.250

$0.240

$0.230

Northwest PG Solutions

USA . 109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.834

10k+ parts

-

109

-

-

$6.834

-

Technical Specifications

PIN Diodes BAR81WH6327XTSA1 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Application:

SWITCHING

Minimum Breakdown Voltage:

30 V

Case Connection:

CATHODE

Config:

SINGLE

Maximum Diode Capacitance:

1 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

1 ohm

Diode Type:

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Nominal Minority Carrier Lifetime:

.08 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Dissipation:

.1 W

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Trade Compliance

BAR81WH6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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