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MBM2764-30-X

Fujitsu Semiconductor America

MBM2764-30-X by Fujitsu Semiconductor America

UVPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: WQCCN; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;

Median Price

$23.400

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 14 parts In-Stock

1+ parts

$23.400

100+ parts

-

1k+ parts

-

10k+ parts

-

14

$23.400

-

-

-

Lakeland Logistics Inc

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Technical Specifications

EPROM MBM2764-30-X attributes and parameters. Explore more EPROM devices from Fujitsu Semiconductor America

Specs

Maximum Access Time:

300 ns

JESD-30 Code:

R-CQCC-N32

Length:

13.97 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

MBM2764-30-X Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Fujitsu Semiconductor America

Fujitsu Semiconductor America, Inc. leads the industry in innovation. Specifically, Fujitsu provides high-quality, reliable semiconductor products and services for the wireless, automotive, consumer, industrial, communications, and other markets throughout North and South America.

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