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PI7C9X2G612GPCNJEX

Diodes Incorporated

PI7C9X2G612GPCNJEX by Diodes Incorporated

PI7C9X2G612GPCNJEX by Diodes Inc. is a Bus Controller IC with 196 terminals, CMOS technology, and industrial temperature grade. It is used in X86, PowerPC, MIPS, ARM systems for PCI bus compatibility applications.

Median Price

$21.781

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$21.781

100+ parts

-

1k+ parts

-

10k+ parts

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300

$21.781

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-

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Chip Stock

USA . 46,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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46,000

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-

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Vyrian

USA . 6,244 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,244

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$9.203

100+ parts

-

1k+ parts

-

10k+ parts

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820

$9.203

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-

-

Corohmni

South Africa . 1,959 parts In-Stock

1+ parts

$23.357

100+ parts

-

1k+ parts

-

10k+ parts

-

1,959

$23.357

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-

-

Ampacity Inc.

Singapore . 179 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

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10k+ parts

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179

$34.000

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-

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Lixinc

USA . 9,181 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,181

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-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$21.346

1k+ parts

$20.692

10k+ parts

$20.257

100

-

$21.346

$20.692

$20.257

Overview

Experience seamless and efficient data transfer with the PI7C9X2G612GPCNJEX by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated guarantees top-notch quality and reliability in their products. This bus controller is versatile and compatible with various systems, making it a must-have for any application requiring high-speed communication. Trust in Diodes Incorporated to deliver a product that not only meets but exceeds your expectations, providing you with unparalleled value and performance. Elevate your projects with the PI7C9X2G612GPCNJEX and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount technology saves space on the PCB and improves overall product reliability.

Package Shape: SQUARE

Square shape allows for easier placement and routing on the PCB, streamlining the design process.

No. of Terminals: 196

The high number of terminals provides connectivity options for various system configurations.

Package Style (Meter): GRID ARRAY

Grid array package style ensures consistent electrical performance and facilitates automated assembly processes.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and minimizes signal interference.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures the product can operate reliably in rugged industrial environments.

Peripheral IC Type: BUS CONTROLLER, PCI

This bus controller supports various bus systems such as X86, POWERPC, MIPS, ARM, and PCI, enhancing system compatibility.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall performance and efficiency.

Terminal Form: BALL

Ball terminal form simplifies the soldering process, ensuring secure and reliable connections.

Bus Compatibility: X86; POWERPC; MIPS; ARM; PCI

Support for multiple bus types allows the product to be used in a wide range of applications, increasing versatility.

Technical Specifications

Bus Controllers PI7C9X2G612GPCNJEX attributes and parameters. Explore more Bus Controllers devices from Diodes Incorporated

Specs

Bus Compatibility:

X86; POWERPC; MIPS; ARM; PCI

JESD-30 Code:

S-PBGA-B196

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

PI7C9X2G612GPCNJEX Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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