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CY7C68013A-56BAXC

Infineon Technologies

CY7C68013A-56BAXC by Infineon Technologies

CY7C68013A-56BAXC by Infineon: 48MHz clock, 60MBps data rate, 85mA supply current. Ideal for USB bus controllers in applications requiring high-speed data transfer and low power consumption.

Median Price

$11.500

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,450 parts In-Stock

1+ parts

$8.808

100+ parts

-

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2,450

$8.808

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Arrow

USA . 774 parts In-Stock

1+ parts

$10.218

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774

$10.218

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Chip1Stop

Japan . 596 parts In-Stock

1+ parts

$11.500

100+ parts

$9.020

1k+ parts

$8.160

10k+ parts

$7.930

596

$11.500

$9.020

$8.160

$7.930

RS (Exports)

UK . 100 parts In-Stock

1+ parts

$14.855

100+ parts

$10.970

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-

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100

$14.855

$10.970

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Mouser Electronics

USA . 111 parts In-Stock

1+ parts

$16.360

100+ parts

$11.890

1k+ parts

$9.910

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111

$16.360

$11.890

$9.910

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Verical

USA . 3,011 parts In-Stock

1+ parts

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100+ parts

$12.350

1k+ parts

$11.050

10k+ parts

$10.400

3,011

-

$12.350

$11.050

$10.400

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$9.880

1k+ parts

$8.840

10k+ parts

$8.320

3

-

$9.880

$8.840

$8.320

DigiKey

USA . 3 parts In-Stock

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-

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3

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Distributors (In-Stock)

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Digiode

USA . 188 parts In-Stock

1+ parts

$7.638

100+ parts

-

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188

$7.638

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$8.945

100+ parts

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100

$8.945

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Vyrian

USA . 1,206 parts In-Stock

1+ parts

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Flip Electronics

USA . 409 parts In-Stock

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409

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Chip Stock

USA . 210 parts In-Stock

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210

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Conversion2

USA . 164 parts In-Stock

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164

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Prism Electronics

USA . 160 parts In-Stock

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160

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Speed Components Ltd

Israel . 20 parts In-Stock

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20

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Electronics Depot

USA . 15 parts In-Stock

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15

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Bristol Electronics

USA . 12 parts In-Stock

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12

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Atlantic Semiconductor

USA . 12 parts In-Stock

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12

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Sensible Micro Corp

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$8.346

1k+ parts

$7.704

10k+ parts

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5

-

$8.346

$7.704

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EMSNET

USA . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,197 parts In-Stock

1+ parts

$4.240

100+ parts

-

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1,197

$4.240

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Corphita

USA . 546 parts In-Stock

1+ parts

$7.236

100+ parts

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546

$7.236

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Component Stockers USA

USA . 11,896 parts In-Stock

1+ parts

$8.110

100+ parts

$6.630

1k+ parts

$6.470

10k+ parts

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11,896

$8.110

$6.630

$6.470

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Netroflash

USA . 50 parts In-Stock

1+ parts

$8.945

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50

$8.945

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Semicontronic

India . 803 parts In-Stock

1+ parts

$9.180

100+ parts

$8.950

1k+ parts

$8.905

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803

$9.180

$8.950

$8.905

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Modulus Dynamics

Lithuania . 865 parts In-Stock

1+ parts

$32.681

100+ parts

$31.374

1k+ parts

$30.067

10k+ parts

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865

$32.681

$31.374

$30.067

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Aztec Data Supply Inc.

USA . 28,779 parts In-Stock

1+ parts

$43.340

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28,779

$43.340

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Advanced Electronics

New Zealand . 62 parts In-Stock

1+ parts

$76.972

100+ parts

$73.123

1k+ parts

$73.123

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62

$76.972

$73.123

$73.123

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Perfect Parts

USA . 2,632 parts In-Stock

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2,632

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Argo Parts USA

USA . 786 parts In-Stock

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786

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Futuretech Components

Singapore . 774 parts In-Stock

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774

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

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200

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Overview

Unlock the power of seamless connectivity with the CY7C68013A-56BAXC by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality bus controllers that excel in a variety of applications. Whether you need reliable data transfer speeds, versatile compatibility with I2C, UART, and USB buses, or exceptional performance in extreme temperatures, the CY7C68013A-56BAXC has you covered. Experience the value and benefits this product offers, from its high-speed capabilities to its compact design, making it the perfect choice for your next project. Elevate your connectivity solutions with Infineon's trusted technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power sources and compatibility with various systems.

Maximum Data Transfer Rate: 60 MBps

The high data transfer rate enables fast and efficient communication between devices, making it suitable for high-speed applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, enhancing overall performance and efficiency.

Bus Compatibility: I2C; UART; USB

The support for multiple bus protocols like I2C, UART, and USB makes the product versatile and compatible with a wide range of devices and systems.

Technical Specifications

Bus Controllers CY7C68013A-56BAXC attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Address Bus Width:

0

Bus Compatibility:

I2C; UART; USB

Maximum Clock Frequency:

48 MHz

Maximum Data Transfer Rate:

60 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B56

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current:

85 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

CY7C68013A-56BAXC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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