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DMN2024UDH-7

Diodes Incorporated

DMN2024UDH-7 by Diodes Incorporated

DMN2024UDH-7 by Diodes Inc. is an N-channel FET with 20V DS breakdown voltage, 45A IDM, and 0.023 ohm RDS(on). Commonly used for switching applications in a small outline package with 8 terminals. Operating range from -55 to 150 °C, MIL-STD-202 compliant.

Median Price

$0.165

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 18,000 parts In-Stock

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Chip Stock

USA . 15,500 parts In-Stock

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Vyrian

USA . 5,047 parts In-Stock

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5,047

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Nova Conductors

Japan . 500 parts In-Stock

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Ampacity Inc.

Singapore . 17,513 parts In-Stock

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$0.140

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$0.140

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AZTECH Wire

Italy . 780 parts In-Stock

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$13.090

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Netroflash

USA . 2,000 parts In-Stock

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Overview

Experience the power of innovation with the DMN2024UDH-7 by Diodes Incorporated, a leading manufacturer in the industry. This N-channel Power FET is designed for switching applications, offering enhanced performance and reliability. With a maximum pulsed drain current of 45 A and a minimum DS breakdown voltage of 20 V, this transistor delivers superior efficiency and durability. Whether you're looking to optimize your electronic designs or enhance your circuitry, the DMN2024UDH-7 provides the value and benefits you need to take your projects to the next level. Experience the difference with Diodes Incorporated today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal conductivity and electrical insulation, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

Allows for efficient and low resistance current flow in the N-channel, enhancing the product's performance.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

Features a built-in diode for better control over the flow of current, making this transistor suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient performance in such scenarios.

Surface Mount: YES

Enables easy mounting on circuit boards, saving space and facilitating efficient circuit design.

Maximum Power Dissipation (Abs): 1.76 W

Can handle high power dissipation, making it suitable for applications requiring high power output.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, ensuring stability and reliability under varying environmental conditions.

Maximum Drain-Source On Resistance: 0.023 ohm

Low resistance allows for efficient current flow and minimal power loss, enhancing the overall performance of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) DMN2024UDH-7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Avalanche Energy Rating (EAS):

8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

5.2 A

Maximum Drain-Source On Resistance:

.023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

38 pF

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Reference Standard:

MIL-STD-202

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN2024UDH-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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