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BSS84DW-7

Diodes Incorporated

BSS84DW-7 by Diodes Incorporated

BSS84DW-7 by Diodes Incorporated is a P-channel FET with 50V breakdown voltage and 0.13A drain current. Ideal for switching applications, it features a small outline package, Gull Wing terminals, and 10 ohm on-resistance. Operating in enhancement mode at up to 150°C, this MOSFET has dual terminals and built-in diode elements.

Median Price

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7

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1k+

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Chip Stock

USA . 59,000 parts In-Stock

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Vyrian

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PC Components Company LLC

USA . 1,615 parts In-Stock

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Bristol Electronics

USA . 1,615 parts In-Stock

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VNN

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Sea View Technologies

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Nova Conductors

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Aztec Data Supply Inc.

USA . 786 parts In-Stock

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$0.420

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Corohmni

South Africa . 1,009 parts In-Stock

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Ampacity Inc.

Singapore . 795 parts In-Stock

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$6.050

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AZTECH Wire

Italy . 677 parts In-Stock

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Discover the BSS84DW-7 by Diodes Incorporated, a top-quality P-Channel Small Signal Field Effect Transistor with built-in diode. Ideal for switching applications, this enhancement mode transistor offers reliable performance and efficiency. With a maximum breakdown voltage of 50V and low drain-source resistance, this component is perfect for various electronic designs. Trust in Diodes Incorporated's expertise and innovation to bring you superior products that deliver value and benefits to meet your needs. Elevate your projects with the BSS84DW-7 and experience the difference in quality and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where a positive voltage is required at the gate to turn the transistor on.

Transistor Application: SWITCHING

Ideal for use in electronic circuits where rapid switching between on and off states is required.

Minimum DS Breakdown Voltage: 50 V

Capable of withstanding high voltage operation, making it versatile for various applications.

Surface Mount: YES

Easy to mount on circuit boards, saving space and facilitating automated assembly.

Maximum Drain Current (Abs) (ID): 0.13 A

Can handle moderate current levels, suitable for low to medium power applications.

Maximum Power Dissipation (Abs): 0.3 W

Capable of dissipating heat effectively to ensure reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high switching speeds and low power consumption, enhancing overall performance.

Maximum Operating Temperature: 150 °C

Can operate reliably in high temperature environments, increasing the range of possible applications.

Maximum Drain-Source On Resistance: 10 ohm

Provides low on-state resistance for efficient conduction during operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS84DW-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

.13 A

Maximum Drain Current (ID):

.13 A

Maximum Drain-Source On Resistance:

10 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS84DW-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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