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74LVC1G126FZ4-7

Diodes Incorporated

74LVC1G126FZ4-7 by Diodes Incorporated

diodes incorporated 74LVC1G126FZ4-7 is a CMOS bus driver with 6ns propagation delay, 24A max I (ol), and 10.5ns tpd at Vsup of 3.3V. Ideal for automotive applications, it features a small outline package with dual terminals and true output polarity.

Median Price

$0.126

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,649 parts In-Stock

1+ parts

$0.200

100+ parts

$0.101

1k+ parts

$0.083

10k+ parts

$0.074

3,649

$0.200

$0.101

$0.083

$0.074

Mouser Electronics

USA . 1,235 parts In-Stock

1+ parts

$0.200

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$0.101

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$0.084

10k+ parts

$0.075

1,235

$0.200

$0.101

$0.084

$0.075

Arrow

USA . 3,900 parts In-Stock

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$0.052

3,900

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$0.052

Verical

USA . 3,900 parts In-Stock

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$0.053

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3,900

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$0.053

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.017

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100

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Chip Stock

USA . 23,100 parts In-Stock

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Vyrian

USA . 6,213 parts In-Stock

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NAC Semi

USA . 5,000 parts In-Stock

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VNN

France . 2,100 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 65,584 parts In-Stock

1+ parts

$0.015

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$0.015

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$0.015

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Ampacity Inc.

Singapore . 53,490 parts In-Stock

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$0.015

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Aranea Global

USA . 100 parts In-Stock

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$0.017

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$0.016

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100

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Continental Prestige Electronics

USA . 6,670 parts In-Stock

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$0.017

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6,670

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Argo Parts USA

USA . 720 parts In-Stock

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720

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Corohmni

South Africa . 45 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,957 parts In-Stock

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$29.120

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$29.120

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iodParts Technologies Inc.

India . 91,615 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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Eastek

USA . 5,000 parts In-Stock

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$0.080

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5,000

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$0.080

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Overview

Discover the Diodes Incorporated 74LVC1G126FZ4-7, a top-of-the-line bus driver & transceiver that guarantees high performance and reliability. With a reputation for quality products, Diodes Incorporated delivers cutting-edge technology in a small outline, very thin profile package. Ideal for a wide range of applications, this product offers customers exceptional value with its fast propagation delay, true output polarity, and automotive-grade temperature grade. Upgrade your electronics with the 74LVC1G126FZ4-7 and experience the advantages of precision engineering at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 6 ns

Fast propagation delay allows for quick signal transmission, ideal for high-speed communication.

Surface Mount: YES

Easy to install on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard power supplies, making integration into existing systems simple.

Maximum I (ol): 24 Amp

High output current capability allows for driving power-hungry devices without external amplification.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions, suitable for a wide range of environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Technical Specifications

Bus Driver & Transceivers 74LVC1G126FZ4-7 attributes and parameters. Explore more Bus Driver & Transceivers devices from Diodes Incorporated

Specs

Control Type:

ENABLE HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.4 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G126FZ4-7 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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