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S40410161B1B2W013

Cypress Semiconductor

S40410161B1B2W013 by Cypress Semiconductor

S40410161B1B2W013 by Cypress Semiconductor is a 16GX8 FLASH Memory IC with 137.4 Gb memory density and operates at 3V. It features a synchronous operating mode, parallel technology, and low profile grid array package shape. Ideal for applications requiring high-speed data storage in compact electronic devices.

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Aztec Data Supply Inc.

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AZTECH Wire

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Overview

Unlock the power of reliable and efficient data storage with the S40410161B1B2W013 by Cypress Semiconductor. As a leader in flash memory technology, Cypress Semiconductor delivers high-quality products that guarantee superior performance and durability. Ideal for a wide range of applications, this flash memory device offers unparalleled value, benefits, and advantages to customers looking for efficient data storage solutions. Upgrade your storage capabilities with the S40410161B1B2W013 and experience seamless operation and enhanced reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, providing protection to the memory IC inside.

Surface Mount: YES

Easy to integrate into circuit boards, saving space and simplifying manufacturing processes.

Operating Mode: SYNCHRONOUS

Allows for faster data transfer and improved system performance.

Nominal Supply Voltage / Vsup (V): 3

Compatible with a standard voltage supply, ensuring ease of integration.

No. of Terminals: 100

Sufficient number of terminals for connection and communication with other components.

Minimum Operating Temperature: -25 °C

Wide temperature range allows for reliable operation in various environments.

Maximum Operating Temperature: 85 °C

Suitable for use in both normal and extended temperature conditions.

Memory IC Type: FLASH

Utilizes flash memory technology for high-speed read and write operations.

Technical Specifications

Flash Memory S40410161B1B2W013 attributes and parameters. Explore more Flash Memory devices from Cypress Semiconductor

Specs

Alternate Memory Width:

4

JESD-30 Code:

R-PBGA-B100

Length:

18 mm

Memory Density:

137438953472 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

100

No. of Words:

17179869184 words

No. of Words Code:

16G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

16GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

S40410161B1B2W013 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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