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S29GL512T10TFI033

Cypress Semiconductor

S29GL512T10TFI033 by Cypress Semiconductor

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;

Median Price

$12.310

Lifecycle Status

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DigiKey

USA . 895 parts In-Stock

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$10.549

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$9.695

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895

$12.310

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Mouser Electronics

USA . 122 parts In-Stock

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$10.550

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$9.410

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122

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USA . 901 parts In-Stock

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790

$10.610

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8,071

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Modulus Dynamics

Lithuania . 1,536 parts In-Stock

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$3.324

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$3.191

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$3.058

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1,536

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Corphita

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391

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Component Stockers USA

USA . 999 parts In-Stock

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$9.780

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$7.750

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999

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USA . 2,500 parts In-Stock

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2,500

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Technical Specifications

Flash Memory S29GL512T10TFI033 attributes and parameters. Explore more Flash Memory devices from Cypress Semiconductor

Specs

Maximum Access Time:

100 ns

Alternate Memory Width:

8

Boot Block:

BOTTOM/TOP

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

56

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Programming Voltage (V):

2.7

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

14 mm

Trade Compliance

S29GL512T10TFI033 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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