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CYD18S36V18-167BBAI

Cypress Semiconductor

CYD18S36V18-167BBAI by Cypress Semiconductor

CYD18S36V18-167BBAI by Cypress Semiconductor is a 512Kx36 MULTI-PORT SRAM with 167 MHz fCLK. Operating at -40 to 85 °C, it has a low profile GRID ARRAY package and consumes up to 780 mA at 1.5/1.8 Vsup. Ideal for industrial applications requiring fast access times and high memory density.

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 376 parts In-Stock

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Ampacity Inc.

Singapore . 1,616 parts In-Stock

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Aranea Global

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Microchip USA

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Overview

Experience unparalleled performance and reliability with the CYD18S36V18-167BBAI by Cypress Semiconductor. As a leading manufacturer in the industry, Cypress Semiconductor delivers top-quality SRAM products that cater to a wide range of applications. Offering a seamless synchronous operating mode and common input/output type, this multi-port SRAM provides customers with a versatile and efficient solution for their memory needs. With a maximum clock frequency of 167 MHz and a low-profile grid array package style, this product ensures optimal performance and ease of integration. Trust Cypress Semiconductor to deliver cutting-edge technology that exceeds expectations and adds value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, making the product reliable for long-term use.

Surface Mount: YES

Ease of installation and space-saving design make this product a convenient choice for various applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination, enhancing overall performance and efficiency.

Nominal Supply Voltage: 1.5V

Stable supply voltage ensures consistent and reliable operation of the product.

Maximum Clock Frequency (fCLK): 167 MHz

High clock frequency enables fast data processing and high-speed performance, suitable for demanding tasks.

Memory IC Type: MULTI-PORT SRAM

Multi-port design allows for multiple accesses to the memory simultaneously, increasing data throughput and versatility.

Technical Specifications

SRAM CYD18S36V18-167BBAI attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

4 ns

Additional Features:

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V

Maximum Clock Frequency (fCLK):

167 MHz

Input/Output Type:

COMMON

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

17 mm

Memory Density:

18874368 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

256

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX36

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Parallel or Serial:

PARALLEL

Power Supplies (V):

1.5/1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Standby Current:

.35 Amp

Minimum Standby Voltage:

1.4 V

Sub-Category:

SRAMs

Maximum Supply Current:

780 mA

Maximum Supply Voltage (Vsup):

1.58 V

Minimum Supply Voltage (Vsup):

1.42 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

CYD18S36V18-167BBAI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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