Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 1.5;
Median Price
$153.990
Lifecycle Status
Suppliers In-Stock
4
In-Stock Inventory
1k+
Rochester
1+ parts
100+ parts
$144.750
1k+ parts
$135.510
10k+ parts
-
DigiKey
Digiode
$170.288
Vyrian
$179.250
Corphita
$161.325
Modulus Dynamics
$173.680
$166.733
$159.786
QUARKTWIN TECHNOLOGY LTD
Northwest PG Solutions
$4.704
Native Components
$4.656
SRAM CYD18S18V18-167BBAXC attributes and parameters. Explore more SRAM devices from Infineon Technologies
Maximum Access Time:
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Maximum Clock Frequency (fCLK):
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JESD-30 Code:
JESD-609 Code:
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No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
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Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
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Maximum Supply Current:
Maximum Supply Voltage (Vsup):
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CYD18S18V18-167BBAXC Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
SS14
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Hitano Enterprise
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
Zowie Technology
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
BAV99
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
71016S15YGI8
Integrated Device Technology
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: SOJ; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
DS1230Y-100
Dallas Semiconductor
NON-VOLATILE SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
IDT71321LA20JG8
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Width: 19.1262 mm;
CY62167DV30LL-55BVXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00001 Amp;
CY14B101LA-SZ45XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn);
IDT71V124SA10PHGI8
Renesas Electronics
The Renesas Electronics IDT71V124SA10PHGI8 is a 128Kx8 SRAM with 3.3V supply voltage, operating in asynchronous mode. It features a max access time of 10ns and offers 131072 words of memory width. Ideal for industrial applications requiring fast and reliable data storage with a compact small outline thin profile package style.
5962-8866204NA
Teledyne E2v (uk)
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
70V28L20PFGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; No. of Functions: 1;
23LCV1024-I/ST
Microchip Technology
23LCV1024-I/ST by Microchip Technology is a 128KX8 SRAM with 20 MHz clock frequency, operating at -40 to 85 °C. It has separate I/O, 3-STATE output, and uses 0.65 mm terminal pitch. Ideal for industrial applications requiring high-speed synchronous memory in a small outline package.
RMLV0408EGSP-4S2#CA0
Renesas Electronics' RMLV0408EGSP-4S2#CA0 is a 512Kx8 SRAM with 45ns access time, operating at -40 to 85°C. It features a supply voltage range of 2.7V to 3.6V and comes in a small outline package for industrial applications requiring fast and reliable parallel memory storage.
CY14E256LA-SZ25XI
Infineon's CY14E256LA-SZ25XI is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast access times like industrial automation and automotive systems.
7130LA100CB
Renesas Electronics' 7130LA100CB is a MIL-PRF-38535 screened SRAM with 1KX8 organization, operating at 5V. It features a max operating temperature of 125°C, asynchronous mode, and common I/O type. Ideal for military applications requiring fast access times and low standby current.
71V124SA12TYGI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Surface Mount: YES;
5962-8855202XA
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Width: 15.24 mm;
CY14B116L-ZS25XIT
Infineon's CY14B116L-ZS25XIT is a 2MX8 SRAM with 16777216-bit memory density, operating at 3V. It features an access time of 25ns and is ideal for industrial applications requiring non-volatile memory storage in a small outline package.
71321SA35TFG
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Power Supplies (V): 5;
CY14B101Q2A-SXIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3;
71024S15YGI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Length: 20.995 mm;
5962-8685916LA
OTHER SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
Pyramid Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 32KX8;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
CYD18S72V18-200BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
CYD18S36V18-200BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Clock Frequency (fCLK): 200 MHz;
CYD18S18V18-200BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; No. of Words: 1048576 words;
CYD18S72V18-167BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Memory Width: 72;
CYD18S72V-100BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
CYD18S36V18-167BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Maximum Access Time: 11 ns;
CYD18S72V18-200BGXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Minimum Standby Voltage: 1.4 V;
CYD18S18V18-167BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,40;
CYD18S36V18-200BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
CYD18S36V18-167BBAXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
CYD18S72V18-167BBXC
CYD18S72V-100BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Current: 450 mA;
CYD18S36V18-167BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Output Characteristics: 3-STATE;
CYD18S72V18-200BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 1.42 V;
CYD18S18V18-200BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Input/Output Type: COMMON;
CYD18S36V18-200BBAXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
CYD18S18V18-167BBXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Input/Output Type: COMMON;
CYD18S36V18-167BBAXI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; No. of Words Code: 512K;
CYD18S72V-133BBXC
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; No. of Words Code: 256K;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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