Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BCM20736E by Cypress Semiconductor is a telecom IC with 48 terminals in a square package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include grid array style, thin profile, and fine pitch design for telecom applications.
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Surface mount technology allows for easy and secure PCB mounting, making the product suitable for mass production and ensuring reliability.
The square package shape provides a compact design, saving space on the PCB and allowing for efficient placement of components.
Having a higher number of terminals enables more connectivity options, making the product versatile for various telecom interfaces.
The grid array, thin profile, and fine pitch package style allows for high-density integration, improving overall performance and efficiency.
The high maximum operating temperature ensures reliable functionality even in harsh environmental conditions, increasing the product's durability.
The low minimum operating temperature extends the product's usability to colder environments, making it suitable for diverse applications.
The bottom terminal position facilitates easy and secure connections, simplifying installation and maintenance procedures.
The low maximum seated height allows for a more compact design, enhancing space-saving capabilities in electronic assemblies.
The narrow width of the product contributes to a smaller footprint on the PCB, enhancing flexibility in layout design.
The short length of the product further reduces the space required for installation, optimizing the use of available board space.
The industrial temperature grade ensures reliable performance in rugged industrial environments, making the product suitable for demanding applications.
The butt terminal form provides a secure connection for reliable signal transfer, enhancing overall product performance and longevity.
Being specifically designed for telecom circuits, the product offers optimized functionality and compatibility for telecom interface applications.
The fine terminal pitch allows for closer connections, enabling high-speed data transmission and improved signal integrity.
Other Function Telecom Interface ICs BCM20736E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Cypress Semiconductor
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Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Texas Instruments
LM555CMX by Texas Instruments is an Analog Waveform Generation IC with 8 terminals. It operates at a nominal voltage of 5V and supports power supplies ranging from 5V to 15V. This versatile IC, housed in a small outline package, is commonly used for pulse and rectangular waveform generation in commercial temperature environments.
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
Frontier Electronics
SMBJ18CA
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
USB3320C-EZK-TR
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
Thinking Electronic Industrial
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Taiwan Semiconductor
STM32F405RGT6TR
STMicroelectronics
STM32F405RGT6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 26 MHz. It features DAC and ADC channels, along with DMA support. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
1N4148WT
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
M39029/56-351
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
1N4148
Nexperia
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SA602AD
NXP Semiconductors
SA602AD by NXP Semiconductors is a telecom interface IC with 8 terminals, operating temperature range of -40 to 85°C. It features a small outline package style, gull wing terminal form, and nominal voltage of 6V. Ideal for telecom circuits in industrial applications.
MAX7042ATJ+
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BLE113-A-V1
Silicon Labs
BLE113-A-V1 by Silicon Labs is a surface mount telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It features a rectangular package style, measures 15.725mm in length, and has a terminal pitch of 0.8mm. Ideal for industrial applications requiring low-profile telecom circuit integration.
ZOE-M8G-0
U-blox Ag
ZOE-M8G-0 by U-blox Ag is a telecom IC with 51 terminals in a square grid array package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 1.8V and thin profile design, it's ideal for telecom circuit applications.
NEO-M8Q-0
NEO-M8Q-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With AEC-Q100 screening and TS 16949 certification, it's ideal for industrial applications requiring a 3V supply voltage. Its compact rectangular package measures 12.2mm x 16mm with a seated height of 2.6mm, making it suitable for space-constrained designs in automotive or telecommunications systems.
RN41-I/RM615
Microchip Technology
Microchip Technology's RN41-I/RM615 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and matte tin finish, suitable for industrial applications. This surface-mount IC in rectangular package measures 13.2mm x 25.8mm with a seated height of 2.2mm, ideal for telecom interface functions.
MT9041AP
Zarlink Semiconductor
MT9041AP by Zarlink Semiconductor is a telecom IC with 28 terminals, operating at 5V. It features CMOS technology, J BEND terminal form, and quad terminal position. Ideal for telecom circuits, it has an industrial temperature grade and operates b/w -40 to 85°C.
XB3-24AUM
Digi International
The Digi International XB3-24AUM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in telecom interface ICs.
DA14682-00F08A92
Dialog Semiconductor
Other Telecom ICs; Peak Reflow Temperature (C): 255; Moisture Sensitivity Level (MSL): 3;
CLRC66302HN,157
The NXP Semiconductors CLRC66302HN,157 is a telecom interface IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 105°C and has a data rate of 1 Mbps at 5V supply voltage. Ideal for industrial applications requiring high-speed communication in compact spaces.
BLUENRG-MSQTR
BLUENRG-MSQTR by STMicroelectronics is a 32-terminal telecom IC with a 3V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use. With a square shape and chip carrier package style, it's ideal for telecom circuit applications.
CC1200RHBT
The Texas Instruments CC1200RHBT is a telecom IC with 32 terminals, operating at 3V. It offers a data rate of 1.25 Mbps and can withstand temperatures from -40 to 85°C. Ideal for telecom circuits, this chip carrier package has a very thin profile and is surface mountable.
CY7B923-JXIT
Infineon Technologies
CY7B923-JXIT by Infineon is a BICMOS technology telecom IC with 400 Mbps data rate and 5V supply voltage. It comes in a square chip carrier package with 28 terminals, suitable for telecom circuit applications. Operating temperature ranges from -40 to 85°C, making it ideal for industrial use.
SPBTLE-RFTR
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MRF24J40ME-I/RM
MRF24J40ME-I/RM by Microchip Technology is a telecom interface IC with 12 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a nominal voltage of 3.3V. This IC is commonly used in telecom circuits for various applications.
MAX-M8W-0
MAX-M8W-0 by U-blox Ag is an AEC-Q100 graded GNSS Module with 18 terminals, operating b/w -40 to 85°C. With a compact size of 9.7mm x 10.1mm x 2.7mm, it's ideal for industrial applications requiring precise location tracking and navigation capabilities at a supply voltage of 3V.
TLV320AIC22CPT
TLV320AIC22CPT by Texas Instruments is a 48-terminal telecom IC with 16-bit linear coding and A/MU-LAW companding law. It operates at temperatures ranging from -40 to 85°C, suitable for industrial applications. The package style is flatpack, low profile, fine pitch, making it ideal for surface mount designs.
ATPL250A-AKU-R
ATPL250A-AKU-R by Microchip Technology is a telecom interface IC with 1 function. It has a square package shape, 80 terminals, and a low profile flatpack style. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications in the telecom circuit field.
RN41XVC-I/RM
Microchip Technology's RN41XVC-I/RM is a telecom IC with 20 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial applications. The package style is rectangular with dimensions of 24.4mm x 29.9mm, making it suitable for various telecom interface functions.
ADF7012BRUZ-RL
Analog Devices
Analog Devices' ADF7012BRUZ-RL is a telecom IC with 24 terminals, operating at 2.5/3.3V. It has a temperature range of -40 to 85°C and uses CMOS technology. The package style is small outline, thin profile, shrink pitch, making it suitable for industrial telecom applications.
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BCM20733A3KML1G
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
BCM20736A1KML2G
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BCM20710A1KUBXG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM20715A1KUBXG
BCM20730A1KFBG
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 64; Package Code: VFBGA; Package Shape: SQUARE;
BCM20738A1KFBG
BCM20730A2KMLG
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
BCM20710A1KUFBXG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 50; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM20733A3KFB2G
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 121; Package Code: TFBGA; Package Shape: SQUARE;
BCM20713A1KUBG
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM20736A0KML2G
BCM20705A1KWFBG
BCM20713A1KUFBXG
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 50; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM2085
Broadcom
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 49; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
BCM2121
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 200; Package Code: BGA; Package Shape: SQUARE; No. of Functions: 1;
BCM2122
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Functions: 1;
BCM2037
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY;
BCM2040
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 64; Package Code: BGA; Package Shape: UNSPECIFIED; JESD-30 Code: X-PBGA-B64;
BCM2124
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 296; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
BCM20737S
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: LGA; Package Shape: SQUARE;
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