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BCM20736E

Cypress Semiconductor

BCM20736E by Cypress Semiconductor

BCM20736E by Cypress Semiconductor is a telecom IC with 48 terminals in a square package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include grid array style, thin profile, and fine pitch design for telecom applications.

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Nova Conductors

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10

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Advanced Electronics

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$7.297

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$6.576

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3,000

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Corohmni

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$17.375

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$560.000

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Argo Parts USA

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3,654

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Authorized Procurement Solutions

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3,000

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Aranea Global

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1,000

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529

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Overview

Unlock the power of seamless connectivity with the BCM20736E by Cypress Semiconductor. Designed with precision and quality in mind, this telecom interface IC offers unparalleled performance and reliability. From smart home devices to industrial applications, this product provides endless possibilities for innovation. Experience the value of effortless communication and efficiency with the versatile capabilities of the BCM20736E. Choose Cypress Semiconductor for cutting-edge solutions that elevate your projects to new heights. Join the revolution and revolutionize your connectivity with the BCM20736E today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure PCB mounting, making the product suitable for mass production and ensuring reliability.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the PCB and allowing for efficient placement of components.

No. of Terminals: 48

Having a higher number of terminals enables more connectivity options, making the product versatile for various telecom interfaces.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style allows for high-density integration, improving overall performance and efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable functionality even in harsh environmental conditions, increasing the product's durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature extends the product's usability to colder environments, making it suitable for diverse applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections, simplifying installation and maintenance procedures.

Maximum Seated Height: 1.18 mm

The low maximum seated height allows for a more compact design, enhancing space-saving capabilities in electronic assemblies.

Width: 6.5 mm

The narrow width of the product contributes to a smaller footprint on the PCB, enhancing flexibility in layout design.

Length: 6.5 mm

The short length of the product further reduces the space required for installation, optimizing the use of available board space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in rugged industrial environments, making the product suitable for demanding applications.

Terminal Form: BUTT

The butt terminal form provides a secure connection for reliable signal transfer, enhancing overall product performance and longevity.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, the product offers optimized functionality and compatibility for telecom interface applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for closer connections, enabling high-speed data transmission and improved signal integrity.

Technical Specifications

Other Function Telecom Interface ICs BCM20736E attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Cypress Semiconductor

Specs

JESD-30 Code:

S-XBGA-B48

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.18 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6.5 mm

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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