Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BCM20733A3KML1G by Cypress Semiconductor is a 56-terminal telecom IC with CMOS technology. It operates b/w 0-70°C, has a nominal voltage of 1.2V, and comes in a square chip carrier package. Ideal for telecom circuits due to its compact size and low power consumption.
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Surface mount technology allows for easy and reliable soldering directly onto a PCB, saving time and effort during assembly.
The square package shape aids in efficient use of PCB real estate, allowing for more components to be placed in a compact space.
Having 56 terminals provides the product with a wide range of connectivity options, enabling versatility in telecom interface applications.
This package style combination offers efficient heat dissipation and a compact form factor, ideal for telecom applications with limited space and thermal constraints.
With a maximum operating temperature of 70°C, this product can withstand a wide range of environmental conditions, ensuring reliability in various operating environments.
The ability to operate at temperatures as low as 0°C makes this product suitable for telecom applications in both indoor and outdoor settings.
The quad terminal position offers a stable connection and ensures proper alignment during installation, enhancing the product's reliability.
The low maximum seated height allows for a compact design, making this product suitable for applications where space is limited.
The small width of 7 mm enables the product to fit in tight spaces on a PCB, enhancing design flexibility.
The short length of 7 mm contributes to the compact form factor of the product, making it ideal for applications where space is a constraint.
The commercial temperature grade indicates that this product is suitable for standard commercial applications, ensuring compatibility with a wide range of equipment.
The CMOS technology used in this product offers low power consumption and high noise immunity, making it ideal for telecom interface ICs that require efficient performance.
The no-lead terminal form simplifies the manufacturing process and increases reliability by eliminating the risk of solder joint failures.
Being specifically designed for telecom circuit applications, this product ensures optimal performance and compatibility in telecom systems.
The nominal supply voltage of 1.2V makes this product suitable for low-power telecom applications, contributing to energy efficiency.
The small terminal pitch of 0.4 mm allows for high-density mounting on a PCB, enabling more terminals to be accommodated in a limited space.
Other Function Telecom Interface ICs BCM20733A3KML1G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Cypress Semiconductor
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BCM20733A3KML1G Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - DK OBS NOTICE
Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.
BAV99
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Toshiba
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Philips Components
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MDBT50Q-P1MV2
Raytac
Raytac's MDBT50Q-P1MV2 is a telecom IC with 61 terminals, operating b/w -40 to 85°C. It supports a data rate of 2 Mbps at a nominal voltage of 3V. This surface-mount module in MICROELECTRONIC ASSEMBLY package is ideal for telecom applications requiring compact design and high-speed data transmission.
SPSGRF-868
SPSGRF-868 by STMicroelectronics is a telecom IC with 11 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.27mm, suitable for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages in surface mount form.
AP22811AW5-7
Diodes Incorporated
AP22811AW5-7 by Diodes Inc. is a telecom interface IC with 5 terminals, operating b/w -40 to 85°C. It features a small outline package style, matte tin finish, and nominal voltage of 5V. Ideal for telecom circuits, this IC has a low profile design and can withstand peak reflow temperatures up to 260°C.
ADF7012BRUZ-RL7
ADF7012BRUZ-RL7 by Analog Devices is a telecom IC with 24 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and uses CMOS technology. This surface-mount IC in a small outline package is ideal for telecom circuit applications.
NEO-M8T-0
U-blox Ag
NEO-M8T-0 by U-blox Ag is a telecom IC with 24 terminals, operating from -40 to 85°C. With a compact size of 12.2mm x 16mm and low supply voltage of 3V, it's ideal for industrial applications requiring precise positioning and timing accuracy. Its no-lead terminal form and dual position make it suitable for various telecom circuit designs.
NEO-M8U-0-10
NEO-M8U-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its compact MICROELECTRONIC ASSEMBLY package makes it ideal for industrial applications requiring a 3V supply voltage. AEC-Q100 and TS 16949 screening ensure high reliability in automotive and telecom systems.
TMS3705DDRQ1
TMS3705DDRQ1 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. This AEC-Q100 compliant IC is ideal for industrial applications requiring small outline packages and dual terminal positions.
NRF52840-QIAA-R7
Nordic Semiconductor Asa
NRF52840-QIAA-R7 by Nordic Semiconductor is a telecom IC with 73 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for industrial applications requiring high temperature tolerance and telecom circuit functionality.
CC3235MODSM2MOBR
CC3235MODSM2MOBR by Texas Instruments is a telecom IC with 63 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and peak reflow temperature of 260°C. This rectangular package is ideal for industrial applications requiring reliable telecom circuit interfaces.
BM70BLES1FC2-0B05BA
Microchip Technology
BM70BLES1FC2-0B05BA by Microchip Technology is a telecom interface IC with surface mount capability. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.0086 Mbps. This IC is commonly used in telecom circuits for various applications.
2615011136000
Wuerth Elektronik & Kg
TELECOM CIRCUIT;
NEO-M8N
SA612AD/01,118
SA612AD/01,118 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This small outline IC is suitable for telecom circuit applications due to its dual terminal position and gull wing form factor.
TRF37B73IDSGT
TRF37B73IDSGT by Texas Instruments is an 8-terminal telecom IC with a package style of small outline, heat sink/slug, and very thin profile. It operates b/w -40 to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits due to its nickel palladium gold terminal finish and industrial temperature grade suitability.
CLRC66302HN,151
CLRC66302HN,151 by NXP Semiconductors is a telecom interface IC with 1 function. It has a square package shape with 32 terminals and a max seated height of 1mm. This IC operates at temperatures ranging from -25 to 85 °C and is suitable for telecom circuit applications.
AS3933-BQFT
Ams Ag
AS3933-BQFT by Ams Ag is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a nominal voltage of 3V and terminal pitch of 0.65mm, ideal for telecom circuit applications.
MAX5980GTJ+
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
SX8651ICSTRT
Semtech
Semtech's SX8651ICSTRT is a 12-terminal IC with nickel palladium gold finish. It operates b/w -40 to 85°C, ideal for industrial telecom circuits at 1.8V supply voltage. The package style is grid array, very thin profile, fine pitch, suitable for surface mount applications.
HMC799LP3ETR
Analog Devices' HMC799LP3ETR is a 16-terminal telecom IC with 5V supply, operating from -40 to 85°C. It's a surface-mount chip carrier package suitable for industrial applications, drawing max 80mA current. With matte tin finish and quad terminal position, it's ideal for telecom circuit interfaces.
ODIN-W260-00B
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BCM20736A1KML2G
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BCM20736E
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 48; Package Code: TFLGA; Package Shape: SQUARE;
BCM20710A1KUBXG
Infineon Technologies
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM20715A1KUBXG
BCM20730A1KFBG
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 64; Package Code: VFBGA; Package Shape: SQUARE;
BCM20738A1KFBG
BCM20730A2KMLG
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
BCM20710A1KUFBXG
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 50; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM20733A3KFB2G
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 121; Package Code: TFBGA; Package Shape: SQUARE;
BCM20713A1KUBG
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 42; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM20736A0KML2G
BCM20705A1KWFBG
BCM20713A1KUFBXG
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 50; Package Code: VFBGA; Package Shape: RECTANGULAR;
BCM2085
Broadcom
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 49; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
BCM2121
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 200; Package Code: BGA; Package Shape: SQUARE; No. of Functions: 1;
BCM2122
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Functions: 1;
BCM2037
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: UNSPECIFIED; Package Body Material: PLASTIC/EPOXY;
BCM2040
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 64; Package Code: BGA; Package Shape: UNSPECIFIED; JESD-30 Code: X-PBGA-B64;
BCM2124
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 296; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
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